Microchip MSDT75-16

表面安装

NO

终端数量

7

Package Description

FLANGE MOUNT, R-XUFM-X7

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Operating Temperature-Max

150 °C

Manufacturer Part Number

MSDT75-16

Package Shape

RECTANGULAR

Manufacturer

Microsemi Corporation

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.82

附加功能

UL 认证

HTS代码

8541.30.00.80

端子位置

UPPER

终端形式

UNSPECIFIED

Reach合规守则

compliant

引脚数量

7

JESD-30代码

R-XUFM-X7

配置

SINGLE WITH BUILT-IN DIODE

箱体转运

ISOLATED

触发装置类型

SCR

重复峰值关态电压

1600 V

重复峰值反向电压

1600 V

均方根通态电流-最大值

117.75 A

直流栅极触发电流（最大）

150 mA