Intel GD82562EX

表面安装

YES

终端数量

196

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA196,14X14,40

Supply Voltage-Nom

3.3 V

Rohs Code

无

Manufacturer Part Number

GD82562EX

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.87

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.31.00.01

子类别

Serial IO/Communication Controllers

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B196

资历状况

不合格

电源

3.3 V

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, LAN