ON Semiconductor MBRP20060CTG

表面安装

NO

二极管元件材料

SILICON

终端数量

2

ECCN (US)

EAR99

Maximum DC Reverse Voltage (V)

60

Peak Reverse Repetitive Voltage (V)

60

Maximum Continuous Forward Current (A)

200

Peak Non-Repetitive Surge Current (A)

1500

Peak Forward Voltage (V)

0.91

Peak Reverse Current (uA)

500

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Supplier Package

POWER TAP II

Military

无

Mounting

Screw

Package Height

16.26(Max)

Package Length

92.33(Max)

Package Width

20.57(Max)

PCB changed

3

Tab

Tab

Package Description

LEAD FREE, PLASTIC, CASE 357C-03, POWERTAP II, 2 PIN

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

CASE 357C-03

Reflow Temperature-Max (s)

40

Operating Temperature-Max

150 °C

Rohs Code

有

Manufacturer Part Number

MBRP20060CTG

Package Shape

RECTANGULAR

Manufacturer

安森美半导体

Number of Elements

2

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Forward Voltage-Max (VF)

0.91 V

Risk Rank

5.76

包装

Tray

零件状态

Obsolete

ECCN 代码

EAR99

类型

肖特基二极管

端子表面处理

Nickel (Ni)

应用

POWER

HTS代码

8541.10.00.80

子类别

研磨二极管

技术

SCHOTTKY

端子位置

UPPER

终端形式

UNSPECIFIED

峰值回流焊温度（摄氏度）

260

Reach合规守则

not_compliant

引脚数量

3

JESD-30代码

R-PUFM-X2

资历状况

不合格

配置

双共阴极

二极管类型

接收电极

箱体转运

CATHODE

输出电流-最大值

100 A

相位的数量

1

Rep Pk反向电压-最大值

60 V

最大非代表Pk前进电流

1500 A

RoHS状态

是,有豁免