Samsung Semiconductor M378B1G73BH0-CK0

EU RoHS

Compliant

ECCN (US)

4A994.a

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

8Gbyte

Number of Chip per Module

16

Chip Density (bit)

4G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.225

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1040

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

SPD EEPROM Support

有

Mounting

Socket

Package Height

30

Package Width

4(Max)

Package Length

133.35

PCB changed

240

Supplier Package

UDIMM

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

1Gx64

锁相环

无

自我刷新

有

模块类型

240UDIMM