Microchip Technology A2F500M3G-1FGG256M

包装/外壳

256-LBGA

引脚数

256

供应商器件包装

256-FPBGA (17x17)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Core

ARM Cortex M3

Maximum Clock Frequency

100 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

6000 LE

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

90

Tradename

SmartFusion

Typical Operating Supply Voltage

1.5000 V

Minimum Operating Supply Voltage

1.425 V

Device Logic Gates

500000

Maximum Operating Supply Voltage

1.575 V

Number of I/Os

MCU - 25, FPGA - 66

Package

Tray

Base Product Number

A2F500

厂商

微芯片技术

Product Status

活跃

Moisture Sensitivity Levels

3

Rohs Code

有

Manufacturer Part Number

A2F500M3G-1FGG256M

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.79

包装

Tray

系列

A2F500

操作温度

0 to 85 °C

最高工作温度

125 °C

最小工作温度

-55 °C

HTS代码

8542.39.00.01

Reach合规守则

compliant

频率

100 MHz

界面

EBI/EMI, Ethernet, I2C, SPI, UART, USART

速度

100MHz

内存大小

64KB

核心处理器

ARM® Cortex®-M3

周边设备

DMA, POR, WDT

程序内存大小

512 kB

连接方式

EBI/EMI, Ethernet, I²C, SPI, UART/USART

建筑学

MCU, FPGA

核心架构

ARM

速度等级

1

主要属性

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

核数量

1 Core

闪光大小

512KB