Microchip Technology MPFS025TLS-FCSG325I

包装/外壳

325-TFBGA

供应商器件包装

325-BGA (11x11)

Shipping Restrictions

This product may require additional documentation to export from the United States.

Mounting Styles

SMD/SMT

Core

RV64GC, RV64IMAC

Maximum Clock Frequency

667 MHz, 667 MHz

L1 Cache Instruction Memory

16 kB, 4 x 32 kB

L1 Cache Data Memory

4 x 32 kB

Data RAM Size

-

Number of Logic Elements

23000 LE

Number of I/Os

108 I/O

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 100 C

Factory Pack QuantityFactory Pack Quantity

1

Package

Tray

厂商

微芯片技术

Product Status

活跃

包装

Tray

操作温度

-40°C ~ 100°C

系列

-

工作电源电压

1 V

速度

-

内存大小

230.4KB

核心处理器

RISC-V

周边设备

DMA, PCI, PWM

程序内存大小

-

连接方式

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

建筑学

MPU, FPGA

主要属性

FPGA - 23K Logic Modules

核数量

5 Core

闪光大小

128KB