N/A

-

YES

1152

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.575 V

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

1 mm

compliant

S-CBGA-X1152

684

684

21504 CLBS, 2000000 GATES

5.935 mm

现场可编程门阵列

0.93 ns

21504

32256

2000000

300k Rad(Si) V

35 mm

35 mm

N/A

-

NO

1152

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.5 V

1.425 V

1.575 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, CGA-1152

125 °C

-55 °C

3A001.A.2.C

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

PERPENDICULAR

UNSPECIFIED

未说明

1 mm

compliant

未说明

S-CPGA-X1152

684

不合格

MILITARY

684

21504 CLBS, 2000000 GATES

3.575 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

21504

32256

2000000

35 mm

35 mm

N/A

-

YES

208

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

310 MHz

125 °C

-55 °C

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

173

不合格

MILITARY

173

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.2 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

N/A

-

YES

624

CERAMIC, METAL-SEALED COFIRED

LGA

LGA624,25X25,50

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

LGA-624

125 °C

-55 °C

3A001.A.2.C

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

无铅

未说明

1.27 mm

compliant

未说明

S-CBGA-N624

418

不合格

MILITARY

418

12096 CLBS, 1000000 GATES

2.96 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

12096

18144

1000000

32.5 mm

32.5 mm

N/A

-

YES

256

CERAMIC, METAL-SEALED COFIRED

LGA

BGA256,16X16,40

SQUARE

网格排列

2.75 V

2.25 V

2.5 V

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, CCLG-256

310 MHz

125 °C

-55 °C

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

BOTTOM

无铅

1 mm

compliant

S-CBGA-N256

202

不合格

MILITARY

202

2880 CLBS, 48000 GATES

1.778 mm

现场可编程门阵列

MIL-PRF-38535

1.2 ns

2880

2880

48000

17 mm

17 mm

N/A

-

YES

624

活跃

MICROCHIP TECHNOLOGY INC

649 MHz

125 °C

-55 °C

LGA

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

9A515.E

8542.39.00.01

BOTTOM

BUTT

compliant

S-XBGA-X624

418

418

21504 CLBS, 2000000 GATES

现场可编程门阵列

0.93 ns

2000000

300k Rad(Si) V

N/A

-

YES

1152

1.425 V

1.5 V

活跃

MICROCHIP TECHNOLOGY INC

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

CGA

CGA1152,34X34,40

SQUARE

网格排列

1.575 V

3A001.A.2.C

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

1 mm

compliant

S-CBGA-X1152

684

684

21504 CLBS, 2000000 GATES

5.935 mm

现场可编程门阵列

1.1 ns

21504

32256

2000000

300k Rad(Si) V

35 mm

35 mm

N/A

-

YES

208

-40 °C

PLASTIC/EPOXY

FQFP

2.5 V

2.3 V

2.7 V

FLATPACK, FINE PITCH

SQUARE

有

活跃

MICROCHIP TECHNOLOGY INC

0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208

3

85 °C

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

30

S-PQFP-G208

不合格

INDUSTRIAL

3.3 mm

现场可编程门阵列

29.21 mm

29.21 mm

N/A

-

YES

208

310 MHz

2.5 V

2.25 V

2.75 V

FLATPACK, GUARD RING

SQUARE

TPAK208,2.9SQ,20

GQFF

CERAMIC, METAL-SEALED COFIRED

-55 °C

125 °C

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

e0

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

225

0.5 mm

compliant

20

S-CQFP-F208

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class B

1.2 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

YES

256

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-256

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.4 ns

2880

2880

48000

36 mm

36 mm

N/A

-

YES

624

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, CGA-624

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

CGA

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

UNSPECIFIED

未说明

1.27 mm

compliant

未说明

S-CBGA-X624

不合格

MILITARY

21504 CLBS, 2000000 GATES

5.37 mm

现场可编程门阵列

0.95 ns

21504

2000000

32.5 mm

32.5 mm

N/A

-

YES

256

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

QFP-256

125 °C

-55 °C

e0

9A515.E

锡铅

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

136

不合格

MILITARY

136

21504 CLBS, 2000000 GATES

3.3 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

0.93 ns

21504

32256

2000000

36 mm

36 mm

N/A

-

YES

352

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-352

125 °C

-55 °C

e0

3A001.A.2.C

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class S (Modified)

1.1 ns

12096

1000000

48 mm

48 mm

N/A

-

活跃

MICROCHIP TECHNOLOGY INC

9A515.E

8542.39.00.01

compliant

现场可编程门阵列

N/A

-

YES

624

CERAMIC, METAL-SEALED COFIRED

LGA

LGA624,25X25,50

SQUARE

网格排列

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

LGA-624

125 °C

-55 °C

9A515.E

250000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

BOTTOM

无铅

未说明

1.27 mm

compliant

未说明

S-CBGA-N624

684

不合格

MILITARY

684

21504 CLBS, 2000000 GATES

2.96 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

21504

32256

2000000

32.5 mm

32.5 mm

N/A

-

YES

256

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK256,3SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-256

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F256

227

不合格

MILITARY

227

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535

1.2 ns

2880

2880

48000

36 mm

36 mm

N/A

-

YES

208

310 MHz

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

GQFF

TPAK208,2.9SQ,20

SQUARE

FLATPACK, GUARD RING

2.75 V

2.25 V

2.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-208

3A001.A.2.C

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

QUAD

FLAT

未说明

0.5 mm

compliant

未说明

S-CQFP-F208

173

不合格

MILITARY

173

2880 CLBS, 48000 GATES

3.3 mm

现场可编程门阵列

MIL-PRF-38535 Class V

1.4 ns

2880

2880

48000

100k Rad(Si) V

29.21 mm

29.21 mm

N/A

-

YES

352

CERAMIC, METAL-SEALED COFIRED

QFF

TPAK352,2.9SQ,20

SQUARE

FLATPACK

1.575 V

1.425 V

1.5 V

无

活跃

MICROCHIP TECHNOLOGY INC

CERAMIC, QFP-352

125 °C

-55 °C

e0

9A515.E

锡铅

125000 ASIC GATES ALSO AVAILABLE

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

198

不合格

MILITARY

198

12096 CLBS, 1000000 GATES

2.89 mm

现场可编程门阵列

MIL-STD-883 Class B

0.93 ns

12096

1000000

48 mm

48 mm

N/A

-

YES

352

Obsolete

MICROCHIP TECHNOLOGY INC

CERAMIC, MQFP-352

CERAMIC, METAL-SEALED COFIRED

HGQFF

SQUARE

FLATPACK, HEAT SINK/SLUG, GUARD RING

1.95 V

1.65 V

1.8 V

8542.39.00.01

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F352

280000 GATES

3.5 mm

现场可编程门阵列

280000

48 mm

48 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

649 MHz

有

27

Actel

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

AX2000-FG896I

649 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

N

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

-40 to 85 °C

Tray

AX2000

e0

Tin/Lead (Sn/Pb)

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

684

不合格

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

294912

2000000

32256

STD

0.99 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

微芯片技术

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX36-PQG208

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Details

176 I/O

3 V

0 C

+ 70 C

SMD/SMT

131 MHz

有

24

Actel

5.25 V

Tray

A42MX36

0°C ~ 70°C (TA)

Tray

A42MX36

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

2560

54000

2.7 ns

2438

54000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

AFS600-2FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

0°C ~ 85°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

484

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

60

ProASIC3

微芯片技术

0.014110 oz

FBGA

1.5000 V

1.425 V

600000

235

600000

1.575 V

表面贴装

1.575 V

Tray

A3P600

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P600-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

Commercial grade

This product may require additional documentation to export from the United States.

N

235 I/O

0 to 70 °C

Tray

A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

Commercial

1

13824

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

1.5000 V

微芯片技术

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-VQ100

350 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

N

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

90

ProASIC3

0 to 70 °C

Tray

M1A3P250

e0

锡铅

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1 mm

14 mm

14 mm