Samsung Semiconductor M393B2G70DB0-YK0

EU RoHS

Compliant

ECCN (US)

4A994.a

HTS

8473.30.11.40

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

16Gbyte

Number of Chip per Module

36

Chip Density (bit)

4G

Data Bus Width (bit)

72

Max. Access Time (ns)

0.225

Maximum Clock Rate (MHz)

1600

Chip Configuration

1Gx4

Chip Package Type

78FBGA

Minimum Operating Supply Voltage (V)

1.283

Typical Operating Supply Voltage (V)

1.35

Maximum Operating Supply Voltage (V)

1.45

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Double

ECC Support

无

Number of Ranks

Dual

Number of Chip Banks

8

CAS Latency

11

SPD EEPROM Support

有

零件状态

Obsolete

组织结构

2Gx72

锁相环

无

自我刷新

有

模块类型

240RDIMM