N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

256

250 MHz

有

微芯片技术

90

IGLOOe

Tray

M1AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1AGL1000V5-FG256

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

This product may require additional documentation to export from the United States.

N

11000 LE

177 I/O

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

M1AGL1000V5

TIN LEAD/TIN LEAD SILVER

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

OTHER

127 uA

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

250 MHz

24576

1000000

17 mm

17 mm

36 In Stock

• 1: ¥416.332064
• 10: ¥392.766099
• 100: ¥370.534056
• 500: ¥349.560426
查看所有的价格

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

400000

400000

97

微芯片技术

Tray

M1A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

5.24

1.575 V

MICROSEMI CORP

活跃

SQUARE

LBGA

350 MHz

M1A3P400-2FG144

无

85 °C

1.425 V

30

1.5 V

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

0°C ~ 85°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

49 In Stock

• 1: ¥412.903308
• 10: ¥389.531421
• 100: ¥367.482473
• 500: ¥346.681578
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

151

Tray

微芯片技术

M1A3P400

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

24

ProASIC3

1.5000 V

-40 to 100 °C

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

STD

9216

400000

28 mm

28 mm

3600 In Stock

• 1: ¥92.354990
• 10: ¥87.127352
• 100: ¥82.195611
• 500: ¥77.543031
查看所有的价格

-

表面贴装

VQFP-100

YES

100-VQFP (14x14)

100

- 40 C

+ 100 C

SMD/SMT

350 MHz

有

微芯片技术

90

ProASIC3 nano

0.017637 oz

1.575 V

Tray

A3PN060

活跃

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

有

A3PN060-VQG100I

TFQFP

SQUARE

活跃

MICROSEMI CORP

1.4

Details

700 LE

71 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

A3PN060

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

1.425 V to 1.575 V

INDUSTRIAL

-

1536 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

18432

60000

STD

-

1536

60000

1 mm

14 mm

14 mm

5000 In Stock

• 1: ¥237.242915
• 10: ¥223.814069
• 100: ¥211.145349
• 500: ¥199.193729
查看所有的价格

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL005-1VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

161

Tray

M2GL005

活跃

1.26 V

0°C ~ 85°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

533 In Stock

• 1: ¥7,252.391237
• 10: ¥6,841.878527
• 100: ¥6,454.602383
• 500: ¥6,089.247531
查看所有的价格

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

30

有

AFS1500-1FGG484K

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

有

60

Fusion

223

活跃

AFS1500

Tray

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-55 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

223

不合格

1.5,3.3 V

33.8 kB

223

现场可编程门阵列

276480

1.5e+06

1

38400

49 In Stock

• 1: ¥488.351827
• 10: ¥460.709271
• 100: ¥434.631388
• 500: ¥410.029611
查看所有的价格

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

M1A3P400

微芯片技术

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

5.24

1.575 V

MICROSEMI CORP

活跃

SQUARE

FQFP

M1A3P400-2PQG208I

有

100 °C

1.425 V

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

24

ProASIC3

151

Tray

-40°C ~ 100°C (TJ)

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

9216

400000

28 mm

28 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

活跃

M2GL060

Tray

0°C ~ 85°C (TJ)

Tray

M2GL060T

1.14V ~ 2.625V

1.2 V

56520

1869824

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

20

1.14 V

无

M2GL150TS-FCV484I

FBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

84

IGLOO2

248

Tray

M2GL150

活跃

FBGA,

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL150TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B484

3.15 mm

现场可编程门阵列

146124

5120000

STD

19 mm

19 mm

49 In Stock

• 1: ¥741.035570
• 10: ¥699.090162
• 100: ¥659.519019
• 500: ¥622.187754
查看所有的价格

-

表面贴装

FCBGA-325

325-FCBGA (11x11)

微芯片技术

This product may require additional documentation to export from the United States.

N

27696 LE

180 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

176

IGLOO2

1.2 V

活跃

M2GL025

Tray

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.14V ~ 2.625V

1.2 V

27696

1130496

2 Transceiver

2729 In Stock

• 1: ¥1,570.078516
• 10: ¥1,481.206147
• 100: ¥1,397.364287
• 500: ¥1,318.268198
查看所有的价格

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

1.14 V

85 °C

有

M2GL050TS-1VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B400

207

不合格

1.2 V

OTHER

207

1.51 mm

现场可编程门阵列

56340

1869824

56340

17 mm

17 mm

2222 In Stock

• 1: ¥3,891.987666
• 10: ¥3,671.686473
• 100: ¥3,463.855166
• 500: ¥3,267.787889
查看所有的价格

-

表面贴装

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

微芯片技术

PLASTIC/EPOXY

1.2 V

20

1.14 V

85 °C

无

M2GL150T-FCS536

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

293

Tray

M2GL150

活跃

16 X 16 MM, 0.50 MM PITCH, FBGA-536

网格排列

0°C ~ 85°C (TJ)

Tray

M2GL150T

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B536

OTHER

现场可编程门阵列

146124

5120000

STD

36 In Stock

• 1: ¥195.614168
• 10: ¥184.541660
• 100: ¥174.095909
• 500: ¥164.241425
查看所有的价格

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL005S-1VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL005S

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.56 mm

现场可编程门阵列

6060

719872

1

14 mm

14 mm

5000 In Stock

• 1: ¥130.648905
• 10: ¥123.253688
• 100: ¥116.277061
• 500: ¥109.695344
查看所有的价格

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL005-VF256

LFBGA

SQUARE

活跃

FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

N

1.14 V

有

119

IGLOO2

1.26 V

161

Tray

M2GL005

0°C ~ 85°C (TJ)

Tray

M2GL005

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

6060

719872

14 mm

14 mm

36 In Stock

• 1: ¥773.314346
• 10: ¥729.541833
• 100: ¥688.247018
• 500: ¥649.289637
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

有

微芯片技术

176

IGLOO2

Tray

M2GL025

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

有

M2GL025-1FCSG325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

30

S-PBGA-B325

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

27696

1130496

27696

2680 In Stock

• 1: ¥1,012.802067
• 10: ¥955.473651
• 100: ¥901.390235
• 500: ¥850.368142
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

BGA, BGA325,21X21,20

网格排列

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

30

1.14 V

85 °C

有

M2GL050-1FCSG325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

176

IGLOO2

200

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

2754 In Stock

• 1: ¥1,289.717778
• 10: ¥1,216.714885
• 100: ¥1,147.844229
• 500: ¥1,082.871914
查看所有的价格

-

表面贴装

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

1.14 V

无

M2GL050-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

90

IGLOO2

207

Tray

M2GL050

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

-40°C ~ 100°C (TJ)

Tray

M2GL050

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

56340

1869824

STD

56340

17 mm

17 mm

2087 In Stock

• 1: ¥1,719.667321
• 10: ¥1,622.327662
• 100: ¥1,530.497791
• 500: ¥1,443.865845
查看所有的价格

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.2 V

30

1.14 V

85 °C

有

M2GL050TS-FGG896

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

Details

有

27

IGLOO2

377

Tray

M2GL050

活跃

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B896

377

不合格

1.2 V

OTHER

377

2.44 mm

现场可编程门阵列

56340

1869824

56340

31 mm

31 mm

2602 In Stock

• 1: ¥1,011.169686
• 10: ¥953.933665
• 100: ¥899.937420
• 500: ¥848.997564
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL060

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

OTHER

现场可编程门阵列

56520

1869824

2038 In Stock

• 1: ¥958.098080
• 10: ¥903.866113
• 100: ¥852.703884
• 500: ¥804.437625
查看所有的价格

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

有

微芯片技术

176

IGLOO2

1.2 V

Tray

M2GL060

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

200 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

1.2 V

现场可编程门阵列

56520

1869824

2 Transceiver

2895 In Stock

• 1: ¥1,100.906400
• 10: ¥1,038.590946
• 100: ¥979.802774
• 500: ¥924.342241
查看所有的价格

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

微芯片技术

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

M2GL050

活跃

BGA, BGA325,21X21,20

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

2031 In Stock

• 1: ¥2,529.763788
• 10: ¥2,386.569611
• 100: ¥2,251.480762
• 500: ¥2,124.038461
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-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

11000 LE

有

60

ProASIC3

300

Tray

A3P1000

活跃

-55°C ~ 125°C (TJ)

Tray

A3P1000

125 °C

-55 °C

1.425V ~ 1.575V

18 kB

147456

1e+06

2804 In Stock

• 1: ¥1,111.668748
• 10: ¥1,048.744102
• 100: ¥989.381233
• 500: ¥933.378514
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-

表面贴装

FBGA-676

676-FBGA (27x27)

微芯片技术

This product may require additional documentation to export from the United States.

Details

56520 LE

387 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

Tray

M2GL060

活跃

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL060

1.14V ~ 2.625V

1.2 V

667 Mb/s

56520

1869824

4 Transceiver

2027 In Stock

• 1: ¥830.288556
• 10: ¥783.291089
• 100: ¥738.953862
• 500: ¥697.126285
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-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

有

微芯片技术

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL025-VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL025

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

2651 In Stock

• 1: ¥1,593.106897
• 10: ¥1,502.931036
• 100: ¥1,417.859468
• 500: ¥1,337.603269
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-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2GL050TS-1FGG484

有

85 °C

1.14 V

1.2 V

BGA484,22X22,40

PLASTIC/EPOXY

3

网格排列

BGA, BGA484,22X22,40

This product may require additional documentation to export from the United States.

Details

有

60

IGLOO2

267

Tray

M2GL050

活跃

5.27

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

30

S-PBGA-B484

267

不合格

1.2 V

OTHER

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm