Microchip的FPGA 评估板_正品采购_价格信息

品牌是'Microchip' (371)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	底架	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	质量	终端数量															厂商																																	操作温度	包装	系列	JESD-609代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	最大电源电压	最小电源电压	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	数据率	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	产品类别	总 RAM 位数	阀门数量	速度等级	收发器数量
M2S090TS-1FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	40	1.2000 V	267	Tray	M2S090	活跃	-	166 MHz	86316 LE	SMD/SMT	-	64 kB	1.14 V						M2S090TS-1FGG484I	有	活跃	MICROSEMI CORP	FBGA-484	5.8	3	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	网格排列	1.26 V	1.2 V	-40 to 100 °C		SmartFusion®2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	267	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	267		2.44 mm	现场可编程门阵列						1		FPGA - 90K Logic Modules			86316	1 Core		512KB			23 mm	23 mm
M2GL005-1FGG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	1.14 V				M2GL005-1FGG484	有	活跃	MICROSEMI CORP	23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484	5.3	3	85 °C	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	网格排列	1.26 V	1.2 V	30	209	Compliant	Tray	M2GL005	活跃	0°C ~ 85°C (TJ)		IGLOO2			85 °C	0 °C		8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	260	1 mm	compliant		S-PBGA-B484	209	不合格		1.2 V	OTHER				87.9 kB							209		2.44 mm	现场可编程门阵列	6060		719872								6060						23 mm	23 mm
M2GL090-1FGG676	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	Compliant	Tray	M2GL090	活跃	86184 LE	+ 85 C	0 C	SMD/SMT	1.14 V				1.26 V	1.2 V	30	M2GL090-1FGG676	有	活跃	MICROSEMI CORP	BGA, BGA676,26X26,40	5.27	3	85 °C	PLASTIC/EPOXY	BGA	BGA676,26X26,40	SQUARE	网格排列	425	0°C ~ 85°C (TJ)		IGLOO2			85 °C	0 °C		8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	260	1 mm	compliant		S-PBGA-B676	425	不合格	1.2 V	1.2 V	OTHER				323.3 kB							425		2.44 mm	现场可编程门阵列	86316		2648064								86316						27 mm	27 mm
M2S150T-FCVG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	微芯片技术	1.14 V						M2S150T-FCVG484	有	活跃	MICROSEMI CORP	VFBGA-484	5.77	4	85 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	1.26 V	1.2 V	40	273	Tray	M2S150	活跃	0°C ~ 85°C (TJ)		SmartFusion®2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01			BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B484	273	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	273		3.15 mm	现场可编程门阵列								FPGA - 150K Logic Modules			146124			512KB			19 mm	19 mm
M2S060-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325	325-FCBGA (11x11)	325	MICROSEMI CORP	FBGA-325	微芯片技术	5.79	1.2000 V	1.14 V	1.26 V	200	Tray	M2S060	活跃	Compliant	-	166 MHz	56520 LE	+ 100 C	- 40 C	-	64 kB	1.14 V				3	PLASTIC/EPOXY	TFBGA	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.26 V	1.2 V	40	M2S060-FCSG325I	有	活跃	-40 to 100 °C		SmartFusion®2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C	LG-MIN, WD-MIN	8542.39.00.01			BOTTOM	BALL	250	0.5 mm	compliant		S-PBGA-B325	200	不合格	1.2 V	1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	200		1.01 mm	现场可编程门阵列						STD		FPGA - 60K Logic Modules			56520	1 Core		256KB			11 mm	11 mm
M2GL050-1FGG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	1.14 V				M2GL050-1FGG484	有	活跃	MICROSEMI CORP	23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484	5.3	3	85 °C	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	网格排列	1.26 V	1.2 V	30	267	Compliant	Tray	M2GL050	活跃	0°C ~ 85°C (TJ)		IGLOO2			85 °C	0 °C		8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	260	1 mm	compliant		S-PBGA-B484	267	不合格		1.2 V	OTHER				228.3 kB							267		2.44 mm	现场可编程门阵列	56340		1869824								56340						23 mm	23 mm
M1AGLE3000V5-FG896I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	表面贴装	YES	896	400.011771 mg	896	无	Obsolete	MICROSEMI CORP	FBGA-896	5.88	3	85 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.575 V		1.5 V	20	620	Compliant	1.425 V				M1AGLE3000V5-FG896I				e0	Tin/Lead (Sn/Pb)	85 °C	-40 °C		8542.39.00.01			BOTTOM	BALL	225	1 mm	unknown		S-PBGA-B896		不合格	1.5 V		INDUSTRIAL	1.575 V	1.425 V		63 kB								75264 CLBS, 3000000 GATES	2.44 mm	现场可编程门阵列	75264			3e+06	892.86 MHz				75264	75264			3000000			1.73 mm	29 mm	29 mm	无
M2S060T-FGG676	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	40	Non-Compliant	387	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB	1.14 V					M2S060T-FGG676	有	活跃	MICROSEMI CORP	BGA, BGA676,26X26,40	5.81	3	85 °C	PLASTIC/EPOXY	BGA	BGA676,26X26,40	SQUARE	网格排列	1.26 V	1.2 V	0°C ~ 85°C (TJ)		SmartFusion®2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B676	387	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	387		2.44 mm	现场可编程门阵列								FPGA - 60K Logic Modules			56520	1 Core		256KB			27 mm	27 mm
M2GL005-VFG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	BGA-256	YES	256-FPBGA (14x14)	256	3	85 °C	PLASTIC/EPOXY	LFBGA	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	1.26 V	微芯片技术	1.14 V	1.2 V	30	有	This product may require additional documentation to export from the United States.	703 kbit	6060 LE	161 I/O	+ 85 C	0.025037 oz	0 C	119	SMD/SMT	505 LAB	Microchip Technology / Atmel	340 MHz	IGLOO2	Details	Tray	M2GL005	活跃					M2GL005-VFG256	有	活跃	MICROSEMI CORP	LFBGA,	5.27	FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray	0°C ~ 85°C (TJ)	Tray	M2GL005						8542.39.00.01	可编程逻辑集成电路	1.14V ~ 2.625V	BOTTOM	BALL	260	0.8 mm	compliant		S-PBGA-B256			1.2 V		OTHER									-				1.56 mm	现场可编程门阵列	6060	FPGA - Field Programmable Gate Array	719872			STD	-								FPGA - Field Programmable Gate Array	14 mm	14 mm
M2GL025-VFG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	256-LFBGA	YES	256-FPBGA (14x14)	256	GRID ARRAY, LOW PROFILE, FINE PITCH	1.26 V	微芯片技术	1.2 V	30	138	Tray	M2GL025	活跃	有	27696 LE	+ 85 C	0 C	119	SMD/SMT	Microchip Technology / Atmel	IGLOO2	Details	1.14 V					M2GL025-VFG256	有	活跃	MICROSEMI CORP	14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256	5.26	IC FPGA 138 I/O 256FBGA	3	85 °C	PLASTIC/EPOXY	LFBGA	SQUARE	0°C ~ 85°C (TJ)	Tray	IGLOO2						8542.39.00.01	可编程逻辑集成电路	1.14V ~ 2.625V	BOTTOM	BALL	260	0.8 mm	compliant		S-PBGA-B256			1.2 V		OTHER									667 Mb/s				1.56 mm	现场可编程门阵列	27696	FPGA - Field Programmable Gate Array	1130496			STD	2 Transceiver								FPGA - Field Programmable Gate Array		14 mm	14 mm
M2S010-VFG400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	3	PLASTIC/EPOXY	LFBGA	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	1.26 V	1.2 V	微芯片技术	40	2.5, 3.3 V	MSL 3 - 168 hours	有	This product may require additional documentation to export from the United States.	-	166 MHz	12084 LE	0.236569 oz	90	SMD/SMT	1007 LAB	Microchip Technology / Atmel	Details	-	64 kB	195	Tray	M2S010	活跃	1.14 V						M2S010-VFG400I	有	活跃	MICROSEMI CORP	VFBGA-400	5.73	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B400	195	不合格		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	195		1.51 mm	现场可编程门阵列		SoC FPGA	400Kbit			STD		FPGA - 10K Logic Modules			12084	1 Core		256KB	SoC FPGA	17 mm	17 mm
M1A3PE3000L-FG896I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	896-BGA	YES	896-FBGA (31x31)	896	微芯片技术	1.2 V	30	1.2000 V	1.14 V	1.26 V	620	Tray	M1A3PE3000	活跃	1.14 V					M1A3PE3000L-FG896I	无	活跃	MICROSEMI CORP	BGA, BGA896,30X30,40	5.3	350 MHz	3	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA896,30X30,40	SQUARE	网格排列	1.575 V	-40 to 85 °C		ProASIC3L	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		1.14V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant	896	S-PBGA-B896	620	不合格		1.5/3.3 V	INDUSTRIAL											620	75264 CLBS, 3000000 GATES	2.44 mm	现场可编程门阵列			516096	3000000		STD				75264	75264		3000000				31 mm	31 mm
M1AGLE3000V5-FG896	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	表面贴装	YES	896	400.011771 mg	896	MICROSEMI CORP	FBGA-896	5.88	3	70 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.575 V	1.5 V		20	620	Compliant	1.425 V				M1AGLE3000V5-FG896	无	Obsolete				e0	Tin/Lead (Sn/Pb)	70 °C	0 °C		8542.39.00.01			BOTTOM	BALL	225	1 mm	unknown		S-PBGA-B896		不合格	1.5 V		COMMERCIAL	1.575 V	1.425 V		63 kB								75264 CLBS, 3000000 GATES	2.44 mm	现场可编程门阵列	75264			3e+06	892.86 MHz				75264	75264			3000000			1.73 mm	29 mm	29 mm	无
M1AGL600V5-FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	表面贴装	YES	400.011771 mg	484				M1AGL600V5-FGG484I	有	Obsolete	MICROSEMI CORP	BGA,	5.81	108 MHz	3	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列		1.575 V	1.5 V	40	235	Compliant	1.425 V					e1	锡银铜	85 °C	-40 °C		8542.39.00.01			BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484		不合格	1.5 V		INDUSTRIAL	1.575 V	1.425 V		13.5 kB								13824 CLBS, 600000 GATES	2.44 mm	现场可编程门阵列	13824			600000						13824			600000			1.73 mm	23 mm	23 mm
M1A3PE3000L-FG896	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	896-BGA	YES	896-FBGA (31x31)	896	微芯片技术	1.2000 V	1.14 V	1.26 V	620	Tray	M1A3PE3000	活跃	1.14 V					M1A3PE3000L-FG896	无	活跃	MICROSEMI CORP	31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896	5.3	350 MHz	3	70 °C	PLASTIC/EPOXY	BGA	BGA896,30X30,40	SQUARE	网格排列	1.575 V	1.2 V	30	0 to 70 °C		ProASIC3L	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		1.14V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant	896	S-PBGA-B896	620	不合格		1.5/3.3 V	COMMERCIAL											620	75264 CLBS, 3000000 GATES	2.44 mm	现场可编程门阵列			516096	3000000		STD				75264	75264		3000000				31 mm	31 mm
M1AFS1500-1FG676I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	1.575 V	252	Tray	M1AFS1500	活跃	1.425 V					M1AFS1500-1FG676I	无	活跃	MICROSEMI CORP	BGA,	5.3	3	85 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.575 V	1.5 V	30	1.5000 V	1.425 V	-40 to 85 °C		Fusion®	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant		S-PBGA-B676		不合格			INDUSTRIAL												38400 CLBS, 1500000 GATES	2.44 mm	现场可编程门阵列			276480	1500000		1				38400			1500000				25 mm	25 mm
M1A3P1000L-FGG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484						M1A3P1000L-FGG484	有	Obsolete	MICROSEMI CORP	BGA, BGA484,22X22,40	5.27	350 MHz	3	70 °C	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	网格排列		1.575 V	1.2 V	40	1.14 V						e1	锡银铜				8542.39.00.01			BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	300	不合格		1.5/3.3 V	COMMERCIAL											300	24576 CLBS, 1000000 GATES	2.44 mm	现场可编程门阵列										24576	24576		1000000				23 mm	23 mm
M1AGL600V2-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	表面贴装	YES	484	400.011771 mg	484		M1AGL600V2-FG484I	无	Obsolete	MICROSEMI CORP	23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484	5.86	108 MHz	3	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列		1.575 V	1.14 V	1.2 V	30	235	Non-Compliant						e0	Tin/Lead (Sn/Pb)	85 °C	-40 °C		8542.39.00.01			BOTTOM	BALL	225	1 mm	compliant		S-PBGA-B484		不合格	1.5 V		INDUSTRIAL	1.575 V	1.14 V		13.5 kB								13824 CLBS, 600000 GATES	2.44 mm	现场可编程门阵列	13824			600000						13824			600000			1.73 mm	23 mm	23 mm
M2GL090TS-1FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	FBGA-484	YES	484-FPBGA (23x23)	484	1.26 V	1.2 V	微芯片技术	20	有	This product may require additional documentation to export from the United States.	86316	267 I/O	+ 100 C	0.627572 oz	- 40 C	60	SMD/SMT	Microchip Technology / Atmel	IGLOO2	N	Tray	M2GL090	活跃	1.14 V				M2GL090TS-1FG484I	无	活跃	MICROSEMI CORP	BGA, BGA484,22X22,40	5.3	3	PLASTIC/EPOXY	BGA	BGA484,22X22,40	SQUARE	网格排列	-40°C ~ 100°C (TJ)	Tray	M2GL090TS			100 °C	-40 °C		8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	240	1 mm	compliant		S-PBGA-B484	267	不合格	1.2 V	1.2 V					323.3 kB					667 Mb/s		267		2.44 mm	现场可编程门阵列	86316	FPGA - Field Programmable Gate Array	2648064				4 Transceiver				86316				FPGA - Field Programmable Gate Array		23 mm	23 mm
M2S010TS-1VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	微芯片技术	1.14 V	1.26 V	195	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	1.14 V						M2S010TS-1VF400I	无	活跃	MICROSEMI CORP	VFBGA-400	5.86	PLASTIC/EPOXY	LFBGA	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	1.26 V	1.2 V	30	1.2000 V	-40 to 100 °C		SmartFusion®2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01			BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400								166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA			1.51 mm	现场可编程门阵列						1		FPGA - 10K Logic Modules				1 Core		256KB			17 mm	17 mm
M2GL150TS-FCS536	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	微芯片技术	M2GL150TS-FCS536	无	活跃	MICROSEMI CORP	BGA,	5.27	85 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.26 V	1.14 V	1.2 V	20	293	Tray	M2GL150	活跃	Non-Compliant				0°C ~ 85°C (TJ)		IGLOO2						8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	240		compliant		S-PBGA-B536					OTHER														现场可编程门阵列	146124		5120000			STD
M1A3P400-1FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484				M1A3P400-1FG484I	无	Obsolete	MICROSEMI CORP	BGA,	5.25	3	100 °C	-40 °C	PLASTIC/EPOXY	BGA	SQUARE	网格排列	1.575 V		1.5 V	30	1.425 V								e0	Tin/Lead (Sn/Pb)				8542.39.00.01			BOTTOM	BALL	225	1 mm	compliant		S-PBGA-B484		不合格			INDUSTRIAL												9216 CLBS, 400000 GATES	2.44 mm	现场可编程门阵列										9216			400000				23 mm	23 mm
M2GL150TS-FC1152	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术	M2GL150	活跃	1.14 V				M2GL150TS-FC1152	无	活跃	MICROSEMI CORP	BGA, BGA1152,34X34,40	5.27	85 °C	PLASTIC/EPOXY	BGA	BGA1152,34X34,40	SQUARE	网格排列	1.26 V	1.2 V	20	1.14 V	1.26 V	Non-Compliant	574	Tray	0°C ~ 85°C (TJ)		IGLOO2						8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	240	1 mm	compliant		S-PBGA-B1152	574	不合格		1.2 V	OTHER											574		2.9 mm	现场可编程门阵列	146124		5120000			STD					146124						35 mm	35 mm
M2S150-1FCSG536	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	微芯片技术	M2S150-1FCSG536	293	Tray	M2S150	活跃	1.14 V	-	166 MHz	146124 LE	-	64 kB						40	1.2 V	1.26 V	网格排列	SQUARE	BGA536,30X30,20	BGA	PLASTIC/EPOXY	85 °C	3	5.77	FBGA-536	MICROSEMI CORP	活跃	有	0°C ~ 85°C (TJ)		SmartFusion®2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			BOTTOM	BALL	250		compliant		S-PBGA-B536	293	不合格		1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA	293			现场可编程门阵列								FPGA - 150K Logic Modules			146124	1 Core		512KB
M2GL050T-FG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术			SQUARE	网格排列	1.26 V	1.14 V	1.2 V	20	BGA484,22X22,40	BGA	PLASTIC/EPOXY	3	5.27	BGA, BGA484,22X22,40	MICROSEMI CORP	活跃	无	M2GL050T-FG484I	267	Tray	M2GL050	活跃			-40°C ~ 100°C (TJ)		IGLOO2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		1.14V ~ 2.625V	BOTTOM	BALL	240	1 mm	compliant		S-PBGA-B484	267	不合格		1.2 V												267		2.44 mm	现场可编程门阵列	56340		1869824			STD					56340						23 mm	23 mm

M2S090TS-1FGG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL005-1FGG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL090-1FGG676

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S150T-FCVG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S060-FCSG325I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL050-1FGG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AGLE3000V5-FG896I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S060T-FGG676

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL005-VFG256

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025-VFG256

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S010-VFG400I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1A3PE3000L-FG896I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AGLE3000V5-FG896

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AGL600V5-FGG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1A3PE3000L-FG896

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AFS1500-1FG676I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1A3P1000L-FGG484

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AGL600V2-FG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL090TS-1FG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S010TS-1VF400I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL150TS-FCS536

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1A3P400-1FG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL150TS-FC1152

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S150-1FCSG536

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL050T-FG484I

Microchip

分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)