Samsung Semiconductor M378B5773CH0-CH900

EU RoHS

Compliant

ECCN (US)

4A994.a

Automotive

无

PPAP

无

Module

DRAM模块

Module Density

2Gbyte

Number of Chip per Module

8

Chip Density (bit)

2G

Data Bus Width (bit)

64

Max. Access Time (ns)

0.255

Maximum Clock Rate (MHz)

1333

Chip Configuration

256Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.425

Typical Operating Supply Voltage (V)

1.5

Maximum Operating Supply Voltage (V)

1.575

Operating Current (mA)

1120

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Module Sides

Single

ECC Support

无

Number of Ranks

Single

Number of Chip Banks

8

CAS Latency

9

SPD EEPROM Support

有

Mounting

Socket

Package Height

30

Package Width

4(Max)

Package Length

133.35

PCB changed

240

Supplier Package

UDIMM

Lead Shape

No Lead

零件状态

Obsolete

引脚数量

240

组织结构

256Mx64

锁相环

无

自我刷新

有

模块类型

240UDIMM