Samsung Electronics M393A8K40B21-CTC

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

64Gbyte

Number of Chip per Module

36

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

3848

ECC Support

无

Number of Ranks

Quad

CAS Latency

17

Supplier Package

RDIMM

Mounting

Socket

Package Height

31.25

Package Length

133.35

Package Width

4.1(Max)

PCB changed

288

零件状态

活跃

引脚数量

288

组织结构

8Gx72

模块类型

288RDIMM

RoHS状态

符合RoHS标准