N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

0.317680 oz

1.26 V

Tray

M2GL005

活跃

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL005-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

Details

6060 LE

209 I/O

1.14 V

-40°C ~ 100°C (TJ)

Tray

M2GL005

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

-

209

2.44 mm

现场可编程门阵列

6060

719872

STD

-

6060

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

176

IGLOO2

1.2 V

活跃

M2GL090

Tray

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090T-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

267 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060T-1FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

1

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

FPBGA-484

484-FPBGA (23x23)

微芯片技术

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

1.2 V

- 55 C

+ 125 C

SMD/SMT

有

60

IGLOO2

1.2 V

活跃

M2GL010

Tray

-55°C ~ 125°C (TJ)

Tray

M2GL010TS

1.2 V

12084

933888

4 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

195 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL010

活跃

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.73

This product may require additional documentation to export from the United States.

N

12084 LE

0°C ~ 85°C (TJ)

Tray

M2GL010

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

195

1.51 mm

现场可编程门阵列

12084

933888

STD

12084

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090T-FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL090T

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL010

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

有

M2GL010TS-1FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

12084 LE

233 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

114 kB

233

2.44 mm

现场可编程门阵列

12084

933888

1

4 Transceiver

12084

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

YES

676-FBGA (27x27)

676

425 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

40

IGLOO2

Tray

M2GL090

活跃

1.2 V

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

30

85 °C

有

M2GL090-FGG676

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

86184 LE

0°C ~ 85°C (TJ)

Tray

M2GL090

85 °C

0 °C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

86316

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

+ 100 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

无

M2GL025T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

27696 LE

207 I/O

1.2 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL025T

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

0 C

+ 85 C

微芯片技术

SMD/SMT

有

90

IGLOO2

Tray

M2GL010

活跃

1.2 V

LFBGA, BGA400,20X20,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

20

85 °C

无

M2GL010T-VF400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

12084 LE

195 I/O

1.2 V

0°C ~ 85°C (TJ)

Tray

M2GL010T

85 °C

0 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

OTHER

114 kB

195

1.51 mm

现场可编程门阵列

12084

933888

STD

4 Transceiver

12084

17 mm

17 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

176

IGLOO2

Tray

M2GL090

活跃

1.2 V

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090TS-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.81

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

207 I/O

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

活跃

M2GL025

Tray

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL025TS-VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

207

1.51 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

267 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

60

IGLOO2

1.2 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

20

85 °C

无

M2GL060T-1FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

0°C ~ 85°C (TJ)

Tray

M2GL060T

e0

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.2 V

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

OTHER

2.44 mm

现场可编程门阵列

56520

1869824

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

VFPBGA-400

400-VFBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

90

IGLOO2

1.2 V

活跃

M2GL025

Tray

0°C ~ 85°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

VFPBGA-400

YES

400

400-VFBGA (17x17)

400

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL025

活跃

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

有

M2GL025T-1VFG400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

27696 LE

207 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL025T

100 °C

-40 °C

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

138 kB

207

1.51 mm

现场可编程门阵列

27696

1130496

1

4 Transceiver

27696

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

256-FPBGA (14x14)

微芯片技术

This product may require additional documentation to export from the United States.

Details

27696 LE

138 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

-40°C ~ 100°C (TJ)

Tray

M2GL025TS

1.2 V

27696

1130496

2 Transceiver

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

207 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

活跃

M2GL060

Tray

LFBGA,

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL060T-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

0°C ~ 85°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B400

OTHER

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

60

IGLOO2

Tray

M2GL060

活跃

1.2 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

56520 LE

267 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

2.44 mm

现场可编程门阵列

56520

1869824

STD

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

1.2 V

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

BGA, BGA325,21X21,20

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

无

M2GL090-1FCS325I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

86184 LE

180 I/O

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

240

compliant

S-PBGA-B325

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.26 V

Tray

M2GL060

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.2 V

30

有

M2GL060T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Details

56520 LE

267 I/O

1.14 V

- 40 C

-40°C ~ 100°C (TJ)

Tray

M2GL060T

8542.39.00.01

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

667 Mb/s

2.44 mm

现场可编程门阵列

56520

1869824

STD

4 Transceiver

23 mm

23 mm

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

微芯片技术

SMD/SMT

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090TS-1FCSG325

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

0 C

+ 85 C

0°C ~ 85°C (TJ)

Tray

M2GL090TS

8542.39.00.01

CMOS

1.2 V

compliant

180

不合格

1.2 V

180

现场可编程门阵列

86184

2648064

4 Transceiver

86316

N/A

-

表面贴装

VFPBGA-400

YES

400-VFBGA (17x17)

400

- 40 C

+ 100 C

微芯片技术

SMD/SMT

有

90

IGLOO2

1.2 V

Tray

M2GL060

活跃

17 X 17 MM, 0.80 MM PITCH, VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL060TS-VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

56520 LE

207 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL060TS

8542.39.00.01

1.2 V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B400

1.51 mm

现场可编程门阵列

56520

1869824

4 Transceiver

17 mm

17 mm

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

138 I/O

1.2 V

0 C

+ 85 C

微芯片技术

SMD/SMT

有

119

IGLOO2

1.2 V

Tray

M2GL025

活跃

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

30

85 °C

有

M2GL025-1VFG256

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

Details

27696 LE

0°C ~ 85°C (TJ)

Tray

M2GL025

8542.39.00.01

1.2 V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

OTHER

1.56 mm

现场可编程门阵列

27696

1130496

14 mm

14 mm

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

Details

27696 LE

267 I/O

1.2 V

- 55 C

+ 125 C

微芯片技术

SMD/SMT

有

60

IGLOO2

Tray

M2GL025

活跃

1.2 V

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

125 °C

有

M2GL025TS-1FGG484M

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TJ)

Tray

M2GL025TS

3A001.A.2.C

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

267

2.44 mm

现场可编程门阵列

27696

1130496

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

BGA-329

YES

329-PBGA (31x31)

329

This product may require additional documentation to export from the United States.

N

249 I/O

2.25 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

278 MHz

有

27

Actel

2.75 V

Tray

A54SX32

活跃

BGA, BGA329,23X23,50

网格排列

3

PLASTIC/EPOXY

BGA329,23X23,50

-55 °C

2.5 V

30

125 °C

无

A54SX32A-1BG329M

5.24

MICROSEMI CORP

活跃

SQUARE

BGA

278 MHz

-55°C ~ 125°C (TC)

Tray

A54SX32A

e0

3A001.A.2.C

锡铅

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

BOTTOM

BALL

225

1.27 mm

unknown

S-PBGA-B329

249

不合格

2.5,3.3/5 V

MILITARY

249

2880 CLBS, 48000 GATES

2.7 mm

现场可编程门阵列

48000

2880

1.1 ns

2880

2880

48000

1.8 mm

31 mm

31 mm