Micron Technology Inc NAND98R3M0AZBB5E
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NAND98R3M0AZBB5E
1616-NAND98R3M0AZBB5E
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Memory Circuit, Flash SDRAM, PBGA107
1最小包装量--
NAND98R3M0AZBB5E详情
Micron Technology Inc NAND98R3M0AZBB5E重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
107
Rohs Code
有
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
Package Description
FBGA, BGA107,10X14,32
Operating Temperature-Max
85 °C
Operating Temperature-Min
-30 °C
Package Body Material
PLASTIC/EPOXY
Package Code
FBGA
Package Equivalence Code
BGA107,10X14,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
Supply Voltage-Nom (Vsup)
1.8 V
ECCN 代码
EAR99
HTS代码
8542.32.00.71
端子位置
BOTTOM
终端形式
BALL
端子间距
0.8 mm
Reach合规守则
compliant
JESD-30代码
R-PBGA-B107
资历状况
不合格
温度等级
OTHER
内存IC类型
存储器电路
混合内存类型
FLASH+SDRAM
NAND98R3M0AZBB5E拓展信息
Micron Technology Inc
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