Samsung Semiconductor M395T2863QZ4-CE66

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

9

Chip Density (bit)

1G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

667

Chip Configuration

128Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Module Sides

Double

ECC Support

有

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

5

PC Type

PC2-5300

SPD EEPROM Support

有

Mounting

Socket

Package Height

30.35

Package Width

8.2(Max)

Package Length

133.35

PCB changed

240

Supplier Package

FBDIMM

ECCN (US)

EAR99

EU RoHS

Compliant

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

128Mx72

锁相环

有

自我刷新

有

模块类型

240FBDIMM