品牌是'Microchip' (5152)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 触点形状 | 外壳材料 | 供应商器件包装 | 介电材料 | 房屋材料 | 质量 | 插入材料 | 终端数量 | 材料 - 磁铁 | 厂商 | Voltage Rating AC | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 功率(瓦特) | 附加功能 | HTS代码 | 电容量 | 紧固类型 | 子类别 | 触点类型 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | 样式 | Reach合规守则 | 额定电流 | 频率 | 基本部件号 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 执行器类型 | 效率 | 电压-隔离度 | 房屋颜色 | 失败率 | 引线间距 | 电源 | 温度等级 | 注意 | 照明电压(标称) | 最大输出电流 | 内存大小 | 外壳尺寸,MIL | 极数 | 照明 | 传播延迟 | 功率 - 最大 | 断路器类型 | 电压 - 输出 2 | 数据率 | 场效应管类型 | 输入数量 | Rds On(Max)@Id,Vgs | 不同 Id 时 Vgs(th)(最大值) | 组织结构 | 座位高度-最大 | 输入电容(Ciss)(Max)@Vds | 门极电荷(Qg)(最大)@Vgs | 可编程逻辑类型 | 大小 | 漏源电压 (Vdss) | 逻辑元件/单元数 | 产品类别 | 电压 - 输出 3 | 包括 | 第一个连接器 | 第二个连接器 | 总 RAM 位数 | 阀门数量 | 最高频率 | 电压 - 输出 4 | 最低负载要求 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 场效应管特性 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 等效门数 | 特征 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 材料可燃性等级 | 辐射硬化 | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | M2GL090-FCS325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 活跃 | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 微芯片技术 | 20 | 无 | M2GL090-FCS325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.27 | This product may require additional documentation to export from the United States. | N | 86184 LE | 180 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 176 | IGLOO2 | 1.2 V | Tray | M2GL090 | -40°C ~ 100°C (TJ) | Tray | M2GL090 | 8542.39.00.01 | CMOS | 1.2 V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL060T-1VF400I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | LFBGA, | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 20 | 微芯片技术 | 无 | M2GL060T-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.7 | This product may require additional documentation to export from the United States. | N | 56520 LE | 207 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 90 | IGLOO2 | 1.2 V | Tray | M2GL060 | 活跃 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.2 V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 1.51 mm | 现场可编程门阵列 | 56520 | 1869824 | 4 Transceiver | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AFS250-PQ208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 93 | Compliant | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 85 °C | 无 | AFS250-PQ208 | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | R-PQFP-F208 | 不合格 | OTHER | 4.5 kB | 6144 CLBS, 250000 GATES | 4.1 mm | 现场可编程门阵列 | 250000 | 1.0989 GHz | 6144 | 6144 | 1.575 V | 1.425 V | 250000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQ160 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | 微芯片技术 | 3.6 V | 5.24 | QFP | 125 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-2PQ160 | 117 MHz | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.1 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-2BG272I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 通孔 | Radial | YES | 272 | 272-PBGA (27x27) | Polyester, Metallized | 272 | BGA | 微芯片技术 | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 3.6 V | 5.2 | BGA | -- | 630V | 202 | Compliant | Tray | A42MX36 | Obsolete | PLASTIC, BGA-272 | 网格排列 | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | 160V | A42MX36-2BG272I | 91 MHz | -55°C ~ 105°C | Bulk | MKT303 | 0.689 L x 0.248 W (17.50mm x 6.30mm) | ±5% | e0 | 活跃 | -- | PC引脚 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 通用型 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 0.15µF | CMOS | 5 V | BOTTOM | BALL | 225 | 1.27 mm | compliant | S-PBGA-B272 | 不合格 | 0.591 (15.00mm) | INDUSTRIAL | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | 现场可编程门阵列 | 1184 | 2560 | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 5.5 V | 3 V | 54000 | 长寿命 | 1.73 mm | 0.433 (11.00mm) | 27 mm | 27 mm | 无 | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX04-3PL68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 0603 (1608 Metric) | YES | 68 | 0603 | 68 | Obsolete | KOA Speer Electronics, Inc. | MICROSEMI CORP | 3.6 V | 5.24 | LCC | RN731J | Obsolete | Tape & Reel (TR) | 57 | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX04-3PL68I | 109 MHz | QCCJ | SQUARE | Microsemi Corporation | -55°C ~ 155°C | RN73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.05% | e0 | 2 | ±25ppm/°C | 14.5 kOhms | Tin/Lead (Sn/Pb) | Thin Film | 0.063W, 1/16W | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | 现场可编程门阵列 | 6000 | 1.7 ns | 547 | 6000 | Moisture Resistant | 0.022 (0.55mm) | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX09-TQ176M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 176 | 176 | PLASTIC/EPOXY | QFP176,1.0SQ,20 | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX09-TQ176M | Amphenol Custom Cable | 117 MHz | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | Male | 4 GHz | RG-316 | Male | Bag | 50 Ohms | Q-0D0520 | 活跃 | LFQFP, QFP176,1.0SQ,20 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | - | - | e0 | 3A001.A.2.C | 锡铅 | Copper | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 225 | - | 0.5 mm | BNC 转 TNC | compliant | S-PQFP-G176 | 104 | 不合格 | 3.3,3.3/5,5 V | MILITARY | 104 | 684 CLBS, 14000 GATES | 1.6 mm | 现场可编程门阵列 | BNC Plug, Right Angle | TNC Plug | 2.5 ns | 684 | 684 | 14000 | Shielded | 39.4 (1.0m) 3.3 | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-VQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-TQFP | YES | 100 | 100-VQFP (14x14) | 100 | Obsolete | 微芯片技术 | MICROSEMI CORP | 3.6 V | 5.24 | QFP | Obsolete | A42MX16 | Tray | 83 | TFQFP, | FLATPACK, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-VQ100M | 94 MHz | TFQFP | SQUARE | Microsemi Corporation | -55°C ~ 125°C (TC) | MX | 3A001.A.2.C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 240 | 0.5 mm | compliant | S-PQFP-G100 | 不合格 | MILITARY | 1232 CLBS, 24000 GATES | 1.2 mm | 现场可编程门阵列 | 24000 | 2.8 ns | 1232 | 24000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-3PQ100 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-BQFP | YES | 100 | 100-PQFP (20x14) | 1.758804 g | 100 | 微芯片技术 | 5.24 | QFP | 83 | Compliant | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | 3.3 V | 30 | 3 V | 70 °C | 无 | A42MX16-3PQ100 | 129 MHz | QFP | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 0°C ~ 70°C (TA) | MX | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | 608 | 24000 | 237 MHz | 608 | 3 | 928 | 1.9 ns | 1232 | 5.25 V | 3 V | 24000 | 2.7 mm | 20 mm | 14 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | 微芯片技术 | 5.23 | QFP | 125 | Compliant | Obsolete | A42MX24 | Tray | PLASTIC, QFP-160 | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX24-PQ160M | QFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 5 V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | MILITARY | 1890 CLBS, 36000 GATES | 4.1 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 5.5 V | 3 V | 36000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 面板安装 | 208-BFQFP | YES | Flange | 208 | Circular | Composite | 208-PQFP (28x28) | Plastic | 208 | 微芯片技术 | MICROSEMI CORP | 1.575 V | 5.59 | -- | 20 | 147 | Compliant | Tray | A3PE3000 | 活跃 | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3PE3000L-PQG208 | 250 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | e3 | 活跃 | -- | 插座外壳 | 用于公引脚 | 32 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | Threaded | 现场可编程门阵列 | Crimp | CMOS | 1.2 V | QUAD | A | 鸥翼 | Shielded | 245 | 抗环境干扰 | 0.5 mm | compliant | Chromate over Cadmium | 19-32 | S-PQFP-G208 | 147 | 不合格 | 橄榄色 | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 不包括触点 | 63 kB | F | 147 | 75264 CLBS, 3000000 GATES | 4.1 mm | 现场可编程门阵列 | -- | 516096 | 3e+06 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 1.26 V | 1.14 V | 3000000 | -- | 3.4 mm | 28 mm | 28 mm | -- | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025-VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | VFBGA-400 | YES | Flange | Circular | Composite | 400-VFBGA (17x17) | Plastic | 400 | Microchip Technology / Atmel | IGLOO2 | Details | Tray | M2GL025 | 活跃 | LFBGA, BGA400,20X20,32 | 微芯片技术 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 有 | M2GL025-VFG400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.52 | -- | 20 | 有 | 27696 LE | 207 I/O | + 100 C | 1.26 V | 0.270728 oz | - 40 C | 90 | 1.14 V | SMD/SMT | Microchip | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | 活跃 | -- | 插座外壳 | 用于内螺纹插座 | 7 | 8542.39.00.01 | Threaded | 可编程逻辑集成电路 | Crimp | CMOS | 1.2 V | BOTTOM | N (Normal) | BALL | Shielded | 260 | 抗环境干扰 | 0.8 mm | compliant | Chromate over Cadmium | 11-99 | S-PBGA-B400 | 207 | 不合格 | 橄榄色 | 1.2 V | 不包括触点 | B | 667 Mb/s | 207 | 1.51 mm | 现场可编程门阵列 | 27696 | FPGA - Field Programmable Gate Array | -- | 1130496 | STD | 4 Transceiver | 27696 | -- | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL010T-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 面板安装 | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 无 | M2GL010T-1VF400I | 微芯片技术 | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.3 | -- | 195 | Non-Compliant | Tray | M2GL010 | 活跃 | 12084 LE | + 100 C | 1.2 V | - 40 C | 1.2 V | SMD/SMT | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 20 | -40°C ~ 100°C (TJ) | APL | Obsolete | -- | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | -- | S-PBGA-B400 | 195 | 不合格 | Lever | 1.2 V | -- | 114 kB | 3 | -- | Magnetic (Hydraulic Delay) | 195 | 1.51 mm | 现场可编程门阵列 | 12084 | 933888 | 4 Transceiver | 12084 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AGLE3000V5-FGG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | YES | 896 | 400.011771 mg | 896 | 620 | Compliant | BGA, | 网格排列 | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 1.425 V | 70 °C | 有 | M1AGLE3000V5-FGG896 | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.82 | e1 | 锡银铜 | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.5 V | BOTTOM | BALL | 245 | 1 mm | compliant | S-PBGA-B896 | 不合格 | COMMERCIAL | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | 现场可编程门阵列 | 75264 | 3e+06 | 892.86 MHz | 75264 | 75264 | 1.575 V | 1.425 V | 3000000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-2PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | 95 | Compliant | 5.88 | 1.575 V | MICROSEMI CORP | Obsolete | Microsemi Corporation | RECTANGULAR | QFF | M1AFS600-2PQ208I | 无 | 85 °C | 1.425 V | 30 | 1.5 V | -40 °C | PLASTIC/EPOXY | 3 | FLATPACK | QFF, | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | compliant | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS600-PQ208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 208 | 208 | Compliant | 95 | QFP-208 | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 1.5 V | 30 | 1.425 V | 85 °C | 无 | M1AFS600-PQ208I | QFF | RECTANGULAR | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.88 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.5 V | QUAD | FLAT | 225 | 0.5 mm | compliant | 1.0989 GHz | R-PQFP-F208 | 不合格 | INDUSTRIAL | 13.5 kB | 13824 CLBS, 600000 GATES | 4.1 mm | 现场可编程门阵列 | 600000 | 1.0989 GHz | 13824 | 13824 | 1.575 V | 1.425 V | 600000 | 3.4 mm | 28 mm | 28 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A54SX32-CQ256B | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 256 | 10.567001 g | 256 | 5.26 | Military grade | 203 | Compliant | CERAMIC, QFP-256 | FLATPACK | CERAMIC, METAL-SEALED COFIRED | TPAK256,3SQ,20 | -55 °C | 3.3 V | 20 | 2.97 V | 125 °C | 无 | A54SX32-CQ256B | 205 MHz | QFF | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.63 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 48000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 5 V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 246 | 不合格 | 3.3,5 V | MILITARY | 1 ns | 246 | 2880 CLBS, 32000 GATES | 3.06 mm | 现场可编程门阵列 | 48000 | 205 MHz | MIL-STD-883 Class B | 2880 | 1080 | 1 ns | 2880 | 2880 | 5.5 V | 4.5 V | 32000 | 2.8 mm | 36 mm | 36 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGLN020V5-QNG68I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-68 | YES | 68-QFN (8x8) | 68 | SMD/SMT | Microchip | Microchip Technology / Atmel | 250 MHz | IGLOO nano | Details | Tray | AGLN020 | 活跃 | HVQCCN, | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 微芯片技术 | 3 | UNSPECIFIED | -40 °C | 1.5 V | 未说明 | 85 °C | 有 | AGLN020V5-QNG68I | HVQCCN | SQUARE | 活跃 | MICROSEMI CORP | 2.07 | 有 | 200 LE | 49 I/O | + 100 C | 1.575 V | 0.074347 oz | - 40 C | 260 | 1.425 V | -40°C ~ 100°C (TJ) | Tray | AGLN020V5 | 8542.39.00.01 | 可编程逻辑集成电路 | CMOS | 1.5 V | QUAD | 无铅 | 未说明 | 0.4 mm | compliant | S-XQCC-N68 | 不合格 | INDUSTRIAL | - | 520 CLBS, 20000 GATES | 1 mm | 现场可编程门阵列 | 520 | FPGA - Field Programmable Gate Array | 20000 | STD | - | 520 | 20000 | FPGA - Field Programmable Gate Array | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-2PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 底座安装 | 100-BQFP | YES | 100 | 100-PQFP (20x14) | 100 | 117 MHz | QFP | RECTANGULAR | 微芯片技术 | Microsemi Corporation | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 24V | CE, cURus | 83 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | 85 ~ 264 VAC | A42MX16-2PQ100I | -10°C ~ 70°C | SWF | 7.09 L x 3.31 W x 1.65 H (180.0mm x 84.0mm x 42.0mm) | e0 | 活跃 | EAR99 | Enclosed | Tin/Lead (Sn/Pb) | ITE (Commercial) | 240W | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | R-PQFP-G100 | 1 | 不合格 | 92% | 3kV | INDUSTRIAL | 10A | -- | 1232 CLBS, 24000 GATES | 3.4 mm | 现场可编程门阵列 | -- | 24000 | -- | -- | 2.1 ns | 1232 | 24000 | Adjustable Output, Remote On/Off, Universal Input | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-1PQ100M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | SOT-563, SOT-666 | YES | 100 | SC-89-6 | 100 | RECTANGULAR | Microsemi Corporation | 微芯片技术 | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | 190mA | 57 | Tray | A40MX02 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A40MX02-1PQ100M | 92 MHz | QFP | -55°C ~ 150°C (TJ) | Tape & Reel (TR) | TrenchFET® | e0 | Obsolete | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | SI1025 | R-PQFP-G100 | 不合格 | MILITARY | 250mW | 2 P-Channel (Dual) | 4 Ohm @ 500mA, 10V | 3V @ 250µA | 295 CLBS, 3000 GATES | 3.4 mm | 23pF @ 25V | 1.7nC @ 15V | 现场可编程门阵列 | 60V | 3000 | 2.3 ns | 295 | 逻辑电平门 | 3000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3P600L-FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | Axial | YES | 256 | Axial | 400.011771 mg | 256 | 177 | Compliant | BGA, BGA256,16X16,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA256,16X16,40 | 1.2 V | 40 | 1.14 V | 70 °C | 有 | A3P600L-FGG256 | 350 MHz | BGA | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.575 V | 5.28 | -55°C ~ 250°C | Tape & Reel (TR) | Military, MIL-PRF-39007, RWR71S | 0.187 Dia x 0.812 L (4.75mm x 20.62mm) | ±1% | e1 | 活跃 | 2 | ±50ppm/°C | 10 Ohms | 锡银铜 | 70 °C | 0 °C | Wirewound | 2W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 1.2 V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | 不合格 | S (0.001%) | 1.5/3.3 V | COMMERCIAL | 13.5 kB | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | 现场可编程门阵列 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 1.26 V | 1.14 V | 600000 | Military, Moisture Resistant | 1.2 mm | -- | 17 mm | 17 mm | 无 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | APA600-PQ208M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | Axial | 208 | Axial | 微芯片技术 | 158 | Compliant | Tray | APA600 | Obsolete | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 4.48 kOhms | 125 °C | -55 °C | Metal Film | 0.125W, 1/8W | 2.5 V | 180 MHz | S (0.001%) | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 2.7 V | 2.3 V | Military, Moisture Resistant, Weldable | 3.4 mm | -- | 28 mm | 28 mm | 无 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX16-1PQ160M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 160-BQFP | YES | 160 | 160-PQFP (28x28) | 160 | SQUARE | Microsemi Corporation | 微芯片技术 | Obsolete | MICROSEMI CORP | 3.6 V | 5.23 | QFP | -- | 125 | Tray | A42MX16 | Obsolete | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX16-1PQ160M | 108 MHz | QFP | -55°C ~ 125°C (TC) | * | e0 | 活跃 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | S-PQFP-G160 | 不合格 | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | 现场可编程门阵列 | 24000 | 2.4 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A40MX02-3PQ100I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | Cylinder, Threaded | YES | 100 | 100-PQFP (20x14) | Plastic | 100 | Alnico 5 (AlNiCo) | 微芯片技术 | Obsolete | MICROSEMI CORP | 3.6 V | 5.25 | QFP | MK11/M8 | Obsolete | A40MX02 | Tray | 57 | QFP, | FLATPACK | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 30 | 3 V | 85 °C | 无 | A40MX02-3PQ100I | 109 MHz | QFP | RECTANGULAR | Microsemi Corporation | 70°C (TA) | M11 | e0 | 活跃 | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | 鸥翼 | 225 | 0.65 mm | compliant | R-PQFP-G100 | 不合格 | INDUSTRIAL | 295 CLBS, 3000 GATES | 3.4 mm | 现场可编程门阵列 | 0.315 Dia x 1.50 L (8.00mm x 38.0mm) | 3000 | 1.7 ns | 295 | 3000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX24-PL84M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 months ago) | 表面贴装 | Panel Mount, Through Hole | 84-LCC (J-Lead) | YES | Flange | 84 | Aluminum | 84-PLCC (29.31x29.31) | 6.777889 g | 84 | Glenair | Microsemi Corporation | Obsolete | MICROSEMI CORP | LCC | 5.23 | 3.6 V | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 72 | Compliant | A42MX24 | PLASTIC, LCC-84 | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 30 | 3 V | 125 °C | 无 | A42MX24-PL84M | QCCJ | SQUARE | -65°C ~ 175°C | 806 | e0 | Solder | 3A001.A.2.C | Receptacle, Female Sockets | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 橄榄色 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Threaded | CMOS | 5 V | QUAD | F | J BEND | 225 | 1.27 mm | compliant | 橄榄色镉 | S-PQCC-J84 | 不合格 | MILITARY | 1890 CLBS, 36000 GATES | 4.572 mm | 现场可编程门阵列 | 912 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 5.5 V | 3 V | 36000 | Ground | 3.68 mm | 29.31 mm | 29.31 mm | 无 |
M2GL090-FCS325I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL060T-1VF400I
Microchip Technology
分类:Embedded - FPGAs (Field Programmable Gate Array)
AFS250-PQ208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-2PQ160
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-2BG272I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX04-3PL68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-TQ176M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-VQ100M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-3PQ100
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-PQ160M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-PQG208
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025-VFG400I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010T-1VF400I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AGLE3000V5-FGG896
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-2PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS600-PQ208I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX32-CQ256B
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLN020V5-QNG68I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-2PQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-1PQ100M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600L-FGG256
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA600-PQ208M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-1PQ160M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A40MX02-3PQ100I
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX24-PL84M
Microchip
分类:Embedded - FPGAs (Field Programmable Gate Array)
