Samsung Electronics M393A2K40BB1-CTD8Q

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2666

Chip Configuration

2Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

ECC Support

无

Number of Ranks

Single

CAS Latency

19

Standard Package Name

DIM

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.3(Max)

PCB changed

288

Lead Shape

Ball

引脚数量

288

组织结构

2Gx72

模块类型

288RDIMM

RoHS状态

符合RoHS标准