参数名
参数值
参数名
参数值
材料
Si
EU RoHS
供应商未确认
Automotive
无
HTS
8541.29.00.95
ECCN (US)
EAR99
PPAP
无
Category
功率MOSFET
Process Technology
HEXFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
20
Maximum Gate Source Voltage (V)
±12
Maximum Gate Threshold Voltage (V)
0.7(Min)
Maximum Continuous Drain Current (A)
11
Maximum Gate Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain Source Resistance (MOhm)
[email protected]
Typical Gate Charge @ Vgs (nC)
50(Max)@4.5V
Typical Input Capacitance @ Vds (pF)
1450@15V
Maximum Power Dissipation (mW)
50000
Typical Fall Time (ns)
90(Max)
Typical Rise Time (ns)
150(Max)
Typical Turn-Off Delay Time (ns)
72(Max)
Typical Turn-On Delay Time (ns)
35(Max)
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Mounting
表面贴装
Package Height
2.61(Max)
Package Width
10.28(Max)
Package Length
7.64(Max)
PCB changed
3
Supplier Package
SMD-0.5
零件状态
活跃
引脚数量
3
配置
Single
信道型
P