参数名
参数值
参数名
参数值
表面安装
YES
SVHC
有
SVHC Exceeds Threshold
有
Automotive
无
PPAP
无
Category
功率MOSFET
Process Technology
HEXFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
30
Maximum Gate Source Voltage (V)
±20
Maximum Continuous Drain Current (A)
86
Maximum Drain Source Resistance (mOhm)
6.5@10V
Typical Gate Charge @ Vgs (nC)
[email protected]
Typical Input Capacitance @ Vds (pF)
2330@15V
EU RoHS
符合免除
ECCN (US)
EAR99
Maximum Power Dissipation (mW)
79000
Typical Fall Time (ns)
3.9
Typical Rise Time (ns)
12
Typical Turn-Off Delay Time (ns)
15
Typical Turn-On Delay Time (ns)
12
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Mounting
表面贴装
Package Height
2.39(Max)
Package Width
6.22(Max)
Package Length
6.73(Max)
PCB changed
2
Tab
Tab
Standard Package Name
TO-252
Supplier Package
DPAK
Lead Shape
Gull-wing
Package Description
,
Operating Temperature-Max
175 °C
Rohs Code
有
Manufacturer Part Number
IRFR3709ZCTRPBF
Manufacturer
International Rectifier
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTERNATIONAL RECTIFIER CORP
Risk Rank
5.64
包装
卷带
零件状态
Obsolete
子类别
FET 通用电源
Reach合规守则
unknown
引脚数量
3
配置
Single
操作模式
增强型MOSFET
极性/通道类型
N-CHANNEL
最大漏极电流 (Abs) (ID)
86 A
信道型
N
场效应管技术
METAL-OXIDE SEMICONDUCTOR
最大耗散功率(Abs)
79 W