Samsung Electronics M393A1G40EB2-CTD

ECCN (US)

EAR99

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

18

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1333

Chip Configuration

1Gx4

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

16

CAS Latency

19

SPD EEPROM Support

无

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

1.4 + 2.8(Max)

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

288RDIMM

RoHS状态

符合RoHS标准