NXP USA Inc. 74LVT374DB

表面安装

YES

终端数量

20

Package Style

SMALL OUTLINE, SHRINK PITCH

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP20,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74LVT374DB

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.72

Prop.

5.8 ns

子类别

FF/Latches

技术

BICMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

8

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G20

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.064 A

触发器类型

积极优势