Microchip Technology M2S150TS-1FCG1152

包装/外壳

FCBGA-1152

供应商器件包装

1152-FCBGA (35x35)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Mounting Styles

SMD/SMT

Core

ARM Cortex M3

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

146124 LE

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

12177 LAB

Factory Pack QuantityFactory Pack Quantity

24

Number of I/Os

574

Package

Tray

Base Product Number

M2S150

厂商

微芯片技术

Product Status

活跃

包装

Tray

系列

SmartFusion2

操作温度

0°C ~ 85°C (TJ)

速度

166MHz

内存大小

64KB

核心处理器

ARM® Cortex®-M3

周边设备

DDR, PCIe, SERDES

程序内存大小

512 kB

连接方式

CANbus, Ethernet, I²C, SPI, UART/USART, USB

建筑学

MCU, FPGA

主要属性

FPGA - 150K Logic Modules

核数量

1 Core

闪光大小

512KB