N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

1.575 V

151

Tray

A3P250

活跃

有

3000 LE

微芯片技术

+ 85 C

1.575 V

1 oz

0 C

24

1.425 V

SMD/SMT

Microchip

Microchip Technology / Atmel

350 MHz

ProASIC3

Details

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P250-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Industrial grade

SMD

Thin-Film Directional Coupler

表面贴装

1.5000 V

1.425 V

-40 to 85 °C

Tray

ProASIC3

e3

Matte Tin (Sn)

8542.39.00.01

可编程逻辑集成电路

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

4

S-PQFP-G208

不合格

1.5 V

COMMERCIAL

-

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

36864

250000

Industrial

2

-

6144

250000

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

SMD

表面贴装

267

Tray

M2GL090

活跃

86184 LE

+ 125 C

1.2 V

- 55 C

1.2 V

SMD/SMT

-55 to 155 °C

IGLOO2

1.14V ~ 2.625V

2

温度传感器

Analog

1.2 V

86184

2648064

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

5.27

425

Tray

M2GL090

活跃

Non-Compliant

86316 LE

+ 100 C

1.26 V

- 40 C

1.14 V

SMD/SMT

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

20

无

M2GL090T-1FG676I

-40°C ~ 100°C (TJ)

IGLOO2

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

323.3 kB

667 Mb/s

425

2.44 mm

现场可编程门阵列

86316

2648064

4 Transceiver

86316

27 mm

27 mm

N/A

-

表面贴装

FBGA-256

YES

256-FPBGA (17x17)

256

SMD/SMT

-

微芯片技术

Microchip

Microchip Technology / Atmel

231 MHz

ProASIC3

Details

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

A3P400-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.31

AEC-Q200

有

5000 LE

55296 bit

178 I/O

+ 85 C

1.575 V

0 C

90

1.425 V

0°C ~ 85°C (TJ)

Tray

A3P400

e1

25 ppm/°C

1.62 kOhm

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

可编程逻辑集成电路

0.15 W

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

Sulfur Resistant, Precision

compliant

S-PBGA-B256

不合格

1.5 V

COMMERCIAL

3 mA

-

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

FPGA - Field Programmable Gate Array

55296

400000

STD

-

0.1

9216

400000

FPGA - Field Programmable Gate Array

1.62 mm

0.81 mm

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

有

2000 LE

36864 bit

158 I/O

+ 85 C

2.7 V

1.384339 oz

- 40 C

24

2.3 V

SMD/SMT

-

Microchip

Microchip Technology / Atmel

180 MHz

ProASICPLUS

Details

Tray

APA150

活跃

-40°C ~ 85°C (TA)

Tray

APA150

可编程逻辑集成电路

2.3V ~ 2.7V

2.5 V

5 mA

-

FPGA - Field Programmable Gate Array

36864

150000

STD

-

FPGA - Field Programmable Gate Array

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

5.3

158

Tray

APA075

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

30

2.3 V

70 °C

无

APA075-PQ208

180 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

0°C ~ 70°C (TA)

ProASICPLUS

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

COMMERCIAL

158

75000 GATES

4.1 mm

现场可编程门阵列

27648

75000

3072

75000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

微芯片技术

MICROSEMI CORP

2.7 V

5.3

158

Tray

APA150

Obsolete

0.50 MM PITCH, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

2.5 V

30

2.3 V

85 °C

无

APA150-PQ208I

180 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

-40°C ~ 85°C (TA)

ProASICPLUS

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G208

158

不合格

2.5,2.5/3.3 V

INDUSTRIAL

158

150000 GATES

4.1 mm

现场可编程门阵列

36864

150000

6144

150000

28 mm

28 mm

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

158

Tray

APA075

Obsolete

-40°C ~ 85°C (TA)

ProASICPLUS

2.3V ~ 2.7V

27648

75000

N/A

-

表面贴装

64-LQFP

64-TQFP (10x10)

微芯片技术

46

Tray

EX128

Obsolete

0°C ~ 70°C (TA)

EX

2.3V ~ 2.7V

256

6000

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

微芯片技术

MIL-PRF-55681

176

Tray

A42MX24

Obsolete

0°C ~ 70°C (TA)

MX

4.7 pF

3V ~ 3.6V, 4.75V ~ 5.25V

36000

1.4 mm

1.4 x 1.4 x 1.45

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

+ 100 C

1.575 V

0.014110 oz

- 40 C

160

微芯片技术

1.14 V

SMD/SMT

Microchip

Microchip Technology / Atmel

526.32 MHz, 892.86 MHz

IGLOOe

Details

Tray

AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

AGL600V2-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.25

0.1pF

1.2, 1.5 V

1.14 V

1.575 V

有

7000 LE

97 I/O

-40 to 85 °C

Tray

AGL600V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

2.5 pF

可编程逻辑集成电路

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

1.2 V to 1.5 V

INDUSTRIAL

-

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

FPGA - Field Programmable Gate Array

110592

600000

STD

-

13824

600000

FPGA - Field Programmable Gate Array

1.6 mm

1.52 x 0.76 x 0.91 mm

1.05 mm

13 mm

13 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

84

6.777889 g

MIL-PRF-55681/7

69

Non-Compliant

70 °C

0 °C

20 pF

5 V

5.25 V

3 V

547

6000

139 MHz

547

273

2 mm

2 x 1.25 x 1.3

3.68 mm

29.31 mm

29.31 mm

无

N/A

-

微芯片技术

1

Microchip

微芯片技术

N

A42MX16-CQ172B

活跃

MICROSEMI CORP

5.74

MIL-PRF-55681

131

Tray

Discontinued at Digi-Key

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

MX

0.001 uF

可编程逻辑集成电路

3V ~ 3.6V, 4.5V ~ 5.5V

compliant

现场可编程门阵列

FPGA - Field Programmable Gate Array

24000

FPGA - Field Programmable Gate Array

2.03 mm

2.03 x 1.27 x 1.4

N/A

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

5.29

81

Tray

EX256

Obsolete

TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

2.5 V

30

2.3 V

85 °C

无

EX256-TQ100I

250 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.7 V

-40°C ~ 85°C (TA)

EX

e0

Tin/Lead (Sn/Pb)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

225

0.5 mm

unknown

S-PQFP-G100

INDUSTRIAL

12000 GATES

1.6 mm

现场可编程门阵列

512

12000

1 ns

12000

14 mm

14 mm

N/A

-

表面贴装

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

微芯片技术

LCC

57

Tray

A40MX02

Obsolete

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A40MX02-2PL68

101 MHz

QCCJ

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

3.6 V

5.25

0°C ~ 70°C (TA)

MX

e0

Tin/Lead (Sn/Pb)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

QUAD

J BEND

225

1.27 mm

compliant

68

S-PQCC-J68

不合格

COMMERCIAL

295 CLBS, 3000 GATES

4.572 mm

现场可编程门阵列

3000

2 ns

295

3000

24.2316 mm

24.2316 mm

N/A

-

表面贴装

Axial

YES

Axial

100

微芯片技术

5.91

68

Tray

A3PN250

Obsolete

14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

1.5 V

30

1.425 V

85 °C

无

A3PN250-Z1VQ100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

e0

活跃

2

±25ppm/°C

117 kOhms

锡铅

Metal Film

0.125W, 1/8W

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

68

不合格

S (0.001%)

1.5,1.5/3.3 V

INDUSTRIAL

68

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

36864

250000

6144

6144

250000

Military, Moisture Resistant, Weldable

--

14 mm

14 mm

N/A

-

表面贴装

81-WFBGA, CSBGA

YES

81-CSP (5x5)

81

微芯片技术

52

Tray

AGLN020

活跃

VFBGA,

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AGLN020V5-CSG81I

VFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.59

-40°C ~ 100°C (TJ)

IGLOO nano

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B81

不合格

INDUSTRIAL

520 CLBS, 20000 GATES

0.8 mm

现场可编程门阵列

520

20000

STD

520

20000

5 mm

5 mm

N/A

-

表面贴装

Axial

Axial

微芯片技术

170

Tray

活跃

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±1%

活跃

2

±50ppm/°C

815 kOhms

Metal Film

0.125W, 1/8W

0.97V ~ 1.08V

S (0.001%)

192000

13946061

Military, Moisture Resistant, Weldable

--

N/A

-

表面贴装

Axial

YES

Axial

64

微芯片技术

46

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

2.5 V

40

2.3 V

70 °C

有

EX128-TQG64

250 MHz

LFQFP

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

2.7 V

5.32

-65°C ~ 150°C

Tape & Reel (TR)

Military, MIL-PRF-39017/02, RLR20

0.138 Dia x 0.375 L (3.51mm x 9.53mm)

±1%

e3

活跃

2

±100ppm/°C

8.45 kOhms

Matte Tin (Sn)

Metal Film

0.5W, 1/2W

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G64

R (0.01%)

COMMERCIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

STD

1 ns

6000

Military, Moisture Resistant, Weldable

--

10 mm

10 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

144-LBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

3

8542310000/8542310000/8542310000/8542310000/8542310000

97

Compliant

Tray

A3P600

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

0.78

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

LBGA

350 MHz

A3P600L-FGG144

有

70 °C

1.14 V

40

1.2 V

BGA144,12X12,40

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

1.26 V

1.14 V

13.5 kB

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

781.25 MHz

STD

13824

13824

13824

600000

1.05 mm

13 mm

13 mm

无

无铅

N/A

-

表面贴装

Axial

YES

Axial

144

微芯片技术

5.25

100

Tray

A3P125

Obsolete

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

1.425 V

100 °C

无

A3P125-1TQ144I

350 MHz

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

-65°C ~ 150°C

Tape & Reel (TR)

Military, MIL-PRF-39017/05, RLR05

0.066 Dia x 0.150 L (1.68mm x 3.81mm)

±1%

e0

活跃

2

±100ppm/°C

118 Ohms

Tin/Lead (Sn/Pb)

Metal Film

0.125W, 1/8W

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G144

不合格

S (0.001%)

INDUSTRIAL

3072 CLBS, 125000 GATES

1.6 mm

现场可编程门阵列

36864

125000

3072

125000

Military, Moisture Resistant, Weldable

--

20 mm

20 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

484-BGA

YES

484

484-FPBGA (23x23)

484

微芯片技术

235

Compliant

Tray

A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

A3P600-FGG484I

350 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

1.35

-40°C ~ 100°C (TJ)

ProASIC3

e1

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

231 MHz

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

45 mA

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

6500

110592

600000

231 MHz

STD

13824

13824

600000

1.73 mm

23 mm

23 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

729-BBGA

YES

729

729-PBGA (35x35)

729

微芯片技术

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.26

1.5000 V

1.425 V

1.575 V

516

Compliant

Tray

AX1000

活跃

BGA, BGA729,27X27,50

网格排列

3

PLASTIC/EPOXY

BGA729,27X27,50

1.5 V

30

1.425 V

70 °C

无

AX1000-2BG729

870 MHz

BGA

0 to 70 °C

Axcelerator

e0

锡铅

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1.27 mm

unknown

870 MHz

729

S-PBGA-B729

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.54 mm

现场可编程门阵列

12096

165888

1e+06

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

35 mm

35 mm

无

N/A

-

表面贴装

144-LBGA

YES

144-FPBGA (13x13)

144

微芯片技术

LBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

3.6 V

5.24

3.3, 5 V

2.97, 4.75 V

3.63, 5.25 V

111

Tray

A54SX08

活跃

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

3.3 V

40

3 V

70 °C

有

A54SX08-FGG144

240 MHz

0 to 70 °C

SX

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

3V ~ 3.6V, 4.75V ~ 5.25V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

3.3,5 V

COMMERCIAL

111

768 CLBS, 8000 GATES

1.55 mm

现场可编程门阵列

12000

768

STD

0.9 ns

768

768

8000

13 mm

13 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

484-BGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

2.5000 V

2.3 V

2.7 V

344

Compliant

Tray

APA450

活跃

-40 to 85 °C

ProASICPLUS

85 °C

-40 °C

2.3V ~ 2.7V

180 MHz

2.5 V

2.7 V

2.3 V

13.5 kB

110592

450000

180 MHz

STD

12288

1.73 mm

23 mm

23 mm

无