Freescale Semiconductor SN54LS22J

表面安装

NO

终端数量

14

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP14,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Design series

253

Average on-state current IT(AV)

1000

Peak repetitive reverse voltage VRRM

16

Suitable for cooling devices

O143, O243, O343, OM103, OM104

Transport packaging size/quantity

23*22.5*28/30

Gross weight

567.67

JESD-609代码

e0

类型

fast-acting tablet

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

5 V

温度等级

MILITARY

输出特性

OPEN-COLLECTOR

逻辑IC类型

NAND GATE

最大 I(ol)

0.004 A

Prop. Delay@Nom-Sup

32 ns

施密特触发器

NO