Xilinx的PLDs（可编程逻辑器件）_正品采购_价格信息

品牌是'Xilinx' (731)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	包装方式	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
PZ5032-6BC-T	AMD Xilinx	数据表	623 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	105 MHz	32	70 °C	PLASTIC/EPOXY	TQFP	SQUARE	FLATPACK, THIN PROFILE	5.25 V	4.75 V	5 V	Obsolete	XILINX INC	QFP	TQFP,					32 MACROCELLS	8542.39.00.01		QUAD	鸥翼		0.8 mm	unknown		44	S-PQFP-G44		不合格	COMMERCIAL	8 ns			2 DEDICATED INPUTS, 32 I/O	1.2 mm	EE PLD	MACROCELL			2			10 mm	10 mm
PZ5064CS7BP	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	SQUARE	FLATPACK	5 V	无	Obsolete	XILINX INC	QFP, TQFP100,.63SQ	3	70 °C					YES	8542.39.00.01		QUAD	鸥翼	240	0.5 mm	unknown	30		S-PQFP-G100		不合格	COMMERCIAL	9 ns					EE PLD		64	YES		YES
PZ3032I10A44-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	QCCJ,	58.8 MHz	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	3.63 V	2.97 V	3.3 V	Obsolete	XILINX INC	LPCC					32 MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	INDUSTRIAL	12.5 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL			2			16.5862 mm	16.5862 mm
PZ5064NS10BC-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	Transferred	XILINX INC	TQFP-44	80 MHz	3	32	85 °C	-40 °C	PLASTIC	QFP	TQFP44,.47SQ,32	SQUARE	FLATPACK	5.5 V	4.5 V	5 V	无					YES	8542.39.00.01	TAPE AND REEL	QUAD	鸥翼	240	0.8 mm	not_compliant	30		S-PQFP-G44	32	不合格	INDUSTRIAL	12 ns	PAL/PLA-TYPE	36	2 DEDICATED INPUTS, 32 I/O		EE PLD		64	YES	2	YES		10 mm	10 mm
PZ3064-10A68	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	68	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	3.3 V	无	Obsolete	XILINX INC	QCCJ, LDCC68,1.0SQ	3	70 °C	e0			Tin/Lead (Sn85Pb15)	NO	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown			S-PQCC-J68		不合格	COMMERCIAL	12.5 ns					EE PLD		64	NO		NO
P5Z22V10-7DH-T	AMD Xilinx	数据表	970 In Stock	-	最小起订量: 1 最小包装量: 1	YES	24	TSSOP,	103 MHz	10	70 °C	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	5.25 V	4.75 V	5 V	Obsolete	XILINX INC	TSSOP					PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET	8542.39.00.01		DUAL	鸥翼		0.65 mm	unknown		24	R-PDSO-G24		不合格	COMMERCIAL	7.5 ns			11 DEDICATED INPUTS, 10 I/O	1.1 mm	EE PLD	MACROCELL			11			7.8 mm	4.4 mm
XCR3320-10BG256C	AMD Xilinx	数据表	887 In Stock	-	最小起订量: 1 最小包装量: 1	YES	256	Obsolete	XILINX INC	BGA	PLASTIC, BGA-256	87 MHz	3	3	70 °C	PLASTIC/EPOXY	BGA	BGA256,20X20,50	SQUARE	网格排列	3.6 V	3 V	3.3 V	无	e0			锡铅	YES	8542.39.00.01		BOTTOM	BALL	225	1.27 mm	not_compliant	30	256	S-PBGA-B256		不合格	COMMERCIAL	10 ns			12 DEDICATED INPUTS, 3 I/O	2.55 mm	可加载 PLD	MACROCELL	320	YES	12	YES		27 mm	27 mm
XC7236-25PC44I	AMD Xilinx	数据表	599 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	LCC	PLASTIC, LCC-44	33 MHz	3	30	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	e0			锡铅	36 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30	44	S-PQCC-J44		不合格	INDUSTRIAL	40 ns			2 DEDICATED INPUTS, 30 I/O	4.57 mm	OT PLD	MACROCELL	36	NO	2	NO		16.5862 mm	16.5862 mm
P3Z22V10-DDH	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	24	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	无	Obsolete	XILINX INC	TSSOP, TSSOP24,.25	80 MHz	70 °C	e0			Tin/Lead (Sn/Pb)		8542.39.00.01		DUAL	鸥翼		0.635 mm	unknown			R-PDSO-G24	10	不合格	COMMERCIAL	10 ns	PAL-TYPE	22			EE PLD	MACROCELL					132
PZ3128IS12BP-T	AMD Xilinx	数据表	402 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	TFQFP,	69 MHz	80	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	3.63 V	2.97 V	3.3 V	Obsolete	XILINX INC	QFP					128 MACROCELLS	8542.39.00.01		QUAD	鸥翼		0.5 mm	unknown		100	S-PQFP-G100		不合格	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD	MACROCELL			2			14 mm	14 mm
XC7272-30WC84I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	XILINX INC	85 °C	-40 °C	CERAMIC	QCCJ					NO	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown			S-XQCC-J84		不合格	INDUSTRIAL	48 ns					UV PLD		72	NO		NO
XC7272A-16WC84I	AMD Xilinx	数据表	718 In Stock	-	最小起订量: 1 最小包装量: 1	YES	84	无	Obsolete	XILINX INC	QFJ	WQCCJ, LDCC84,1.2SQ	55 MHz	1	42	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V					PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		84	S-CQCC-J84		不合格	INDUSTRIAL	25 ns			12 DEDICATED INPUTS, 42 I/O	4.826 mm	UV PLD	MACROCELL	72	NO	12	NO		29.21 mm	29.21 mm
PZ5032-6A44-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	105 MHz	32	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Obsolete	XILINX INC	LPCC	QCCJ,					32 MACROCELLS	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	8 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL			2			16.5862 mm	16.5862 mm
XH95432-10HQ304C	AMD Xilinx	数据表	711 In Stock	-	最小起订量: 1 最小包装量: 1	YES	304	232	PLASTIC/EPOXY	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	无	Transferred	XILINX INC	QFP	HEAT SINK, QFP-304	3	e0	无	3A991.D	锡铅		8542.39.00.01		QUAD	鸥翼		0.5 mm	compliant		304	S-PQFP-G304		不合格					0 DEDICATED INPUTS, 232 I/O	4.5 mm	MASK PLD	MACROCELL						40 mm	40 mm
XCR3032C-10PC44I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	LCC	PLASTIC, LCC-44	58.8 MHz	3	32	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	3.63 V	2.97 V	3.3 V	e0			锡铅	YES	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30	44	S-PQCC-J44		不合格	INDUSTRIAL	10 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD	MACROCELL	32	YES	2	YES		16.5862 mm	16.5862 mm
PZ3064DS12BP	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	-40 °C	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	SQUARE	FLATPACK	无	Obsolete	XILINX INC	QFP, TQFP100,.63SQ	3	85 °C					YES	8542.39.00.01		QUAD	鸥翼	240	0.5 mm	unknown	30		S-PQFP-G100		不合格	INDUSTRIAL	13.5 ns					EE PLD		64	YES		YES
XC7272A-16PG84C	AMD Xilinx	数据表	2 In Stock	-	最小起订量: 1 最小包装量: 1	NO	84	XILINX INC	PGA	WPGA, PGA84M,11X11	55 MHz	42	70 °C	CERAMIC, METAL-SEALED COFIRED	WPGA	PGA84M,11X11	SQUARE	GRID ARRAY, WINDOW	5.25 V	4.75 V	5 V	有	Obsolete					PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS	8542.39.00.01		PERPENDICULAR	PIN/PEG		2.54 mm	unknown		84	S-CPGA-P84		不合格	COMMERCIAL	25 ns			12 DEDICATED INPUTS, 42 I/O	5.207 mm	UV PLD	MACROCELL	72	NO	12	NO		27.94 mm	27.94 mm
XC2C64-4CPG56C	AMD Xilinx	数据表	28 In Stock	-	最小起订量: 1 最小包装量: 1	YES	56	Transferred	XILINX INC	BGA	6 X 6 MM, 0.50 MM PITCH, CSP-56	213 MHz	3	45	70 °C	PLASTIC/EPOXY	LFBGA	BGA56,10X10,20	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	1.9 V	1.7 V	1.8 V	有	e1	有		锡银铜	FAST ZERO POWER DESIGN TECHNOLOGY	8542.39.00.01		BOTTOM	BALL	260	0.5 mm	compliant	30	56	S-PBGA-B56	45	不合格	COMMERCIAL	4 ns	PLA-TYPE	45	0 DEDICATED INPUTS, 45 I/O	1.35 mm	闪存 PLD	MACROCELL	64					6 mm	6 mm
XC95108F-10PQ100C	AMD Xilinx	数据表	241 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	Obsolete	XILINX INC	QFP	PLASTIC, QFP-100	67 MHz	3	81	70 °C	PLASTIC/EPOXY	QFP	QFP100,.7X.9	RECTANGULAR	FLATPACK	5.25 V	4.75 V	5 V	无	e0			Tin/Lead (Sn85Pb15)	NO	8542.39.00.01		QUAD	鸥翼	225	0.65 mm	not_compliant	30	100	R-PQFP-G100		不合格	COMMERCIAL	10 ns			0 DEDICATED INPUTS, 81 I/O	3.4 mm	闪存 PLD	MACROCELL	108	YES		NO		20 mm	14 mm
XCR5064-7PC68C	AMD Xilinx	数据表	683 In Stock	-	最小起订量: 1 最小包装量: 1	YES	68	Obsolete	XILINX INC	LCC	QCCJ, LDCC68,1.0SQ	105 MHz	1	48	70 °C	PLASTIC/EPOXY	QCCJ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	无					NO	8542.39.00.01		QUAD	J BEND		1.27 mm	unknown		68	S-PQCC-J68		不合格	COMMERCIAL	7.5 ns			2 DEDICATED INPUTS, 48 I/O	5.08 mm	EE PLD	MACROCELL	64	NO	2	NO		24.2316 mm	24.2316 mm
PZ5064N12BP	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	XILINX INC	67 MHz	3	64	85 °C	-40 °C	PLASTIC/EPOXY	QFP	TQFP100,.63SQ	SQUARE	FLATPACK	5.5 V	4.5 V	5 V	无	Transferred	e0			锡铅	YES	8542.39.00.01		QUAD	鸥翼	240	0.5 mm	not_compliant	30		S-PQFP-G100	64	不合格	INDUSTRIAL	14.5 ns	PAL/PLA-TYPE	68	2 DEDICATED INPUTS, 64 I/O		EE PLD		64	YES	2	YES		14 mm	14 mm
PZ5064C10A44	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	80 MHz	3	32	70 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	无	Transferred	XILINX INC	e0			锡铅	YES	8542.39.00.01		QUAD	J BEND	225	1.27 mm	not_compliant	30		S-PQCC-J44	32	不合格	COMMERCIAL	12.5 ns	PAL/PLA-TYPE	36	2 DEDICATED INPUTS, 32 I/O		EE PLD		64	YES	2	YES		16.585 mm	16.585 mm
XC95576-12BGG432C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	432	LBGA,	3	232	70 °C	PLASTIC/EPOXY	LBGA	BGA432,31X31,50	SQUARE	GRID ARRAY, LOW PROFILE	5 V	有	Obsolete	XILINX INC	BGA	e1		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		BOTTOM	BALL	未说明	1.27 mm	compliant	未说明	432	S-PBGA-B432		不合格	COMMERCIAL	12 ns			232 I/O	1.7 mm	闪存 PLD	MACROCELL						40 mm	40 mm
XC95216-15BGG352C	AMD Xilinx	数据表	944 In Stock	-	最小起订量: 1 最小包装量: 1	YES	352	Obsolete	XILINX INC	BGA	LBGA,	55.6 MHz	3	166	70 °C	PLASTIC/EPOXY	LBGA	BGA352,26X26,50	SQUARE	GRID ARRAY, LOW PROFILE	5.25 V	4.75 V	5 V	有	e1			Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V	8542.39.00.01		BOTTOM	BALL	260	1.27 mm	compliant	30	352	S-PBGA-B352		不合格	COMMERCIAL	15 ns			0 DEDICATED INPUTS, 166 I/O	1.4 mm	闪存 PLD	MACROCELL						35 mm	35 mm
XH95432-10HQG304C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	304	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	Transferred	XILINX INC	QFP	HEAT SINK, QFP-304	232	PLASTIC/EPOXY	HFQFP	SQUARE	e3	有	3A991.D	哑光锡		8542.39.00.01		QUAD	鸥翼		0.5 mm	compliant		304	S-PQFP-G304		不合格					0 DEDICATED INPUTS, 232 I/O	4.5 mm	MASK PLD	MACROCELL						40 mm	40 mm