参数名
参数值
参数名
参数值
表面安装
YES
材料
Si
EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
有
PPAP
Unknown
Category
功率MOSFET
Process Technology
HEXFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
40
Maximum Gate Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
4
Maximum Continuous Drain Current (A)
320
Maximum Gate Source Leakage Current (nA)
200
Maximum IDSS (uA)
20
Maximum Drain Source Resistance (MOhm)
1.6@10V
Typical Gate Charge @ Vgs (nC)
170@10V
Typical Gate Charge @ 10V (nC)
170
Typical Input Capacitance @ Vds (pF)
6930@25V
Maximum Power Dissipation (mW)
330000
Typical Fall Time (ns)
100
Typical Rise Time (ns)
150
Typical Turn-Off Delay Time (ns)
110
Typical Turn-On Delay Time (ns)
17
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Supplier Temperature Grade
汽车
Mounting
表面贴装
Package Height
4.83(Max)
Package Width
9.65(Max)
Package Length
10.67(Max)
PCB changed
6
Tab
Tab
Standard Package Name
TO-263
Supplier Package
D2PAK
Lead Shape
Gull-wing
Package Description
,
Risk Rank
5.82
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
Part Life Cycle Code
Obsolete
Manufacturer
Infineon Technologies AG
Manufacturer Part Number
AUIRF2804STRR7P
Rohs Code
有
Operating Temperature-Max
175 °C
包装
卷带
零件状态
Obsolete
子类别
FET 通用电源
Reach合规守则
compliant
引脚数量
7
配置
单一泉源
操作模式
增强型MOSFET
极性/通道类型
N-CHANNEL
最大漏极电流 (Abs) (ID)
240 A
信道型
N
场效应管技术
METAL-OXIDE SEMICONDUCTOR
最大耗散功率(Abs)
330 W