2833 In Stock

• 1: ¥1,614.432849
• 10: ¥1,523.049862
• 100: ¥1,436.839490
• 500: ¥1,355.508950
查看所有的价格

-

表面贴装

BGA-484

484-FPBGA (19x19)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

284 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

938 In Stock

• 1: ¥3,969.581464
• 10: ¥3,744.888172
• 100: ¥3,532.913368
• 500: ¥3,332.937146
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-

Gold

Flanges, Panel, Wall

表面贴装

BGA-325

325-FCBGA (11x11)

Aluminium

微芯片技术

Copper

Compliant

有

This product may require additional documentation to export from the United States.

109000 LE

170 I/O

7.6 Mbit

+ 100 C

1.03 V/1.08 V

- 40 C

1

970 mV/1.02 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF100

活跃

-40°C ~ 100°C (TJ)

Bulk

MPF100TL

Crimp

Circular, Receptacle

26

200 °C

-65 °C

Receptacle

Bayonet

可编程逻辑集成电路

0.97V ~ 1.08V

Straight

30.96 mm

7.5 A

MIL-DTL-38999

26

Female

1 V, 1.05 V

Socket

Cadmium

12.7 Gb/s

109000

FPGA - Field Programmable Gate Array

7782400

4 Transceiver

FPGA - Field Programmable Gate Array

23.54 mm

无

无SVHC

抗环境干扰

665 In Stock

• 1: ¥5,107.731075
• 10: ¥4,818.614218
• 100: ¥4,545.862473
• 500: ¥4,288.549507
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-

Lead, Tin

通孔

表面贴装

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

- 40 C

970 mV/1.02 V

SMD/SMT

Compliant

512

Tray

MPF300

活跃

300000 LE

+ 100 C

1.03 V/1.08 V

-40°C ~ 100°C (TJ)

Bulk

PolarFire™

1 %

2

50 ppm/°C

3.7 kΩ

175 °C

-65 °C

Metal Film

125 mW

125 mW

0.97V ~ 1.08V

MIL-PRF-55182

1.05 V

12.7 Gb/s

300000

21094400

Military, Moisture Resistant, Weldable

2.39 mm

6.35 mm

2.39 mm

含铅

2590 In Stock

• 1: ¥3,006.601243
• 10: ¥2,836.416268
• 100: ¥2,675.864401
• 500: ¥2,524.400379
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-

表面贴装

484-BFBGA

484-FPBGA (19x19)

Copper

微芯片技术

600 V

600 V

Compliant

PVC

284

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

PolarFire™

Blue

0.97V ~ 1.08V

12 A

20 AWG

109000

7782400

2180 In Stock

• 1: ¥3,122.977192
• 10: ¥2,946.204897
• 100: ¥2,779.438583
• 500: ¥2,622.111869
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-

表面贴装

BGA-1152

1152-FCBGA (35x35)

微芯片技术

有

This product may require additional documentation to export from the United States.

300000 LE

20.6 Mbit

512 I/O

+ 100 C

1.08 V

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

可编程逻辑集成电路

0.97V ~ 1.08V

1.05 V

12.5 Gb/s

300000

FPGA - Field Programmable Gate Array

21094400

16 Transceiver

FPGA - Field Programmable Gate Array

794 In Stock

• 1: ¥5,583.886138
• 10: ¥5,267.817108
• 100: ¥4,969.638787
• 500: ¥4,688.338477
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-

表面贴装

BGA-784

784-FCBGA (29x29)

微芯片技术

有

This product may require additional documentation to export from the United States.

481000 LE

388 I/O

Details

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

- 40 C

3.492228 oz

1.08 V

+ 100 C

Tray

MPF500

活跃

-40°C ~ 100°C (TJ)

Tray

MPF500T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

16 Transceiver

FPGA - Field Programmable Gate Array

664 In Stock

• 1: ¥4,735.483008
• 10: ¥4,467.436800
• 100: ¥4,214.563022
• 500: ¥3,976.002849
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-

表面贴装

BGA-1152

3

1152-FCBGA (35x35)

Lithium

2.8 g

微芯片技术

3 V

Compliant

有

This product may require additional documentation to export from the United States.

481000 LE

584 I/O

+ 100 C

1.08 V

2.562565 oz

- 40 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Tray

MPF500

活跃

-40°C ~ 100°C (TJ)

Tray

MPF500TS

通孔

可编程逻辑集成电路

0.97V ~ 1.08V

Horizontal

3 V

1 V, 1.05 V

12.5 Gb/s

481000

FPGA - Field Programmable Gate Array

33792000

24 Transceiver

20 mm

Non-Rechargeable

Lithium

FPGA - Field Programmable Gate Array

20 mm

3.2 mm

20.2 mm

有

无铅

2081 In Stock

• 1: ¥836.285657
• 10: ¥788.948733
• 100: ¥744.291253
• 500: ¥702.161561
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-

Lead, Tin

通孔

表面贴装

BGA-325

325-FCBGA (11x11)

微芯片技术

Compliant

-

PolarFire

Microchip Technology / Atmel

Microchip

SMD/SMT

0.97 V

1

0 C

1.08 V

+ 100 C

7.6 Mbit

170 I/O

109000 LE

This product may require additional documentation to export from the United States.

有

Tray

MPF100

活跃

0°C ~ 100°C (TJ)

Bulk

MPF100T

0.5 %

2

50 ppm/°C

7.41 kΩ

175 °C

-65 °C

Metal Film

可编程逻辑集成电路

100 mW

100 mW

0.97V ~ 1.08V

MIL-PRF-55182

1 V, 1.05 V

12.5 Gb/s

109000

FPGA - Field Programmable Gate Array

7600Kbit

4 Transceiver

Military, Moisture Resistant, Weldable

FPGA - Field Programmable Gate Array

1.78 mm

3.81 mm

1.78 mm

含铅

2545 In Stock

• 1: ¥3,863.097498
• 10: ¥3,644.431603
• 100: ¥3,438.143023
• 500: ¥3,243.531155
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-

表面贴装

BGA-325

325-FCBGA (11x14.5)

微芯片技术

有

This product may require additional documentation to export from the United States.

192000 LE

170 I/O

+ 100 C

1.08 V

0 C

1

0.97 V

SMD/SMT

Microchip

Microchip Technology / Atmel

PolarFire

Details

Tray

MPF200

活跃

0°C ~ 100°C (TJ)

Tray

MPF200T

可编程逻辑集成电路

0.97V ~ 1.08V

1 V, 1.05 V

12.5 Gb/s

192000

FPGA - Field Programmable Gate Array

13619200

4 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

1.14 V

85 °C

有

A3PE3000L-FGG324I

5.29

1.575 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

BGA

250 MHz

1.14 V

1.26 V

221

Tray

A3PE3000

Compliant

活跃

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.2 V

40

-40°C ~ 100°C (TJ)

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

196-TFBGA, CSBGA

YES

196-CSP (8x8)

196

微芯片技术

85 °C

有

AGL400V2-CSG196

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.25

1.2, 1.5 V

1.14 V

1.575 V

143

Tray

AGL400

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

未说明

1.14 V

0 to 70 °C

IGLOO

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

9216 CLBS, 400000 GATES

1.2 mm

现场可编程门阵列

9216

55296

400000

STD

9216

400000

8 mm

8 mm

22 In Stock

• 1: ¥74.299269
• 10: ¥70.093651
• 100: ¥66.126081
• 500: ¥62.383099
查看所有的价格

-

表面贴装

68-VFQFN Exposed Pad

YES

68-QFN (8x8)

68

微芯片技术

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

HVQCCN

AGLN020V2-QNG68

有

70 °C

1.14 V

未说明

1.2 V

-20 °C

1.2, 1.5 V

1.14 V

1.575 V

49

Tray

AGLN020

活跃

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

UNSPECIFIED

5.59

1.575 V

-20 to 70 °C

IGLOO nano

8542.39.00.01

CMOS

1.14V ~ 1.575V

QUAD

无铅

未说明

0.4 mm

compliant

S-XQCC-N68

不合格

OTHER

520 CLBS, 20000 GATES

1 mm

现场可编程门阵列

520

20000

STD

520

20000

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

896-BGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

微芯片技术

1.2 V

40

1.14 V

85 °C

有

A3PE3000L-FGG896I

250 MHz

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.29

1.2000 V

1.14 V

1.26 V

620

Compliant

Tray

A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

-40 to 85 °C

ProASIC3L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3e+06

781.25 MHz

STD

75264

75264

75264

3000000

1.73 mm

31 mm

31 mm

无

2812 In Stock

• 1: ¥2,955.095123
• 10: ¥2,787.825587
• 100: ¥2,630.024135
• 500: ¥2,481.154852
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-

表面贴装

256-LBGA

256-FPBGA (17x17)

微芯片技术

2.75 V

2.25 V

2.5000 V

203

Tray

A54SX32

活跃

-40 to 85 °C

SX-A

2.25V ~ 5.25V

48000

2880

STD

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

400.011771 mg

324

微芯片技术

BGA324,18X18,40

-40 °C

1.2 V

30

1.14 V

85 °C

无

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

023708617

Entrelec

1.2000 V

1.14 V

1.26 V

221

Tray

A3PE3000

活跃

Compliant

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, FBGA-324

网格排列

3

PLASTIC/EPOXY

-40 to 85 °C

ProASIC3L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

85 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B324

221

不合格

1.2 V

1.2/1.5,1.2/3.3 V

INDUSTRIAL

1.26 V

1.14 V

63 kB

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

781.25 MHz

STD

75264

75264

75264

3000000

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

267

Tray

M2GL060

活跃

,

未说明

有

M2GL060TS-1FGG484T2

Microsemi Corporation

活跃

MICROSEMI CORP

5.8

-40 to 125 °C

Automotive, AEC-Q100, IGLOO2

有

1.14V ~ 2.625V

未说明

compliant

现场可编程门阵列

56520

1869824

1

N/A

-

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

85 °C

有

AFS600-FGG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.3

1.5000 V

1.425 V

1.575 V

172

Tray

AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

0 to 70 °C

Fusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

STD

13824

600000

23 mm

23 mm

2334 In Stock

• 1: ¥927.439919
• 10: ¥874.943317
• 100: ¥825.418228
• 500: ¥778.696439
查看所有的价格

-

表面贴装

100-LQFP

YES

100-TQFP (14x14)

100

微芯片技术

PLASTIC/EPOXY

-40 °C

2.5 V

40

2.3 V

85 °C

有

250 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

2.7 V

5.32

F485-G

Ocal, a T & B Brand

2.5000 V

2.3 V

2.7 V

70

Tray

EX128

活跃

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

3

-40 to 85 °C

EX

e3

Matte Tin (Sn)

LG-MIN; WD-MIN; TERM PITCH-MIN

8542.39.00.01

CMOS

2.3V ~ 2.7V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

INDUSTRIAL

6000 GATES

1.6 mm

现场可编程门阵列

256

6000

STD

1 ns

6000

14 mm

14 mm

N/A

-

YES

208

3.6 V

5.24

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

3.3 V

30

3 V

70 °C

无

A54SX16-2PQ208

320 MHz

FQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

e0

Tin/Lead (Sn/Pb)

CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE

8542.39.00.01

CMOS

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

1452 CLBS, 16000 GATES

4.1 mm

现场可编程门阵列

0.7 ns

1452

16000

28 mm

28 mm

N/A

-

YES

100

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

1.425 V

85 °C

有

AGLN030V5-ZVQG100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.31

e3

TIN

8542.39.00.01

CMOS

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

14 mm

14 mm

N/A

-

YES

100

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.2 V

未说明

1.14 V

85 °C

有

AGLN030V2-ZVQG100I

TFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.82

e3

TIN

8542.39.00.01

CMOS

QUAD

鸥翼

未说明

0.5 mm

compliant

S-PQFP-G100

不合格

INDUSTRIAL

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

768

30000

14 mm

14 mm

N/A

-

表面贴装

289-TFBGA, CSBGA

YES

289-CSP (14x14)

289

微芯片技术

160 MHz

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.575 V

5.28

212

Tray

AGLP125

Obsolete

TFBGA, BGA289,17X17,32

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA289,17X17,32

-40 °C

1.5 V

未说明

1.425 V

85 °C

无

AGLP125V2-CS289I

-40°C ~ 100°C (TJ)

IGLOO PLUS

8542.39.00.01

现场可编程门阵列

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

未说明

0.8 mm

unknown

S-PBGA-B289

212

不合格

1.2/1.5 V

INDUSTRIAL

212

3120 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3120

36864

125000

STD

3120

3120

125000

14 mm

14 mm

N/A

-

YES

208

Obsolete

MICROSEMI CORP

2.75 V

7.1

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

40

2.25 V

70 °C

有

A54SX08A-FPQG208

172 MHz

FQFP

SQUARE

Microsemi Corporation

e3

哑光锡

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

130

不合格

2.5,3.3/5 V

COMMERCIAL

130

768 CLBS, 12000 GATES

4.1 mm

现场可编程门阵列

1.7 ns

768

768

12000

28 mm

28 mm

N/A

-

YES

144

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

2.75 V

5.32

LBGA, BGA144,12X12,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

2.5 V

40

2.25 V

85 °C

有

A54SX16A-1FGG144I

263 MHz

LBGA

e1

锡银铜

16000 TYPICAL GATES AVAILABLE

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

111

不合格

2.5,3.3/5 V

INDUSTRIAL

111

1452 CLBS, 24000 GATES

1.55 mm

现场可编程门阵列

1.2 ns

1452

1452

24000

13 mm

13 mm

N/A

-

表面贴装

100-TQFP

YES

100-VQFP (14x14)

100

微芯片技术

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.27

77

Tray

A3PN030

Obsolete

TFQFP,

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

-20 °C

1.5 V

30

1.425 V

70 °C

无

A3PN030-ZVQ100

TFQFP

-20°C ~ 85°C (TJ)

ProASIC3 nano

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

768 CLBS, 30000 GATES

1.2 mm

现场可编程门阵列

30000

768

30000

14 mm

14 mm