参数名
参数值
参数名
参数值
安装类型
表面贴装
包装/外壳
8-SOIC (0.154, 3.90mm Width)
表面安装
YES
供应商器件包装
8-SOIC
HTS
8541.21.00.95
ECCN (US)
EAR99
EU RoHS
Compliant
Automotive
无
PPAP
无
Category
功率MOSFET
Process Technology
HEXFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
20
Maximum Gate Source Voltage (V)
±12
Maximum Gate Threshold Voltage (V)
2
Maximum Continuous Drain Current (A)
16
Maximum Gate Source Leakage Current (nA)
200
Maximum IDSS (uA)
20
Maximum Drain Source Resistance (MOhm)
6.5@10V
Typical Gate Charge @ Vgs (nC)
41@5V
Typical Input Capacitance @ Vds (pF)
3640@15V
Maximum Power Dissipation (mW)
2500
Typical Fall Time (ns)
52
Typical Rise Time (ns)
25
Typical Turn-Off Delay Time (ns)
50
Typical Turn-On Delay Time (ns)
20
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Mounting
表面贴装
Package Height
1.5(Max)
Package Width
4(Max)
Package Length
5(Max)
PCB changed
8
Standard Package Name
SOP
Supplier Package
SOIC
Lead Shape
Gull-wing
Package
Tape & Reel (TR)
Current - Continuous Drain (Id) @ 25℃
16A (Ta)
Drive Voltage (Max Rds On, Min Rds On)
2.8V, 10V
厂商
Infineon Technologies
Power Dissipation (Max)
2.5W (Ta)
Product Status
Obsolete
Moisture Sensitivity Levels
1
Reflow Temperature-Max (s)
未说明
Operating Temperature-Max
150 °C
Rohs Code
有
Manufacturer Part Number
IRF7456TRPBF-1
Manufacturer
Infineon Technologies AG
Part Life Cycle Code
生命周期结束
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
Risk Rank
5.3
包装
卷带
操作温度
-55°C ~ 150°C (TJ)
系列
HEXFET®
零件状态
Obsolete
子类别
FET 通用电源
技术
MOSFET (Metal Oxide)
峰值回流焊温度(摄氏度)
未说明
Reach合规守则
compliant
引脚数量
8
配置
单四漏三源
场效应管类型
N-Channel
Rds On(Max)@Id,Vgs
6.5mOhm @ 16A, 10V
不同 Id 时 Vgs(th)(最大值)
2V @ 250µA
输入电容(Ciss)(Max)@Vds
3640 pF @ 15 V
门极电荷(Qg)(最大)@Vgs
62 nC @ 5 V
漏源电压 (Vdss)
20 V
Vgs(最大值)
±12V
极性/通道类型
N-CHANNEL
最大漏极电流 (Abs) (ID)
16 A
信道型
N
场效应管技术
METAL-OXIDE SEMICONDUCTOR
最大耗散功率(Abs)
2.5 W
场效应管特性
-