category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量			Core													厂商																														操作温度	包装	系列	JESD-609代码	无铅代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	工作电源电流	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	核心架构	阀门数量	速度等级	主要属性	逻辑块数量	逻辑单元数	核数量	等效门数	闪光大小
M2S025TS-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	Tray	M2S025	微芯片技术	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S025TS-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325	180	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.01 mm	现场可编程门阵列				FPGA - 25K Logic Modules		27696	1 Core		256KB	11 mm	11 mm
M2S060TS-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	207	Tray	M2S060	微芯片技术	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	1.14 V	85 °C	有	M2S060TS-1VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		40		S-PBGA-B400	207	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列				FPGA - 60K Logic Modules		56520	1 Core		256KB	17 mm	17 mm
M2S010TS-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	M2S010	微芯片技术	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010TS-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	195	Tray	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	195	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195		1.51 mm	现场可编程门阵列				FPGA - 10K Logic Modules		12084	1 Core		256KB	17 mm	17 mm
M2S060-1FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	40	SmartFusion2	387	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules			1 Core		256KB
M2S090-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	86316 LE	0 to 85 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 90K Logic Modules			1 Core		512KB
M2S050-1FG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	4695 LAB	27	1.2000 V	377	Tray	微芯片技术	M2S050	活跃	FBGA-896	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	85 °C	无	M2S050-1FG896	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	0 to 85 °C	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			896	S-PBGA-B896	377	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377		2.44 mm	现场可编程门阵列			1	FPGA - 50K Logic Modules		48672	1 Core		256KB	31 mm	31 mm
M2S090T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	0 to 85 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 90K Logic Modules			1 Core		512KB
M2S010TS-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	活跃	微芯片技术	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	85 °C	无	M2S010TS-VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138		1.56 mm	现场可编程门阵列				FPGA - 10K Logic Modules		12084	1 Core		256KB	14 mm	14 mm
MAX32655GXG T	Maxim Integrated	数据表	N/A	-	最小起订量: 1 最小包装量: 1	CTBGA-CU-81		Details		2500						Reel
A2F200M3F-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	161 I/O	0 C	+ 85 C	有	-	60	SmartFusion	微芯片技术	Tray	A2F200	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA484,26X26,40	1.5 V	30	1.425 V	85 °C	无	A2F200M3F-FG484	80 MHz	BGA	SQUARE	活跃	MICROSEMI CORP	1.575 V	5.24		N	SMD/SMT	80 MHz	-	-	64 kB	2000 LE	0°C ~ 85°C (TJ)	Tray	A2F200	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	225	1 mm	compliant				S-PBGA-B484	94	不合格		1.5,1.8,2.5,3.3 V	OTHER		2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	94	4608 CLBS, 200000 GATES	2.44 mm	现场可编程门阵列		200000	STD	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB	23 mm	23 mm
A2F500M3G-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	A2F500	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	100 MHz	-	-	64 kB	6000 LE	204 I/O	0 C	+ 85 C	有	-	SmartFusion	60	1.5000 V	1.425 V	1.575 V	Tray	0 to 85 °C	Tray	A2F500																								1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA						500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			1 Core		512KB
A2F500M3G-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	SMD/SMT	ARM Cortex M3	100 MHz	-	-	64 kB	6000 LE	204 I/O	- 40 C	+ 100 C	有	-	60	SmartFusion	微芯片技术	1.5000 V	1.425 V	500000	500000	1.575 V	Tray	A2F500	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA484,26X26,40	-40 °C	1.5 V	30	1.425 V	100 °C	有	A2F500M3G-1FGG484I	100 MHz	BGA	SQUARE	活跃	MICROSEMI CORP	1.575 V	5.24		Details	-40 to 100 °C	Tray	A2F500	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	128	不合格	1.5 V	1.5,1.8,2.5,3.3 V	INDUSTRIAL		16.5 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	128	11520 CLBS, 500000 GATES	2.44 mm	现场可编程门阵列		500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520	1 Core	500000	512KB	23 mm	23 mm
A2F200M3F-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	2000 LE	161 I/O	- 40 C	+ 100 C	有	-	60	SmartFusion	微芯片技术	Tray	A2F200	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA484,26X26,40	-40 °C	1.5 V	30	1.425 V	100 °C	有	A2F200M3F-1FGG484I	100 MHz	BGA	SQUARE	活跃	MICROSEMI CORP	1.575 V	5.24		Details	SMD/SMT	100 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	A2F200	e1		Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant				S-PBGA-B484	94	不合格		1.5,1.8,2.5,3.3 V	INDUSTRIAL		1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	94	4608 CLBS, 200000 GATES	2.44 mm	现场可编程门阵列		200000		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB	23 mm	23 mm
A2F500M3G-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	N	SMD/SMT	80 MHz	-	-	64 kB	6000 LE	204 I/O	- 40 C	+ 100 C	有	-	60	SmartFusion	Tray	A2F500	活跃				This product may require additional documentation to export from the United States.	-40°C ~ 100°C (TJ)	Tray	A2F500																								2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA						500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			1 Core		512KB
M2S060TS-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	4710 LAB	60	SmartFusion2	活跃	M2S060	Tray	267				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 60K Logic Modules			1 Core		256KB
A2F500M3G-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	SMD/SMT	100 MHz	-	-	64 kB	6000 LE	204 I/O	- 40 C	+ 100 C	有	-	60	微芯片技术	SmartFusion	1.5000 V	1.425 V	1.575 V	Tray	A2F500	活跃	BGA, BGA484,26X26,40	网格排列	3	PLASTIC/EPOXY	5.24	1.575 V	MICROSEMI CORP	活跃	SQUARE	BGA	100 MHz	A2F500M3G-1FG484I	无	100 °C	1.425 V	20	1.5 V	-40 °C	BGA484,26X26,40		This product may require additional documentation to export from the United States.	N	-40 to 100 °C	Tray	A2F500	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	225	1 mm	compliant				S-PBGA-B484	128	不合格		1.5,1.8,2.5,3.3 V	INDUSTRIAL		1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	128	11520 CLBS, 500000 GATES	2.44 mm	现场可编程门阵列		500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520	1 Core	500000	512KB	23 mm	23 mm
A2F500M3G-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	有	-	60	SmartFusion	MCU - 41, FPGA - 128	Tray	A2F500	活跃				This product may require additional documentation to export from the United States.	Details	100 MHz	-	-	64 kB	6000 LE	-55°C ~ 125°C (TJ)	Tray	A2F500				125 °C	-55 °C									100 MHz									EBI/EMI, Ethernet, I2C, SPI, UART, USART		100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA					ARM			ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			1 Core		512KB
M2S150T-1FCG1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	-	64 kB	146124 LE	有	12177 LAB	24	1.2000 V	574	Tray	M2S150	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	0 to 85 °C	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1	FPGA - 150K Logic Modules			1 Core		512KB
M2S025-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	27696 LE	有	2308 LAB	90	207	Tray	M2S025	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								FPGA - 25K Logic Modules			1 Core		256KB
M2S090-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	Tray	M2S090	微芯片技术	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S090-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	267	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B484	267	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267		2.44 mm	现场可编程门阵列				FPGA - 90K Logic Modules		86316	1 Core		512KB	23 mm	23 mm
M2S025TS-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	Tray	M2S025	微芯片技术	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S025TS-1VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	90	207	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B400	207	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列				FPGA - 25K Logic Modules		27696	1 Core		256KB	17 mm	17 mm
M2S010T-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	138	Tray	M2S010	微芯片技术	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	85 °C	无	M2S010T-1VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138		1.56 mm	现场可编程门阵列				FPGA - 10K Logic Modules		12084	1 Core		256KB	14 mm	14 mm
M2S060TS-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S060TS-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	200	Tray	M2S060	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	240	0.5 mm	not_compliant				S-PBGA-B325								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			1.01 mm	现场可编程门阵列				FPGA - 60K Logic Modules			1 Core		256KB	11 mm	11 mm
M2S090T-FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	Tray	M2S090	活跃	微芯片技术	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090T-FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0		Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425		2.44 mm	现场可编程门阵列				FPGA - 90K Logic Modules		86316	1 Core		512KB	27 mm	27 mm
M2S010S-TQG144	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	0 C	+ 85 C	400 kbit	1007 LAB	60	1.2000 V	Tray	M2S010	活跃				This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2																				1.2 V					166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							STD	FPGA - 10K Logic Modules			1 Core		256KB