Samsung Electronics M393A2K43BB1-CPB

ECCN (US)

4A994.a

HTS

8473.30.11.40

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

18

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2133

Chip Configuration

1Gx8

Typical Operating Supply Voltage (V)

1.2

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

16

CAS Latency

15

零件状态

活跃

组织结构

2Gx72

模块类型

288RDIMM