N/A

-

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

QFN-48

ARM Cortex M4

416

3.6 V

微芯片技术

Tray

PIC32CX1012

活跃

SMD/SMT

64 MHz

GPIO, I2C, QSPI, SPI, UART

SRAM

128 kB

+ 85 C

- 40 C

96.7 mA

40.6 mA

1.9 V

2 Mb/s

Details

29 I/O

Tray

-

Bluetooth, Zigbee

2.4 GHz

1.9 V to 3.6 V

Flash

1 MB

12 dBm

32 bit

- 40 C to + 85 C

- 96 dBm

8 Channel

4 Timer

12 bit

0.9 mm

7 mm

7 mm

N/A

-

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

有

1

Tray

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

FCVG-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

有

1

Tray

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

667 MHz

有

1

Tray

活跃

This product may require additional documentation to export from the United States.

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

TQFP-128

微芯片技术

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel

N/A

-

TQFP-128

微芯片技术

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

1000

Tray

活跃

EV06X38A

120 MHz

PIC32CX

99 I/O

3.63 V

1.71 V

Tray

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

N/A

-

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

FCSG-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

N/A

-

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

N/A

-

325-TFBGA

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

-

23000 LE

108 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

325-TFBGA

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

-

23000 LE

108 I/O

0 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

0°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

325-TFBGA

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

-

23000 LE

108 I/O

- 40 C

+ 100 C

1

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

484-BFBGA

484-FBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

1

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

Tray

活跃

-

23000 LE

108 I/O

- 40 C

+ 100 C

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

+ 100 C

0 C

108 I/O

23000 LE

-

4 x 32 kB

16 kB, 4 x 32 kB

667 MHz, 667 MHz

MSL 3 - 168 hours

Tray

活跃

SMD/SMT

This product may require additional documentation to export from the United States.

1

0°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

FCSG-325

325-BGA (11x11)

RV64GC, RV64IMAC

微芯片技术

23000 LE

108 I/O

0 C

+ 100 C

1

MSL 3 - 168 hours

Tray

活跃

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

N/A

-

256-LBGA

256-FPBGA (17x17)

微芯片技术

活跃

MCU - 25, FPGA - 66

Tray

A2F500

0°C ~ 85°C (TJ)

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

1

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

N/A

-

256

A2F060M3E-1FG256M

Microsemi Corporation

Obsolete

MICROSEMI CORP

5.88

Non-Compliant

无

125 °C

-55 °C

8542.39.00.01

unknown

100 MHz

EBI/EMI, I2C, SPI, UART, USART

DMA, POR, WDT

ARM

N/A

-

208-BFQFP

208-PQFP (28x28)

微芯片技术

Obsolete

MCU - 22, FPGA - 66

Tray

A2F200

0°C ~ 85°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

N/A

-

536-LFBGA

536-BGA (16x16)

微芯片技术

MCU - 136, FPGA - 168

Tray

活跃

-40°C ~ 125°C (TJ)

-

-

2.2MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128KB

N/A

-

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

MCU - 136, FPGA - 468

Tray

活跃

0°C ~ 100°C

PolarFire™

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB