N/A

-

微芯片技术

4184880

Fluke

131

Tray

Discontinued at Digi-Key

This product may require additional documentation to export from the United States.

1

微芯片技术

N

活跃

MICROSEMI CORP

5.74

0°C ~ 70°C (TA)

MX

可编程逻辑集成电路

3V ~ 3.6V, 4.75V ~ 5.25V

compliant

现场可编程门阵列

FPGA - Field Programmable Gate Array

24000

FPGA - Field Programmable Gate Array

N/A

-

Miscellaneous

N/A

-

表面贴装

484-BFBGA

484-FBGA (19x19)

微芯片技术

BTW39-700X

Miscellaneous

284

Tray

活跃

-55°C ~ 125°C (TJ)

PolarFire™

0.97V ~ 1.08V

300000

21600666

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

30

微芯片技术

2.25 V

85 °C

无

A54SX08A-2TQ144I

313 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.25

113

Tray

A54SX08A

Obsolete

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

0.9 ns

768

768

12000

20 mm

20 mm

N/A

-

表面贴装

176-TQFP

YES

176-VQFP (20x20)

176

微芯片技术

250 MHz

AGLP060V5-VQ176

无

70 °C

1.425 V

未说明

1.5 V

TQFP176,.87SQ,16

PLASTIC/EPOXY

137

Tray

AGLP060

Obsolete

20 X 20 MM, 1 MM HEIGHT, 0.4 MM PITCH, VQFP-176

FLATPACK, THIN PROFILE, FINE PITCH

5.28

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

TFQFP

0°C ~ 85°C (TJ)

IGLOO PLUS

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

未说明

0.4 mm

unknown

S-PQFP-G176

137

不合格

1.5 V

COMMERCIAL

137

1584 CLBS, 60000 GATES

1.2 mm

现场可编程门阵列

1584

18432

60000

1584

1584

60000

20 mm

20 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

3 V

70 °C

无

117 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

3.6 V

5.24

QFP

ACH580-BCR-273A-2+E213+F267+K465

ABB

140

Tray

A42MX16

Obsolete

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

208

S-PQFP-G208

不合格

COMMERCIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

2.1 ns

1232

24000

28 mm

28 mm

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

-40 °C

微芯片技术

2.5 V

30

2.25 V

85 °C

无

294 MHz

LFQFP

SQUARE

Obsolete

MICROSEMI CORP

2.75 V

5.27

C0005P9GSES

Cutler Hammer, Div of Eaton Corp

81

Tray

A54SX16A

Obsolete

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40°C ~ 85°C (TA)

SX-A

e0

Tin/Lead (Sn/Pb)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,3.3/5 V

INDUSTRIAL

81

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

14 mm

14 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

267

Tray

M2GL060

活跃

,

未说明

有

M2GL060-1FGG484T1

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

-40°C ~ 135°C (TJ)

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

56520

1869824

N/A

-

表面贴装

BGA-484

484-FCBGA (19x19)

微芯片技术

Tray

MPF300

活跃

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

284 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

活跃

有

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Gold

Flanges, Panel, Wall

表面贴装

BGA-325

325-FCBGA (11x11)

Aluminium

微芯片技术

MPF100

活跃

Copper

Compliant

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.03 V/1.08 V

- 40 C

1

970 mV/1.02 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

-40°C ~ 100°C (TJ)

Bulk

MPF100TL

Crimp

Circular, Receptacle

26

200 °C

-65 °C

Receptacle

Bayonet

可编程逻辑集成电路

0.97V ~ 1.08V

Straight

30.96 mm

7.5 A

MIL-DTL-38999

26

Female

1 V, 1.05 V

Socket

Cadmium

12.7 Gb/s

109000

FPGA - Field Programmable Gate Array

7782400

4 Transceiver

FPGA - Field Programmable Gate Array

23.54 mm

无

无SVHC

抗环境干扰

N/A

-

Lead, Tin

通孔

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

Compliant

512

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

- 40 C

970 mV/1.02 V

SMD/SMT

-40°C ~ 100°C (TJ)

Bulk

PolarFire™

1 %

2

50 ppm/°C

3.7 kΩ

175 °C

-65 °C

Metal Film

125 mW

125 mW

0.97V ~ 1.08V

MIL-PRF-55182

1.05 V

12.7 Gb/s

300000

21094400

Military, Moisture Resistant, Weldable

2.39 mm

6.35 mm

2.39 mm

含铅

N/A

-

表面贴装

484-BFBGA

484-FPBGA (19x19)

Copper

微芯片技术

284

Tray

MPF100

活跃

600 V

600 V

Compliant

PVC

0°C ~ 100°C (TJ)

PolarFire™

Blue

0.97V ~ 1.08V

12 A

20 AWG

109000

7782400

N/A

-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

Tray

MPF300

活跃

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

512 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

Tray

MPF500

活跃

有

This product may require additional documentation to export from the United States.

481000 LE

388 I/O

Details

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

- 40 C

3.492228 oz

1.08 V

+ 100 C

-40°C ~ 100°C (TJ)

Tray

MPF500T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

16 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

BGA-1152

3

1152-FCBGA (35x35)

Lithium

2.8 g

微芯片技术

MPF500

活跃

3 V

Compliant

有

This product may require additional documentation to export from the United States.

481000 LE

584 I/O

+ 100 C

1.08 V

2.562565 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

-40°C ~ 100°C (TJ)

Tray

MPF500TS

通孔

可编程逻辑集成电路

0.97V ~ 1.08V

Horizontal

3 V

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

20 mm

Non-Rechargeable

Lithium

FPGA - Field Programmable Gate Array

20 mm

3.2 mm

20.2 mm

有

无铅

N/A

-

Lead, Tin

通孔

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

Tray

MPF100

活跃

Compliant

-

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

0 C

1.08 V

+ 100 C

7.6 Mbit

170 I/O

109000 LE

This product may require additional documentation to export from the United States.

有

0°C ~ 100°C (TJ)

Bulk

MPF100T

0.5 %

2

50 ppm/°C

7.41 kΩ

175 °C

-65 °C

Metal Film

可编程逻辑集成电路

100 mW

100 mW

0.97V ~ 1.08V

MIL-PRF-55182

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7600Kbit

4 Transceiver

Military, Moisture Resistant, Weldable

FPGA - Field Programmable Gate Array

1.78 mm

3.81 mm

1.78 mm

含铅

N/A

-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

活跃

有

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Non-Compliant

Female

Socket

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

30

1.14 V

70 °C

无

350 MHz

FQFP

SQUARE

Obsolete

MICROSEMI CORP

1.575 V

5.61

ASLD29922N-111-A-12V

IDEC

147

Tray

M1A3PE3000L

Obsolete

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.2 V

0°C ~ 85°C (TJ)

ProASIC3L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

75264

75264

3000000

28 mm

28 mm

N/A

-

Production (Last Updated: 10 months ago)

Gold, Lead, Tin

通孔

表面贴装

484-BGA

YES

15

Round

484-FPBGA (23x23)

Aluminium

484

Vertical

Without

Without

微芯片技术

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

85 °C

有

M2GL090-1FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.3

Brass

2.29 mm

Non-Compliant

267

Tray

M2GL090

活跃

86184 LE

+ 85 C

1.2 V

0 C

1.2 V

SMD/SMT

BGA, BGA484,22X22,40

网格排列

0°C ~ 85°C (TJ)

Bulk

IGLOO2

Solder

Male Pin, Pin, Plug

15

200 °C

-200 °C

1

8542.39.00.01

现场可编程门阵列

635 µm

1.14V ~ 2.625V

BOTTOM

Vertical

BALL

260

1 mm

7.11 mm

compliant

S-PBGA-B484

267

不合格

15

Natural

1.2 V

1.2 V

Pin

OTHER

Non-Compliant

1.26 V

1.14 V

323.3 kB

267

With

2.44 mm

现场可编程门阵列

86316

2648064

有

86316

7.5184 mm

14.1859 mm

23 mm

含铅

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

微芯片技术

113

Tray

A54SX32A

Obsolete

0°C ~ 70°C (TA)

SX-A

2.25V ~ 5.25V

48000

2880

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

1.5000 V

115

Tray

AX500

活跃

0 to 70 °C

Axcelerator

1.425V ~ 1.575V

73728

500000

8064

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

-40 °C

1.2 V

40

1.14 V

85 °C

有

A3PE3000L-FGG324I

5.29

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

250 MHz

1.14 V

1.26 V

221

Tray

A3PE3000

Compliant

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

1.2 V

微芯片技术

未说明

1.14 V

85 °C

有

AGL400V2-CSG196

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.2, 1.5 V

1.14 V

1.575 V

143

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

0 to 70 °C

IGLOO

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

8 mm

8 mm