AMD Xilinx XCZU6CG-1FBVB900E

表面安装

YES

终端数量

900

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

XILINX INC

Package Description

BGA, BGA900,30X30,40

Operating Temperature-Max

100 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA900,30X30,40

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

0.876 V

Supply Voltage-Min

0.825 V

Supply Voltage-Nom

0.85 V

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B900

温度等级

OTHER

uPs/uCs/外围ICs类型

PROGRAMMABLE SoC

座位高度-最大

2.88 mm

总线兼容性

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

长度

31 mm

宽度

31 mm