NXP Semiconductors PBSS8510PA

表面安装

YES

Contact plating

gold-plated

Number of pins

13

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SON

Package Description

2 X 2 MM, 0.65 MM HEIGHT, ULTRA THIN, PLASTIC, LEADLESS, HUSON-3

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Package Style

小概要

Transition Frequency-Nom (fT)

150 MHz

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x13

Gross weight

1.24 g

Operating temperature

-40...163°C

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

TIN

端子位置

DUAL

终端形式

无铅

Reach合规守则

unknown

Current rating

1.5A

引脚数量

3

JESD-30代码

S-PDSO-N3

资历状况

不合格

配置

SINGLE

箱体转运

COLLECTOR

晶体管应用

SWITCHING

极性/通道类型

NPN

集电极电流-最大值(IC)

5.2 A

最小直流增益（hFE）

30

Rated voltage

60V

集电极-发射器电压-最大值

100 V

个人资料

beryllium copper

饱和电流

1

Plating thickness

0.75µm

Flammability rating

UL94V-0