Microchip Technology ARF300

生命周期状态

Production (Last Updated: 2 months ago)

底架

Screw

表面安装

YES

引脚数

6

终端数量

6

PCB changed

6

ECCN (US)

EAR99

Typical Input Capacitance @ Vds (pF)

1890@50V

Maximum Continuous Drain Current (A)

24

Maximum VSWR

10

Maximum Gate Source Voltage (V)

±30

Maximum Drain Source Voltage (V)

500

Number of Elements per Chip

1

Package Height

4.06

Package Length

28.98

Package Width

12.88

Typical Reverse Transfer Capacitance @ Vds (pF)

75@50V

Typical Output Capacitance @ Vds (pF)

350@50V

Typical Forward Transconductance (S)

8

Maximum Power Dissipation (mW)

1000000

Output Power (W)

300

Typical Power Gain (dB)

17

Maximum Frequency (MHz)

45

Typical Drain Efficiency (%)

85

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

175

AEC Qualified

无

Supplier Package

Case T-11

Military

无

Mounting

Screw

Channel Mode

Enhancement

Number of Elements

1

RoHS

Compliant

Package Description

ROHS COMPLIANT PACKAGE-6

Package Style

FLATPACK

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Max

175 °C

Rohs Code

有

Manufacturer Part Number

ARF300

Package Shape

RECTANGULAR

Manufacturer

Microsemi Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROSEMI CORP

Risk Rank

5.75

包装

Box

零件状态

活跃

最高工作温度

175 °C

最小工作温度

-55 °C

子类别

FET 通用电源

最大功率耗散

1 kW

端子位置

DUAL

终端形式

FLAT

Reach合规守则

compliant

引脚数量

6

JESD-30代码

R-CDFP-F6

资历状况

不合格

配置

单四源

极性/通道类型

N-CHANNEL

连续放电电流(ID)

24 A

最高频率

45 MHz

最大漏极电流 (Abs) (ID)

24 A

信道型

N

场效应管技术

METAL-OXIDE SEMICONDUCTOR

最大耗散功率(Abs)

555 W

RoHS状态

符合RoHS标准