Microsemi EDI88512CA-55CB

表面安装

NO

终端数量

32

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

512000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Access Time-Max

55 ns

Operating Temperature-Max

125 °C

Manufacturer Part Number

EDI88512CA55CB

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Mercury Systems Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MERCURY SYSTEMS INC

Risk Rank

5.58

ECCN 代码

3A001.A.2.C

HTS代码

8542.32.00.41

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-CDIP-T32

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

512KX8

座位高度-最大

3.937 mm

内存宽度

8

记忆密度

4194304 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM

宽度

15.24 mm

长度

40.64 mm