类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 外部中断数量 | 长度 | 宽度 | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SC2200UFH-266BF | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 481 | LEAD FREE, MS-034BAU-1, BGU-481 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | HBGA | BGA481,31X31,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.89 V | 1.71 V | 1.8 V | 有 | Obsolete | ADVANCED MICRO DEVICES INC | BGA | e2 | 3A991.A.1 | 锡银 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 481 | S-PBGA-B481 | 不合格 | OTHER | 266 MHz | MICROPROCESSOR | 32 | 2.59 mm | 32 | YES | YES | 32 | 浮点 | YES | 40 mm | 40 mm | |||||||||||||
![]() | NSC800TD-4-MIL | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NSC800TD-4-MIL | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, | 8 MHz | 90 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | 不合格 | OTHER | 4 MHz | MICROPROCESSOR | 8 | 5.08 mm | 16 | NO | YES | 8 | 固定点 | NO | 15.24 mm | |||||||||||||||||||||||
![]() | APM883208-SNC24X1T | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EE80C188EA25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | CHIP CARRIER | 5 V | 有 | Obsolete | INTEL CORP | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 25 MHz | MICROPROCESSOR, RISC | 105 mA | 16 | ||||||||||||||||||||||||||||||||
![]() | MC68HC001FC10 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | FLATPACK | 5 V | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | BQFP, SPQFP68,.7SQ | 70 °C | PLASTIC/EPOXY | BQFP | SPQFP68,.7SQ | SQUARE | e0 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 0.635 mm | unknown | S-PQFP-G68 | 不合格 | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | 30 mA | 32 | ||||||||||||||||||||||||||||||
![]() | UPD70433GJ-12-3EB | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 120 | FLATPACK | Obsolete | NEC ELECTRONICS CORP | QFP | , | PLASTIC/EPOXY | SQUARE | 8542.31.00.01 | QUAD | 鸥翼 | unknown | 120 | S-PQFP-G120 | 不合格 | MICROPROCESSOR | ||||||||||||||||||||||||||||||||||||||||
![]() | UPD8085AC-2 | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC1100UFH-233F | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 388 | HBGA, BGA388,26X26,50 | 27 MHz | 3 | 85 °C | PLASTIC/EPOXY | HBGA | BGA388,26X26,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.89 V | 1.71 V | 1.8 V | 有 | Obsolete | ADVANCED MICRO DEVICES INC | BGA | e2 | 3A991.A.2 | 锡银 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 388 | S-PBGA-B388 | 不合格 | OTHER | 233 MHz | MICROPROCESSOR | 32 | 2.59 mm | 13 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||
![]() | MC6800CLD | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | RECTANGULAR | IN-LINE | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP40,.6 | 85 °C | -40 °C | CERAMIC | DIP | DIP40,.6 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | INDUSTRIAL | 1 MHz | MICROPROCESSOR, RISC | 8 | ||||||||||||||||||||||||||||||||
![]() | OSA248FAA5BL | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 940 | PGA | SPGA, PGA940,31X31,50 | PLASTIC/EPOXY | SPGA | PGA940,31X31,50 | SQUARE | GRID ARRAY, SHRINK PITCH | Obsolete | ADVANCED MICRO DEVICES INC | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 1.27 mm | unknown | 940 | S-PPGA-P940 | 不合格 | 2200 MHz | MICROPROCESSOR, RISC | 64 | ||||||||||||||||||||||||||||||||||
![]() | TMPR4938XBG-333 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 133.3 MHz | 70 °C | PLASTIC/EPOXY | BGA | BGA484,26X26,50 | SQUARE | 网格排列 | 1.6 V | 1.4 V | 1.5 V | 有 | Obsolete | TOSHIBA CORP | BGA | BGA, BGA484,26X26,50 | 有 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1.27 mm | unknown | 未说明 | 484 | S-PBGA-B484 | 不合格 | COMMERCIAL | 333 MHz | MICROPROCESSOR, RISC | 64 | 2.46 mm | 20 | YES | YES | 64 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||
![]() | AV8062701147401 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1284 | Obsolete | INTEL CORP | HBGA, | 100 MHz | PLASTIC/EPOXY | HBGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.52 V | 0.3 V | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | 1.106 mm | compliant | S-PBGA-B1284 | 1500 MHz | MICROPROCESSOR | 64 | 16 | YES | YES | 64 | 固定点 | YES | 37.5 mm | 37.5 mm | |||||||||||||||||||||||||||
![]() | EM78P142SS10J | ELAN Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | ELAN MICROELECTRONICS CORP | , | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HM1-6100-2 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | 无 | Obsolete | INTERSIL CORP | 125 °C | -55 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T40 | 不合格 | MILITARY | 2.5 MHz | MICROPROCESSOR, RISC | 12 | |||||||||||||||||||||||||||||||
![]() | PPC460EX-NUB800T | MACOM | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 728 | PLASTIC/EPOXY | -40 °C | 85 °C | 100 MHz | 35 X 35 MM, ROHS COMPLIANT, PLASTIC, MS-034, TEEBGA-728 | M/A-COM TECHNOLOGY SOLUTIONS INC | Obsolete | 有 | 网格排列 | 1.3 V | 1.2 V | 1.25 V | SQUARE | BGA | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | S-PBGA-B728 | INDUSTRIAL | 800 MHz | MICROPROCESSOR, RISC | 2.65 mm | 32 | YES | YES | 32 | 浮点 | YES | 35 mm | 35 mm | ||||||||||||||||||||
![]() | R65C02P3 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | 3 MHz | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | 康讯系统 | DIP | DIP, DIP40,.6 | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | 不合格 | COMMERCIAL | 3 MHz | MICROPROCESSOR | 12 mA | 8 | 5.08 mm | 16 | NO | YES | 8 | 固定点 | NO | 0 | 2 | 52.07 mm | 15.24 mm | ||||||||||||||
![]() | XPC823ZT25Z3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | Obsolete | NXP SEMICONDUCTORS | BGA, | 70 °C | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | 固定点 | YES | ||||||||||||||||||||||||||||||||||
![]() | XPC823ZT25Z3 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | Transferred | FREESCALE SEMICONDUCTOR INC | BGA, | 70 °C | 8542.31.00.01 | BOTTOM | BALL | unknown | S-PBGA-B256 | COMMERCIAL | 25 MHz | MICROPROCESSOR | 32 | YES | YES | 固定点 | YES | ||||||||||||||||||||||||||||||||||
![]() | IDT79R3000-20G | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 144 | CERAMIC | PGA | PGA144,15X15 | SQUARE | 网格排列 | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | PGA, PGA144,15X15 | 80 MHz | 70 °C | e0 | 无 | 3A991.A.2 | 锡铅 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | not_compliant | S-XPGA-P144 | 不合格 | COMMERCIAL | 20 MHz | MICROPROCESSOR, RISC | 650 mA | 32 | 32 | NO | 32 | 固定点 | |||||||||||||||||||||
![]() | GX2-X28-TD | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 368 | 网格排列 | 活跃 | ADVANCED MICRO DEVICES INC | PLASTIC/EPOXY | BGA | BGA368,26X26,50 | SQUARE | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-PBGA-B368 | 不合格 | 366 MHz | MICROPROCESSOR, RISC | 32 | ||||||||||||||||||||||||||||||||||||||
![]() | XPC8240RZU250D | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | PLASTIC/EPOXY | 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 | FREESCALE SEMICONDUCTOR INC | Obsolete | 网格排列 | SQUARE | BGA352,26X26,50 | BGA | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B352 | 不合格 | 2.5,3.3 V | 250 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||
![]() | SAA7215HS/C2 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 无 | Transferred | 飞利浦半导体 | QFP, QFP208,1.2SQ,20 | PLASTIC/EPOXY | QFP | QFP208,1.2SQ,20 | SQUARE | FLATPACK | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G208 | 不合格 | 消费电路 | |||||||||||||||||||||||||||||||||||
![]() | MPC8572EPXARLE | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1023 | 105 °C | MPC8572EPXARLE | 133 MHz | BGA | SQUARE | 恩智浦半导体 | Obsolete | NXP SEMICONDUCTORS | 1.155 V | 5.69 | BGA, | 网格排列 | PLASTIC/EPOXY | 1.1 V | 1.045 V | 5A002.A | 8542.31.00.01 | CMOS | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1023 | OTHER | 1067 MHz | MICROPROCESSOR, RISC | 32 | 3.38 mm | 16 | YES | YES | 64 | 固定点 | YES | 33 mm | 33 mm | |||||||||||||||||||
![]() | XTDA3SXXBABFRQ1 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
SC2200UFH-266BF
AMD
分类:Embedded - Microprocessors
NSC800TD-4-MIL
National Semiconductor Corporation
分类:Embedded - Microprocessors
NSC800TD-4-MIL
Texas Instruments
分类:Embedded - Microprocessors
APM883208-SNC24X1T
Applied Micro Circuits Corporation
分类:Embedded - Microprocessors
EE80C188EA25
Intel Corporation
分类:Embedded - Microprocessors
MC68HC001FC10
Freescale Semiconductor
分类:Embedded - Microprocessors
UPD70433GJ-12-3EB
NEC Electronics Group
分类:Embedded - Microprocessors
UPD8085AC-2
NEC Electronics Group
分类:Embedded - Microprocessors
SC1100UFH-233F
AMD
分类:Embedded - Microprocessors
MC6800CLD
Freescale Semiconductor
分类:Embedded - Microprocessors
OSA248FAA5BL
AMD
分类:Embedded - Microprocessors
TMPR4938XBG-333
Toshiba America Electronic Components
分类:Embedded - Microprocessors
AV8062701147401
Intel Corporation
分类:Embedded - Microprocessors
EM78P142SS10J
ELAN Microelectronics Corp
分类:Embedded - Microprocessors
HM1-6100-2
Intersil Corporation
分类:Embedded - Microprocessors
PPC460EX-NUB800T
MACOM
分类:Embedded - Microprocessors
R65C02P3
Conexant Systems Inc
分类:Embedded - Microprocessors
XPC823ZT25Z3
NXP Semiconductors
分类:Embedded - Microprocessors
XPC823ZT25Z3
Freescale Semiconductor
分类:Embedded - Microprocessors
IDT79R3000-20G
Integrated Device Technology Inc
分类:Embedded - Microprocessors
GX2-X28-TD
AMD
分类:Embedded - Microprocessors
XPC8240RZU250D
Freescale Semiconductor
分类:Embedded - Microprocessors
SAA7215HS/C2
Philips Semiconductors
分类:Embedded - Microprocessors
MPC8572EPXARLE
NXP
分类:Embedded - Microprocessors
XTDA3SXXBABFRQ1
Texas Instruments
分类:Embedded - Microprocessors
