Samsung Semiconductor K4D26323QG-VC2AT

表面安装

YES

终端数量

144

Manufacturer Part Number

K4D26323QG-VC2AT

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA, BGA144,12X12,32

Risk Rank

5.75

Access Time-Max

0.55 ns

Clock Frequency-Max (fCLK)

350 MHz

Number of Words

4194304 words

Number of Words Code

4000000

Operating Temperature-Max

65 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA144,12X12,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B144

资历状况

不合格

电源

1.8 V

温度等级

COMMERCIAL

电源电流-最大值

0.44 mA

组织结构

4MX32

输出特性

3-STATE

内存宽度

32

待机电流-最大值

0.01 A

记忆密度

134217728 bit

I/O类型

COMMON

内存IC类型

DDR DRAM

刷新周期

4096

顺序突发长度

2,4,8

交错突发长度

2,4,8