Cypress Semiconductor BCM4330FKUBG

表面安装

YES

终端数量

133

Gross weight

8.12

Transport packaging size/quantity

45*38*20/500

Part Life Cycle Code

Transferred

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

WLBGA-133

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom

1.2 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B133

温度等级

OTHER

座位高度-最大

0.55 mm

通信IC类型

电信电路

长度

5.33 mm

宽度

4.89 mm