N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

Details

174 I/O

2.25 V

- 40 C

+ 125 C

SMD/SMT

238 MHz

有

24

Actel

Tray

A54SX32

活跃

2.75 V

-40°C ~ 125°C (TA)

Tray

A54SX32A

2.5 V

48000

2880

STD

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

5.25

Details

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

156 MHz

有

24

Actel

Tray

A54SX72

活跃

2.75 V

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

70 °C

有

A54SX72A-FPQG208

156 MHz

FQFP

SQUARE

活跃

0°C ~ 70°C (TA)

Tray

A54SX72A

e3

Matte Tin (Sn)

70 °C

0 °C

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

245

0.5 mm

compliant

156 MHz

S-PQFP-G208

171

不合格

2.5,3.3/5 V

COMMERCIAL

2 ns

2 ns

171

6036 CLBS, 108000 GATES

4.1 mm

现场可编程门阵列

6036

108000

156 MHz

6036

6036

4024

2 ns

6036

6036

2.75 V

2.25 V

108000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

85 °C

有

A54SX16A-1TQG100I

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

81 I/O

2.25 V

- 40 C

+ 85 C

SMD/SMT

263 MHz

有

90

Actel

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5,3.3/5 V

INDUSTRIAL

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

微芯片技术

2.5 V

40

125 °C

有

A54SX16A-1TQG144M

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.37

This product may require additional documentation to export from the United States.

Details

113 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

263 MHz

有

60

Actel

0.046530 oz

Tray

A54SX16

活跃

2.75 V

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

-55°C ~ 125°C (TC)

Tray

A54SX16A

e3

3A001.A.2.C

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

MILITARY

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

APA075-TQG100

180 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

1.57

Details

-

66 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

有

-

90

27648 bit

ProASICPLUS

0.023175 oz

2.7 V

Tray

APA075

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

0°C ~ 70°C (TA)

Tray

APA075

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

66

不合格

2.5,2.5/3.3 V

COMMERCIAL

5 mA

66

75000 GATES

1.6 mm

现场可编程门阵列

27648

75000

STD

3072

75000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

71 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

90

ProASIC3

Tray

A3P125

活跃

1.575 V

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P125-1VQG100I

350 MHz

-40°C ~ 100°C (TJ)

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

36864

125000

1

3072

125000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

微芯片技术

Tray

A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P1000-FGG256

350 MHz

BGA

SQUARE

活跃

FPGA ProASICu00ae3 Family 1M Gates 231MHz 130nm Technology 1.5V Automotive 256-Pin FBGA

MICROSEMI CORP

1.33

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

ProASIC3

147456 bit

90

-

有

231 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

1.5000 V

1.425 V

1.575 V

1.575 V

0 to 70 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

8 mA

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

1.6 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

A54SX72A-FFGG256

156 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

Actel

90

有

156 MHz

SMD/SMT

+ 70 C

0 C

2.25 V

203 I/O

Details

2.75 V

Tray

A54SX72

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

40

70 °C

有

0°C ~ 70°C (TA)

Tray

A54SX72A

e1

Tin/Silver/Copper (Sn/Ag/Cu)

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

203

不合格

2.5,3.3/5 V

COMMERCIAL

203

6036 CLBS, 108000 GATES

1.97 mm

现场可编程门阵列

108000

6036

2 ns

6036

6036

108000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

-40 °C

1.5 V

40

85 °C

有

M7A3P1000-1FGG484I

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

272 MHz

S-PBGA-B484

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

272 MHz

1

24576

24576

1.575 V

1.425 V

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

247 MHz

有

90

Actel

5.25 V

Tray

A42MX09

活跃

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-1VQG100

135 MHz

TFQFP

SQUARE

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

2.1 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

3

网格排列

BGA,

0.014110 oz

Fusion

60

有

1282.05 MHz

SMD/SMT

+ 85 C

- 40 C

1.425 V

223 I/O

Details

This product may require additional documentation to export from the United States.

1.575 V

Tray

AFS1500

活跃

有

AFS1500-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.28205 GHz

1

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

A40MX04-3PLG84

有

70 °C

40

3.3 V

0.239083 oz

Actel

16

有

188 MHz

SMD/SMT

+ 70 C

0 C

3 V

69 I/O

Details

Tray

A40MX04

活跃

5.25 V

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

5.3

MICROSEMI CORP

活跃

SQUARE

QCCJ

109 MHz

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

表面贴装

BGA-329

YES

329

329-PBGA (31x31)

329

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

SMD/SMT

+ 85 C

- 40 C

3 V

249 I/O

Details

240 MHz

有

27

Actel

Tray

A54SX32

活跃

3.6 V

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-40 °C

3.3 V

40

85 °C

有

A54SX32-BGG329I

240 MHz

-40°C ~ 85°C (TA)

Tray

A54SX32

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

BOTTOM

BALL

250

1.27 mm

compliant

240 MHz

S-PBGA-B329

249

不合格

3.3,5 V

INDUSTRIAL

900 ps

900 ps

249

2880 CLBS, 32000 GATES

2.7 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

5.5 V

4.5 V

32000

1.8 mm

31 mm

31 mm

无

N/A

-

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

微芯片技术

A40MX04-FPLG44

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.25

Details

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

83 MHz

有

547 LAB

27

Actel

0.084185 oz

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

3.7 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

40

70 °C

有

M7A3P1000-FGG144

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M7A3P1000

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B144

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

无

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

微芯片技术

125 °C

有

A40MX04-PLG84M

80 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.28

This product may require additional documentation to export from the United States.

Details

69 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

139 MHz

有

16

Actel

0.239083 oz

5.5 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

-55°C ~ 125°C (TC)

Tube

A40MX04

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

MILITARY

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.7 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

PLCC-68

YES

68-PLCC (24.23x24.23)

68

微芯片技术

3.3 V

PLASTIC/EPOXY

3

CHIP CARRIER

ROHS COMPLIANT, PLASTIC, LCC-68

Details

57 I/O

3 V

0 C

+ 70 C

SMD/SMT

188 MHz

有

19

Actel

0.171777 oz

5.25 V

Tray

A40MX04

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

QCCJ

109 MHz

A40MX04-3PLG68

有

70 °C

40

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J68

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

1.7 ns

547

6000

3.68 mm

24.23 mm

24.23 mm

N/A

-

表面贴装

PQFP-160

YES

160-PQFP (28x28)

160

微芯片技术

A42MX16-2PQG160I

117 MHz

QFP

SQUARE

活跃

MICROSEMI CORP

5.3

Details

125 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

215 MHz

有

24

Actel

0.196363 oz

5.5 V

Tray

A42MX16

活跃

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

有

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

S-PQFP-G160

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

PLCC-44

YES

44

44-PLCC (16.59x16.59)

44

160 MHz

有

27

Actel

0.084185 oz

40MX

85C

微芯片技术

INDUSTRIALC

PLCC

6000

-40C to 85C

34

6000

547

0.45UM

5.5(V)

3.3/5(V)

无

3(V)

-40C

有

547

273

表面贴装

Tray

A40MX04

活跃

5.5 V

40

3.3 V

-40 °C

PLASTIC/EPOXY

3

CHIP CARRIER

QCCJ,

5.28

MICROSEMI CORP

活跃

SQUARE

QCCJ

48 MHz

A40MX04-1PLG44I

有

85 °C

Details

34 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

96/160(MHz)

S-PQCC-J44

不合格

INDUSTRIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

QFP

RECTANGULAR

活跃

MICROSEMI CORP

QFP,

FLATPACK

5.59

Details

69 I/O

4.75 V

- 40 C

+ 125 C

SMD/SMT

120 MHz

有

66

Actel

0.062040 oz

Tray

A40MX04

活跃

5.25 V

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A40MX04-PQG100A

116 MHz

-40°C ~ 125°C (TA)

Tray

A40MX04

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

AUTOMOTIVE

547 CLBS, 6000 GATES

3.4 mm

现场可编程门阵列

6000

STD

2.2 ns

547

6000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

微芯片技术

125 °C

有

A42MX16-1PQG100M

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

This product may require additional documentation to export from the United States.

Details

83 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

198 MHz

有

66

Actel

0.062040 oz

Tray

A42MX16

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

-55°C ~ 125°C (TC)

Tray

A42MX16

e3

3A001.A.2.C

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

MILITARY

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

N/A

-

表面贴装

TQFP-176

YES

176-TQFP (24x24)

176

微芯片技术

活跃

MICROSEMI CORP

5.29

Details

104 I/O

3 V

0 C

+ 70 C

SMD/SMT

129 MHz

有

40

Actel

5.25 V

Tray

A42MX09

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFP-176

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-FTQG176

70 MHz

LFQFP

SQUARE

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G176

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.6 mm

现场可编程门阵列

14000

3.5 ns

684

14000

1.4 mm

24 mm

24 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

115 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

24

Actel

Tray

AX500

活跃

1.575 V

0°C ~ 70°C (TA)

Tray

AX500

1.5 V

73728

500000

8064

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

VQFP

YES

100-VQFP (14x14)

100

微芯片技术

活跃

MICROSEMI CORP

5.26

Details

83 I/O

3 V

0 C

+ 70 C

SMD/SMT

129 MHz

有

90

Actel

5.25 V

Tray

A42MX09

活跃

1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

40

70 °C

有

A42MX09-FVQG100

70 MHz

TFQFP

SQUARE

0°C ~ 70°C (TA)

Tray

A42MX09

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

不合格

COMMERCIAL

684 CLBS, 14000 GATES

1.2 mm

现场可编程门阵列

14000

3.5 ns

684

14000

1 mm

14 mm

14 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

This product may require additional documentation to export from the United States.

Details

158 I/O

2.375 V

- 40 C

+ 125 C

SMD/SMT

180 MHz

有

24

Actel

2.625 V

Tray

APA300

活跃

-40°C ~ 125°C (TJ)

Tray

APA300

2.5 V

73728

300000

STD

3.4 mm

28 mm

28 mm