Samsung Electronics M470T6464EHS-CE7

PCB changed

200

Lead Shape

No Lead

Minimum Operating Supply Voltage (V)

1.7

Chip Package Type

FBGA

Chip Configuration

64Mx16

Maximum Clock Rate (MHz)

800

Max. Access Time (ns)

0.4

Data Bus Width (bit)

64

Chip Density (bit)

1G

Number of Chip per Module

4

Module Density

512Mbyte

Module

DRAM模块

ECCN (US)

4A994.a

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Operating Current (mA)

480

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Supplier Temperature Grade

Commercial

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

5

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

USODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

Package Width

3.8(Max)

零件状态

Obsolete

引脚数量

200

组织结构

64Mx64

锁相环

无

自我刷新

有

模块类型

200SODIMM

RoHS状态

符合RoHS标准