GSI Technology GS8161Z32DD-375

包装/外壳

BGA-165

引脚数

165

Maximum Clock Rate

238@Flow-Through/375@Pipelined MHz

Supplier Package

FBGA

Data Rate Architecture

SDR

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Timing Type

Synchronous

Number of Words

512 kWords

Number of I/O Lines

32 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Mounting

表面贴装

RoHS

Compliant

Maximum Clock Frequency

375 MHz

Maximum Operating Temperature

+ 70 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

0 C

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Usage Level

Commercial grade

操作温度

0 to 70 °C

包装

Bulk

系列

GS8161Z32DD

最高工作温度

70 °C

最小工作温度

0 °C

内存大小

18 Mbit

端口的数量

4

电源电流-最大值

270 mA, 350 mA

访问时间

4.2 ns

建筑学

Flow-Through/Pipelined

组织结构

512 k x 32

地址总线宽度

19 Bit

密度

18 Mbit

筛选水平

Commercial

辐射硬化

无