AMD AM2615FMB

表面安装

YES

终端数量

16

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

DFP, FL16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DFP

Package Equivalence Code

FL16,.3

Package Shape

RECTANGULAR

Package Style

FLATPACK

Supply Voltage-Nom

5 V

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

温度等级

MILITARY

电源电流-最大值

50 mA

筛选水平

MIL-STD-883 Class B (Modified)

输出低电流-最大值

0.015 A