N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

30

70 °C

无

M1A3PE3000-2FG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

0 to 70 °C

Tray

M1A3P1000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

4.1 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

28 mm

28 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1470.59 MHz

微芯片技术

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-2FGG256

LBGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.68 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

3000 LE

97 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

有

160

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1AGL250V5-FGG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

-40 to 85 °C

Tray

M1AGL250V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

4.5 kB

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.425 V

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

1.14 V

0 C

+ 85 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

348

IGLOOe

1.575 V

Tray

AGL125

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.2 V

未说明

85 °C

有

AGL125V2-CSG196

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.58

Details

1500 LE

133 I/O

0°C ~ 70°C (TA)

Tray

AGL125V2

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

未说明

0.5 mm

compliant

S-PBGA-B196

不合格

OTHER

3072 CLBS, 125000 GATES

1.2 mm

现场可编程门阵列

3072

36864

125000

STD

3072

125000

0.7 mm

8 mm

8 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

A3PE600-1FG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

165 I/O

-40 to 85 °C

Tray

A3PE600

e0

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

272 MHz

1

13824

13824

1.575 V

1.425 V

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

324-FBGA (19x19)

324

This product may require additional documentation to export from the United States.

Details

221 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

微芯片技术

有

84

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

A3PE3000

活跃

1.575 V

19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

-40 °C

1.5 V

40

85 °C

有

A3PE3000-FGG324I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B324

221

不合格

1.5/3.3 V

INDUSTRIAL

25 mA

221

75264 CLBS, 3000000 GATES

1.78 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.25 mm

19 mm

19 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P1000-2FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

0°C ~ 85°C (TJ)

Tray

M1A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

310 MHz

有

90

ProASIC3

0.014110 oz

1.5000 V

1.575 V

1.425 V

1.575 V

Tray

A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

A3P1000-2FGG256I

5.23

MICROSEMI CORP

活跃

SQUARE

BGA

350 MHz

-40 to 85 °C

Tray

A3P1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

2

24576

1000000

17 mm

17 mm

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

11000 LE

97 I/O

1.425 V

- 55 C

+ 125 C

SMD/SMT

微芯片技术

350 MHz

有

160

ProASIC3

0.014110 oz

Tray

A3P1000

活跃

1.575 V

BGA, BGA144,12X12,40

网格排列

3

PLASTIC/EPOXY

BGA144,12X12,40

-55 °C

1.5 V

未说明

125 °C

无

A3P1000-FG144M

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.48

-55°C ~ 125°C (TJ)

Tray

A3P1000

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

1 mm

unknown

S-PBGA-B144

97

不合格

1.5,1.5/3.3 V

MILITARY

8 mA

-

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

-

24576

24576

1000000

13 mm

13 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

1.575 V

This product may require additional documentation to export from the United States.

N

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

Tray

M1AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

M1AFS600

1.5 V

110592

600000

1

1.2 mm

17 mm

17 mm

N/A

-

Production (Last Updated: 1 month ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

1470.59 MHz

微芯片技术

有

60

Fusion

0.014110 oz

1.575 V

Tray

M1AFS600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1AFS600-2FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0°C ~ 85°C (TJ)

Tray

M1AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

1.575 V

1.425 V

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

N

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

30

70 °C

无

M1A3PE1500-FG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

444

不合格

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

STD

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

表面贴装

PQFP-208

208-PQFP (28x28)

微芯片技术

1.575 V

Tray

M1A3P600

活跃

1.575 V

This product may require additional documentation to export from the United States.

Details

154 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

24

ProASIC3

1.5000 V

1.425 V

-40 to 85 °C

Tray

M1A3P600

1.5 V

110592

600000

STD

3.4 mm

28 mm

28 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

147 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

24

ProASIC3

1.425 V

1.575 V

Tray

A3PE1500

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

A3PE1500-1PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

This product may require additional documentation to export from the United States.

Details

-40°C ~ 100°C (TJ)

Tray

A3PE1500

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

272 MHz

1

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

341 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

Tray

M1A3PE3000

活跃

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

M1A3PE3000-2FGG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P1000

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.23

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

1

24576

1000000

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

0 C

+ 70 C

SMD/SMT

有

微芯片技术

160

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.2 V

30

85 °C

无

M1AGL600V2-FG144

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

0 to 70 °C

Tray

M1AGL600V2

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

1.575 V

1.14 V

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

ROHS COMPLIANT, FBGA-484

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

有

M1AGLE3000V5-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

341 I/O

1.425 V

0 to 70 °C

Tray

M1AGLE3000V5

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

1.575 V

1.425 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA-144

YES

144-FPBGA (13x13)

144

13824 LE

97 I/O

1.14 V

- 40 C

+ 100 C

SMD/SMT

526.32 MHz, 892.86 MHz

微芯片技术

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

AGL600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

AGL600V2-FG144I

108 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

-40°C ~ 85°C (TA)

Tray

AGL600V2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

230

1 mm

unknown

S-PBGA-B144

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

This product may require additional documentation to export from the United States.

Details

11000 LE

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

526.32 MHz, 892.86 MHz

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGL1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

40

100 °C

有

AGL1000V2-FGG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.45

-40 to 85 °C

Tray

AGL1000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

24576

147456

1000000

STD

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-1FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

This product may require additional documentation to export from the United States.

N

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3P600

活跃

1.26 V

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

30

85 °C

无

M1A3P600L-FG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.23

-40 to 85 °C

Tray

M1A3P600L

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.2 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

97

不合格

1.5/3.3 V

INDUSTRIAL

97

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

STD

13824

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

VQFP

YES

100

100-VQFP (14x14)

100

68 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

微芯片技术

有

90

IGLOOe

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1AGL250

活跃

14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, VQFP-100

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1AGL250V5-VQ100

108 MHz

TFQFP

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

3000 LE

0 to 70 °C

Tray

M1AGL250V5

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

225

0.5 mm

compliant

S-PQFP-G100

不合格

OTHER

4.5 kB

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

1.575 V

1.425 V

250000

1 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M1AFS1500

活跃

-40°C ~ 100°C (TJ)

Tray

M1AFS1500

1.5 V

276480

1500000

1

1.2 mm

17 mm

17 mm