GSI Technology GS88136CGD-300

包装/外壳

BGA-165

Maximum Clock Rate

200@Flow-Through/300@Pipelined MHz

Supplier Package

FBGA

Data Rate Architecture

SDR

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Timing Type

Synchronous

Number of Words

256 kWords

Number of I/O Lines

36 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Mounting

表面贴装

Moisture Sensitive

有

Maximum Clock Frequency

300 MHz

Maximum Operating Temperature

+ 70 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

36

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI技术

Brand

GSI技术

Tradename

SyncBurst

RoHS

Details

Memory Types

SDR

Usage Level

Commercial grade

操作温度

0 to 70 °C

系列

GS88136CGD

包装

Tray

类型

Pipeline/Flow Through

子类别

Memory & Data Storage

引脚数量

165

内存大小

9 Mbit

端口的数量

1

电源电流-最大值

165 mA, 225 mA

访问时间

5 ns

建筑学

Flow-Through/Pipelined

组织结构

256 k x 36

地址总线宽度

17 Bit

产品类别

SRAM

密度

9 Mbit

筛选水平

Commercial

产品类别

SRAM