N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-2FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

235 I/O

1.425 V

0°C ~ 85°C (TJ)

Tray

M1A3P600

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

272 MHz

有

微芯片技术

24

ProASIC3

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P250-1PQG208I

FQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

151 I/O

1.425 V

- 40 C

+ 85 C

-40 to 85 °C

Tray

M1A3P250

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

4.1 mm

现场可编程门阵列

36864

250000

1

6144

250000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

CSP-196

YES

196-CSP (8x8)

196

3000 LE

143 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

微芯片技术

250 MHz

有

348

IGLOOe

1.575 V

1.425 V

1.5000 V

1.575 V

Tray

AGL250

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

-40 °C

1.5 V

未说明

100 °C

无

AGL250V5-CS196I

108 MHz

TFBGA

SQUARE

活跃

FPGA - Field Programmable Gate Array IGLOO

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

AGL250V5

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

未说明

0.5 mm

unknown

S-PBGA-B196

不合格

INDUSTRIAL

20 uA

6144 CLBS, 250000 GATES

1.2 mm

现场可编程门阵列

6144

36864

250000

STD

6144

250000

0.7 mm

8 mm

8 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

SMD/SMT

310 MHz

微芯片技术

有

24

ProASIC3

Tray

M1A3PE3000

活跃

1.575 V

28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.5 V

40

70 °C

有

M1A3PE3000-2PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

This product may require additional documentation to export from the United States.

Details

147 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

M1A3PE3000

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.5 V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

147

不合格

1.5/3.3 V

COMMERCIAL

147

75264 CLBS, 3000000 GATES

4.1 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

3.4 mm

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3PE3000

活跃

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.5 V

40

70 °C

有

M1A3PE3000-2FGG896

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

620 I/O

1.425 V

0 C

0 to 70 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

FBGA

YES

896

896-FBGA (31x31)

896

620 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

892.86 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.2 V

30

85 °C

无

M1A3PE3000L-1FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

N

-40 to 85 °C

Tray

M1A3PE3000L

e0

锡铅

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

25 mA

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

60

ProASIC3

0.014110 oz

1.26 V

8542310000

Tray

A3PE3000

活跃

This product may require additional documentation to export from the United States.

N

341 I/O

0°C ~ 85°C (TJ)

Tray

A3PE3000L

70 °C

0 °C

1.5 V

63 kB

516096

3000000

781.25 MHz

STD

75264

1.26 V

1.14 V

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

90

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P600-2FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

177 I/O

-40 to 85 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

2

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

97 I/O

1.425 V

0 C

+ 70 C

0°C ~ 85°C (TJ)

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

- 40 C

+ 100 C

SMD/SMT

350 MHz

微芯片技术

有

24

ProASIC3

1.508632 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3PE1500

活跃

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

-40 °C

1.5 V

40

85 °C

有

A3PE1500-2PQG208I

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.6

Details

16000 LE

147 I/O

1.425 V

-40 to 85 °C

Tray

A3PE1500

e3

Matte Tin (Sn)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425 V to 1.575 V

QUAD

鸥翼

245

0.5 mm

compliant

310 MHz

S-PQFP-G208

147

不合格

1.5/3.3 V

INDUSTRIAL

33.8 kB

-

147

38400 CLBS, 1500000 GATES

4.1 mm

现场可编程门阵列

276480

1500000

310 MHz

2

-

38400

38400

38400

1.575 V

1.425 V

1500000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

Details

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

活跃

M1A3PE3000

Tray

1.575 V

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE3000-1FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3PE3000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

微芯片技术

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P600-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

97 I/O

0 to 70 °C

Tray

M1A3P600

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.55 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

30

70 °C

有

M1AGLE3000V2-FGG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

0 to 70 °C

Tray

M1AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

8542.39.00.01

CMOS

1.2 V to 1.5 V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

COMMERCIAL

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

1.575 V

1.14 V

3000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

144

144-FPBGA (13x13)

400.011771 mg

微芯片技术

- 40 C

+ 85 C

SMD/SMT

有

160

IGLOOe

0.014110 oz

1.575 V

Tray

M1AGL250

活跃

This product may require additional documentation to export from the United States.

N

3000 LE

97 I/O

1.425 V

-40°C ~ 85°C (TA)

Tray

M1AGL250V5

85 °C

-40 °C

1.5 V

4.5 kB

6144

36864

250000

STD

1.575 V

1.425 V

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

有

272 MHz

SMD/SMT

+ 70 C

0 C

微芯片技术

1.425 V

177 I/O

Details

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P600

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

1.5 V

40

85 °C

有

M1A3P600-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

ProASIC3

90

0 to 70 °C

Tray

M1A3P600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

110592

600000

1

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

SMD/SMT

+ 85 C

- 40 C

微芯片技术

1.425 V

97 I/O

Details

1.425 V

1.575 V

Tray

M1A3P250

活跃

1.575 V

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

100 °C

有

M1A3P250-2FGG144I

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

0.014110 oz

ProASIC3

160

有

310 MHz

-40°C ~ 100°C (TJ)

Tray

M1A3P250

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.5 V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

INDUSTRIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

1.575 V

Tray

AFS600

活跃

LBGA,

有

AFS600-2FGG256I

活跃

MICROSEMI CORP

This product may require additional documentation to export from the United States.

Details

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

-40°C ~ 100°C (TJ)

Tray

AFS600

1.5 V

110592

600000

2

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

SMD/SMT

500 MHz

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

48000 LE

176 I/O

970 mV/1.02 V

0 C

+ 100 C

0°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

- 40 C

+ 100 C

SMD/SMT

500 MHz

1

3.6 MB

MSL 3 - 168 hours

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

3686.4Kbit

48000

N/A

-

表面贴装

FCS-325

325-BGA (11x11)

微芯片技术

SMD/SMT

500 MHz

3.6 MB

1

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

48000 LE

500 MHz

1

3.6 MB

Tray

活跃

1.03 V/1.08 V

SMD/SMT

+ 100 C

- 40 C

970 mV/1.02 V

176 I/O

-40°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

FCV-484

484-FBGA (19x19)

微芯片技术

SMD/SMT

500 MHz

1

3.6 MB

1.03 V/1.08 V

Tray

活跃

48000 LE

176 I/O

970 mV/1.02 V

0 C

+ 100 C

0°C ~ 100°C (TJ)

Tray

-

1 V, 1.05 V

3774874

48000

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

微芯片技术

This product may require additional documentation to export from the United States.

970 mV/1.02 V

1

1.03 V/1.08 V

584

Tray

活跃

BGA,

网格排列

PLASTIC/EPOXY

5.79

MICROSEMI CORP

活跃

SQUARE

BGA

MPF500TS-FC1152M

1 V

-55°C ~ 125°C (TJ)

Tray

MPF500TS

IT ALSO OPERATES AT 1.05 V SUPPLY

1.05 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

2.9 mm

现场可编程门阵列

481000

34603008

35 mm

35 mm