Freescale Semiconductor 1594/BEAJC

表面安装

NO

材料

synthetic polyolefin

终端数量

16

Diameter after shrinkage

10.0 mm

Wall thickness before shrinkage

0.4 mm

Wall thickness after shrinkage

0.8 mm

Gross weight

2620.00

Transport packaging size/quantity

46*46*53/10

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

15 V

Diameter of the protected wire (cable)

10.4…19.0 mm

Diameter before shrinkage

22.0 mm

包装

coil 100 m

JESD-609代码

e0

类型

Adhesive-free heat shrink tube

端子表面处理

Tin/Lead (Sn/Pb)

颜色

red

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

Working voltage

600 V

电源

+-15 V

温度等级

MILITARY

模拟 IC - 其他类型

相机开发工具

供应电流-最大值(Isup)

18 mA

负电源电压(Vsup)

-15 V

Operating temperature range

-55…+125 °C

筛选水平

38535Q/M;38534H;883B

Shrink temperature

+70…+120 °C

Shrink ratio

2 : 1