Microchip Technology AT68166H-YS18-E

表面安装

YES

终端数量

68

ECCN (US)

ITAR (XI)

HTS

8542.31.00.01

Module

SRAM模块

Module Density

16Mbit

Number of Chip per Module

4

Chip Density (bit)

4M

Data Bus Width (bit)

4

Max. Access Time (ns)

18

Chip Configuration

512Kx8

Chip Package Type

68-MQFPT

Minimum Operating Supply Voltage (V)

3

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

170

ECC Support

无

SPD EEPROM Support

无

Standard Package Name

QFP

Supplier Package

MQFP-T

Mounting

表面贴装

Package Height

4.7(Max)

Package Length

64.14(Max)

Package Width

64.14(Max)

PCB changed

68

Package Description

HGQFF,

Package Style

FLATPACK, HEAT SINK/SLUG, GUARD RING

Number of Words Code

512000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Access Time-Max

18 ns

Manufacturer Part Number

AT68166H-YS18-E

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

HGQFF

Package Shape

SQUARE

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.56

附加功能

ALSO DATA WIDTH CAN BE ORGANISED AS 8 BIT

技术

CMOS

端子位置

QUAD

终端形式

FLAT

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

68

JESD-30代码

S-CQFP-F68

电源电压-最大值(Vsup)

3.6 V

电源电压-最小值(Vsup)

3 V

操作模式

ASYNCHRONOUS

组织结构

4Mx4

座位高度-最大

4.7 mm

内存宽度

32

记忆密度

16777216 bit

锁相环

无

并行/串行

PARALLEL

内存IC类型

标准SRAM

备用内存宽度

16

自我刷新

无

宽度

24.14 mm

长度

24.14 mm

RoHS状态

供应商未确认