NXP Semiconductors 74HC175N

底架

通孔

表面安装

NO

引脚数

16

终端数量

16

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

HC

Number of Channels per Chip

4

Number of Elements per Chip

1

Number of Element Inputs

4

Number of Element Outputs

4

Bus Hold

无

Set/Reset

主复位

Triggering Type

Positive-Edge

Maximum Propagation Delay Time @ Maximum CL (ns)

30@6V|[email protected]|175@2V

Absolute Propagation Delay Time (ns)

265

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

5.2

Maximum High Level Output Current (mA)

-5.2

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

6

Maximum Quiescent Current (mA)

0.008

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Supplier Package

PDIP

Mounting

通孔

Package Height

3.2(Max)

Package Length

19.5(Max)

Package Width

6.48(Max)

PCB changed

16

RoHS

Compliant

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74HC175N

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

24000000 Hz

Risk Rank

5.69

JESD-609代码

e4

零件状态

Obsolete

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

最高工作温度

125 °C

最小工作温度

-40 °C

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

4

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-PDIP-T16

资历状况

不合格

极性

Inverting/Non-Inverting

电源

2/6 V

温度等级

INDUSTRIAL

最大电源电压

6 V

最小电源电压

2 V

比特数

1

传播延迟

175 ns

逻辑功能

D-Type Bus Interface

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.004 A

触发器类型

积极优势

宽度

6.48 mm

高度

3.2 mm

长度

19.5 mm

RoHS状态

供应商未确认

达到SVHC

无SVHC

无铅

无铅