Samsung Electronics M393B1G73EB0-YK0

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Mounting

Socket

Supplier Package

RDIMM

SPD EEPROM Support

有

CAS Latency

11

Number of Chip Banks

8

Number of Ranks

Dual

ECC Support

无

Module Sides

Double

Maximum Operating Temperature (°C)

95

Minimum Operating Temperature (°C)

0

Operating Current (mA)

1160

Maximum Operating Supply Voltage (V)

1.45/1.575

Typical Operating Supply Voltage (V)

1.35/1.5

Minimum Operating Supply Voltage (V)

1.283/1.425

Chip Configuration

512Mx8

Maximum Clock Rate (MHz)

1600

Data Bus Width (bit)

72

Chip Density (bit)

4G

Number of Chip per Module

18

Module Density

8Gbyte

Module

DRAM模块

HTS

8473.30.11.40

ECCN (US)

4A994.a

零件状态

活跃

引脚数量

240

组织结构

1Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM

RoHS状态

符合RoHS标准