品牌是'Microchip' (873)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 终端数量 | 后壳材料,电镀 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 终端 | ECCN 代码 | 连接器类型 | 类型 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 颜色 | 应用 | 附加功能 | HTS代码 | 紧固类型 | 子类别 | 额定电流 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | Reach合规守则 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 外壳尺寸,MIL | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 电缆开口 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 速度等级 | 图例 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 等效门数 | 闪光大小 | 特征 | 产品类别 | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S005S-VFG400 | Microchip Technology | 数据表 | 47 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 505 LAB | 90 | 169 | Tray | M2S005 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S005S-VFG400 | LFBGA | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | 现场可编程门阵列 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1FGG484M | Microchip Technology | 数据表 | 2252 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | 有 | M2S010TS-1FGG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 233 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 40 | 1.14 V | 125 °C | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FCSG325I | Microchip Technology | 数据表 | 2940 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | ARM Cortex M3 | 微芯片技术 | RECTANGULAR | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 40 | 1.14 V | 有 | M2S090TS-1FCSG325I | TFBGA | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1VFG400I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 6060 LE | 有 | 505 LAB | 90 | 169 | Tray | M2S005 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-FCS325I | Microchip Technology | 数据表 | 2072 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325 | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | M2S060-FCS325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 176 | SmartFusion2 | 1.2000 V | 1.14 V | 1.26 V | 200 | Tray | M2S060 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 30 | 1.14 V | 无 | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | STD | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FCS325I | Microchip Technology | 数据表 | 2008 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 200 | Tray | M2S050 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF256I | Microchip Technology | 数据表 | 2971 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S025TS-VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.56 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-FC1152 | Microchip Technology | 数据表 | 2816 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-FC1152I | Microchip Technology | 数据表 | 2046 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | 1152-FCBGA (35x35) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1FGG484I | Microchip Technology | 数据表 | 84 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 233 | Tray | M2S010 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-1FG484 | Microchip Technology | 数据表 | 2641 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 60 | SmartFusion2 | 267 | Tray | M2S060 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090TS-1FG484I | Microchip Technology | 数据表 | 2189 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | M2S090TS-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 267 | Tray | M2S090 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-FG484I | Microchip | 数据表 | 2138 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | Panel Mount, Through Hole | 484-BGA | Flange | Aluminum | 484-FPBGA (23x23) | - | - | Amphenol Aerospace Operations | - | Bulk | Metal | TVP00DT | 活跃 | Copper Alloy | Gold | Non-Compliant | 267 | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ HD | Solder | Receptacle, Male Pins | 55 | - | Military | Threaded | - | A | Shielded | 抗环境干扰 | Durmalon™ | 15-55 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | 校准盘 | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-1VF400 | Microchip | 数据表 | 2839 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | Polystyrene | 400 | 微芯片技术 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 119817 | Brady | 1.2000 V | 1.14 V | 1.26 V | 207 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 5.84 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | 无 | 85 °C | 1.14 V | 30 | 0 to 85 °C | SmartFusion®2 | e0 | Fire/Emergency Signs | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | Emergency Fire Alarm | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-FG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 无 | A2F060M3E-FG256 | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 20 | 1.425 V | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | OTHER | 1536 CLBS, 60000 GATES | 1.7 mm | 现场可编程门阵列 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-FG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 20 | 1.425 V | 无 | A2F060M3E-FG256I | 80 MHz | LBGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 8.76 | 1 MM PITCH, FBGA-256 | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | 不合格 | 1.5,1.8,2.5,3.3 V | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | 现场可编程门阵列 | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-VFG256I | Microchip | 数据表 | 2738 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | 1.2000 V | 1.14 V | 1.26 V | 8542390000 | Non-Compliant | 有 | - | 166 MHz | 27696 LE | 138 I/O | + 100 C | 0.241494 oz | - 40 C | 119 | SMD/SMT | 2308 LAB | Microchip | Microchip Technology / Atmel | - | 64 kB | Tray | M2S025 | 活跃 | -40 to 100 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-1CSG288I | Microchip | 数据表 | 44 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | 微芯片技术 | 1.5000 V | 1.425 V | 200000 | 1.575 V | MCU - 31, FPGA - 78 | Tray | A2F200 | 活跃 | -40 to 100 °C | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-FCSG325I | Microchip | 数据表 | 345 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | 180 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | + 100 C | - 40 C | SMD/SMT | - | 64 kB | -40°C ~ 100°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FGG484T2 | Microchip | 数据表 | 2600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2S060 | 活跃 | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1FGG484T2 | Microchip | 数据表 | 2832 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | Tray | M2S025 | 活跃 | 1.2000 V | 267 | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-1TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | MICROSEMI CORP | 1.575 V | 5.81 | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.5 V | 1.425 V | 85 °C | 有 | A2F060M3E-1TQG144 | LFQFP | SQUARE | Microsemi Corporation | Obsolete | 8542.39.00.01 | CMOS | QUAD | 鸥翼 | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1536 CLBS, 60000 GATES | 1.6 mm | 现场可编程门阵列 | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FGG484I | Microchip | 数据表 | 2438 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 56340 LE | 0.489749 oz | 60 | SMD/SMT | 4695 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | 267 | Tray | M2S050 | 活跃 | SMARTFUSION2 | 100C | Industrial | FPBGA | -40C to 100C | 267 | 56340 | 65nm | 1.26(V) | 1.2(V) | 无 | 1.14(V) | -40C | 有 | 56340 | 表面贴装 | 有 | This product may require additional documentation to export from the United States. | - | 166 MHz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F060M3E-TQG144 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 8.63 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | SQUARE | LFQFP | 80 MHz | A2F060M3E-TQG144 | 有 | 85 °C | 1.425 V | 30 | 1.5 V | LFQFP, QFP144,.87SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | e3 | PURE MATTE TIN (394) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 250 | 0.5 mm | compliant | S-PQFP-G144 | 33 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | 现场可编程门阵列 | 1536 | 1536 | 60000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1VFG400I | Microchip | 数据表 | 2804 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 02466 | Greenlee | 1.2000 V | 207 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB |
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