Samsung Electronics M393B2G70EB0-YK0Q2

ECCN (US)

4A994.a

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1600

Chip Configuration

1Gx4

Minimum Operating Supply Voltage (V)

1.283/1.425

Typical Operating Supply Voltage (V)

1.35/1.5

Maximum Operating Supply Voltage (V)

1.45/1.575

Operating Current (mA)

1890

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

SPD EEPROM Support

有

Standard Package Name

DIMM

Supplier Package

RDIMM

Mounting

Socket

Package Height

30

Package Length

133.35

Package Width

4(Max)

PCB changed

240

Lead Shape

No Lead

Maximum Clock Rate

1600(MHz)

Operating Temperature (Max.)

95C

Total Density

16GByte(b)

Operating Temperature Classification

Commercial

Package Type

RDIMM

Operating Temp Range

0C to 95C

Number of Elements

36

Device Core Size

72(b)

Operating Supply Voltage (Max)

1.45/1.575(V)

Operating Supply Voltage (Typ)

1.35/1.5(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.283/1.425(V)

Operating Temperature (Min.)

0C

Main Category

DRAM模块

零件状态

活跃

引脚数量

240

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM

RoHS状态

符合RoHS标准