对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

生命周期状态

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

质量

终端数量

厂商

操作温度

包装

系列

JESD-609代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

技术

电压 - 供电

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

JESD-30代码

输出的数量

资历状况

电源

温度等级

内存大小

传播延迟

接通延迟时间

电流源

数据率

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

总 RAM 位数

阀门数量

最高频率

LABs数量/ CLBs数量

逻辑块数(LABs)

速度等级

收发器数量

寄存器数量

CLB-Max的组合延时

逻辑块数量

逻辑单元数

电压 - 供电 (最大值)

电压 - 供电 (最小值)

等效门数

高度

长度

宽度

辐射硬化

A42MX24-1PQG208I
A42MX24-1PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

5.5 V

Tray

A42MX24

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX24-1PQG208I

105.57 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

250 MHz

24

Actel

SMD/SMT

+ 85 C

- 40 C

3 V

176 I/O

Details

-40°C ~ 85°C (TA)

Tray

A42MX24

e3

Matte Tin (Sn)

85 °C

-40 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1890 CLBS, 36000 GATES

4.1 mm

现场可编程门阵列

912

36000

250 MHz

912

1

1410

2.1 ns

1890

5.5 V

3 V

36000

3.4 mm

28 mm

28 mm

APA600-BGG456
APA600-BGG456
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

Copper, Silver, Tin

表面贴装

表面贴装

BGA-456

456

456-PBGA (35x35)

微芯片技术

This product may require additional documentation to export from the United States.

Details

356 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

180 MHz

24

Actel

2.5000 V

2.3 V

2.7 V

2.7 V

Tray

APA600

活跃

0 to 70 °C

Tray

APA600

70 °C

0 °C

2.5 V

180 MHz

15.8 kB

129024

600000

180 MHz

STD

21504

2.7 V

2.3 V

1.73 mm

35 mm

35 mm

A54SX32A-2TQG100I
A54SX32A-2TQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

2880 LAB

90

Actel

0.023175 oz

2.25 V

81 I/O

微芯片技术

1800 LE

Details

5.25 V

Tray

A54SX32

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

A54SX32A-2TQG100I

313 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

- 40 C

+ 85 C

SMD/SMT

-40°C ~ 85°C (TA)

Tray

A54SX32A

e3

Matte Tin (Sn)

32000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25 V to 5.25 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

81

不合格

2.5,2.5/5 V

INDUSTRIAL

-

81

2880 CLBS, 48000 GATES

1.6 mm

现场可编程门阵列

48000

2880

-

0.9 ns

2880

2880

48000

1.4 mm

14 mm

14 mm

A54SX16A-2TQG144I
A54SX16A-2TQG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

SMD/SMT

294 MHz

60

Actel

微芯片技术

0.046530 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-40 °C

2.5 V

40

85 °C

A54SX16A-2TQG144I

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

INDUSTRIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

M7A3P1000-FGG144I
M7A3P1000-FGG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

160

微芯片技术

ProASIC3

0.014110 oz

Tray

M7A3P1000

活跃

1.575 V

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

85 °C

M7A3P1000-FGG144I

350 MHz

LBGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

-40°C ~ 100°C (TJ)

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B144

不合格

INDUSTRIAL

18 kB

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.05 mm

13 mm

13 mm

A54SX16A-1TQG144
A54SX16A-1TQG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

263 MHz

60

Actel

微芯片技术

0.046530 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

A54SX16A-1TQG144

263 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.2 ns

1452

1452

24000

1.4 mm

20 mm

20 mm

AX250-1FGG256
AX250-1FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

This product may require additional documentation to export from the United States.

Details

138 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

90

Actel

0.014110 oz

1.575 V

Tray

AX250

活跃

0°C ~ 70°C (TA)

Tray

AX250

1.5 V

55296

250000

4224

1.2 mm

17 mm

17 mm

A3P125-1FGG144I
A3P125-1FGG144I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

- 40 C

+ 85 C

SMD/SMT

272 MHz

160

ProASIC3

微芯片技术

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P125-1FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

Details

97 I/O

1.425 V

-40 to 85 °C

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

AFS250-2FGG256I
AFS250-2FGG256I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

3000 LE

114 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS250

活跃

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

AFS250

85 °C

-40 °C

1.5 V

4.5 kB

36864

250000

1.47059 GHz

2

6144

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

A54SX32-TQG144M
A54SX32-TQG144M
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

- 55 C

+ 125 C

SMD/SMT

240 MHz

60

微芯片技术

Actel

0.046530 oz

3.6 V

Tray

A54SX32

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

-55 °C

3.3 V

40

125 °C

A54SX32-TQG144M

240 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

113 I/O

3 V

-55°C ~ 125°C (TC)

Tray

A54SX32

e3

3A001.A.2.C

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

3.3,5 V

MILITARY

113

2880 CLBS, 32000 GATES

1.6 mm

现场可编程门阵列

48000

2880

0.9 ns

2880

2880

32000

1.4 mm

20 mm

20 mm

A3P400-1FGG256
A3P400-1FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

ProASIC3

0.014110 oz

1.575 V

Tray

A3P400

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P400-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

178 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

90

0°C ~ 85°C (TJ)

Tray

A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

6.8 kB

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

1.575 V

1.425 V

400000

1.2 mm

17 mm

17 mm

A3P125-PQG208I
A3P125-PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

1500 LE

133 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

350 MHz

24

微芯片技术

36864 bit

ProASIC3

0.183425 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

A3P125-PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.22

Details

-40 to 85 °C

Tray

A3P125

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

15 mA

-

3072 CLBS, 125000 GATES

4.1 mm

现场可编程门阵列

36864

125000

STD

-

3072

125000

3.4 mm

28 mm

28 mm

APA150-FGG256
APA150-FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA-256

256-FPBGA (17x17)

微芯片技术

ProASICPLUS

2.7 V

Tray

APA150

活跃

This product may require additional documentation to export from the United States.

Details

-

186 I/O

2.3 V

0 C

+ 70 C

SMD/SMT

36 kbit

36 kbit

180 MHz

-

90

36864 bit

0°C ~ 70°C (TA)

Tray

APA150

2.5 V

5 mA

36864

150000

STD

1.2 mm

17 mm

17 mm

AFS1500-2FGG484
AFS1500-2FGG484
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

0.014110 oz

Tray

AFS1500

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

AFS1500-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

223 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

60

Fusion

0°C ~ 85°C (TJ)

Tray

AFS1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

33.8 kB

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1.47059 GHz

2

38400

38400

1.575 V

1.425 V

1500000

1.73 mm

23 mm

23 mm

AFS1500-1FGG256
AFS1500-1FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

0 C

+ 70 C

SMD/SMT

1282.05 MHz

90

Fusion

0.014110 oz

1.575 V

Tray

AFS1500

活跃

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

AFS1500

70 °C

0 °C

1.5 V

33.8 kB

276480

1500000

1.28205 GHz

1

38400

1.575 V

1.425 V

1.2 mm

17 mm

17 mm

A42MX16-PQG208I
A42MX16-PQG208I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

24

Actel

微芯片技术

Tray

A42MX16

活跃

5.5 V

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX16-PQG208I

94 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.29

Details

140 I/O

3 V

- 40 C

+ 85 C

SMD/SMT

172 MHz

-40°C ~ 85°C (TA)

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

4.1 mm

现场可编程门阵列

24000

STD

2.8 ns

1232

24000

3.4 mm

28 mm

28 mm

M7A3P1000-FGG256
M7A3P1000-FGG256
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

SMD/SMT

231 MHz

90

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M7A3P1000

活跃

1.575 V

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

70 °C

M7A3P1000-FGG256

350 MHz

BGA

SQUARE

不推荐

MICROSEMI CORP

5.25

This product may require additional documentation to export from the United States.

Details

177 I/O

1.425 V

0 C

+ 70 C

0 to 70 °C

Tray

M7A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

231 MHz

S-PBGA-B256

不合格

COMMERCIAL

18 kB

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

231 MHz

STD

24576

24576

1.575 V

1.425 V

1000000

1.2 mm

17 mm

17 mm

A40MX04-1PLG44
A40MX04-1PLG44
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PLCC-44

YES

44-PLCC (16.59x16.59)

44

27

Actel

0.084185 oz

微芯片技术

Details

5.25 V

Tray

A40MX04

活跃

ROHS COMPLIANT, PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

3.3 V

40

70 °C

A40MX04-1PLG44

48 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.29

34 I/O

3 V

0 C

+ 70 C

SMD/SMT

160 MHz

0°C ~ 70°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J44

不合格

COMMERCIAL

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

2.3 ns

547

6000

3.68 mm

16.59 mm

16.59 mm

A54SX32-PQG208
A54SX32-PQG208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

Actel

微芯片技术

3.6 V

Tray

A54SX32

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

3.3 V

40

70 °C

A54SX32-PQG208

240 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.23

Details

174 I/O

3 V

0 C

+ 70 C

SMD/SMT

240 MHz

24

0°C ~ 70°C (TA)

Tray

A54SX32

e3

Matte Tin (Sn)

70 °C

0 °C

CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.5 mm

compliant

240 MHz

S-PQFP-G208

174

不合格

3.3,5 V

COMMERCIAL

900 ps

900 ps

174

2880 CLBS, 32000 GATES

4.1 mm

现场可编程门阵列

2880

48000

240 MHz

2880

2880

1080

0.9 ns

2880

2880

5.25 V

4.75 V

32000

3.4 mm

28 mm

28 mm

A42MX36-CQ208
A42MX36-CQ208
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

CQFP-208

YES

208

208-CQFP (75x75)

208

微芯片技术

CERAMIC, QFP-208

FLATPACK, GUARD RING

CERAMIC, METAL-SEALED COFIRED

3.3 V

70 °C

A42MX36-CQ208

73 MHz

GQFF

SQUARE

活跃

MICROSEMI CORP

5.19

QFP

N

176 I/O

3.3 V

0 C

+ 70 C

SMD/SMT

1

Actel

3.3 V

Tray

A42MX36

活跃

0°C ~ 70°C (TA)

A42MX36

70 °C

0 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V

QUAD

FLAT

0.5 mm

compliant

S-CQFP-F208

不合格

COMMERCIAL

320 B

2438 CLBS, 54000 GATES

3.3 mm

现场可编程门阵列

1184

2560

54000

1184

1822

2.7 ns

2438

2414

5.25 V

3 V

54000

29.21 mm

29.21 mm

A3P125-1FGG144
A3P125-1FGG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

SMD/SMT

272 MHz

160

ProASIC3

微芯片技术

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

A3P125

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

A3P125-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

Details

97 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

A3P125

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

3072 CLBS, 125000 GATES

1.55 mm

现场可编程门阵列

36864

125000

1

3072

125000

1.05 mm

13 mm

13 mm

A54SX08A-TQG144
A54SX08A-TQG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

144-TQFP (20x20)

微芯片技术

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

238 MHz

60

Actel

0.046530 oz

2.75 V

Tray

A54SX08

活跃

0°C ~ 70°C (TA)

Tray

A54SX08A

2.5 V

12000

768

1.4 mm

20 mm

20 mm

A42MX16-1PQG100I
A42MX16-1PQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

PQFP-100

YES

100-PQFP (20x14)

100

- 40 C

+ 85 C

SMD/SMT

198 MHz

66

Actel

微芯片技术

0.062040 oz

3.3, 5 V

3 V

5.5 V

Tray

A42MX16

活跃

5.5 V

QFP,

FLATPACK

3

PLASTIC/EPOXY

-40 °C

3.3 V

40

85 °C

A42MX16-1PQG100I

108 MHz

QFP

RECTANGULAR

活跃

MICROSEMI CORP

5.29

Details

83 I/O

3 V

-40 to 85 °C

Tray

A42MX16

e3

Matte Tin (Sn)

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3.3 V, 5 V

QUAD

鸥翼

245

0.65 mm

compliant

R-PQFP-G100

不合格

INDUSTRIAL

1232 CLBS, 24000 GATES

3.4 mm

现场可编程门阵列

24000

1

2.4 ns

1232

24000

2.7 mm

20 mm

14 mm

A54SX16A-2TQG100I
A54SX16A-2TQG100I
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

SMD/SMT

294 MHz

90

Actel

微芯片技术

0.023175 oz

2.75 V

Tray

A54SX16

活跃

1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-100

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

-40 °C

2.5 V

40

85 °C

A54SX16A-2TQG100I

294 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

81 I/O

2.25 V

- 40 C

+ 85 C

-40°C ~ 85°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

172

不合格

2.5,3.3/5 V

INDUSTRIAL

172

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1 ns

1452

1452

24000

1.4 mm

14 mm

14 mm

A54SX16A-FTQG144
A54SX16A-FTQG144
Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

TQFP-144

YES

144-TQFP (20x20)

144

167 MHz

60

Actel

微芯片技术

0.046530 oz

2.75 V

Tray

A54SX16

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

70 °C

A54SX16A-FTQG144

167 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.25

Details

113 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

0°C ~ 70°C (TA)

Tray

A54SX16A

e3

Matte Tin (Sn)

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.5 V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G144

113

不合格

2.5,3.3/5 V

COMMERCIAL

113

1452 CLBS, 24000 GATES

1.6 mm

现场可编程门阵列

24000

1452

1.9 ns

1452

1452

24000

1.4 mm

20 mm

20 mm